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11.
公开(公告)号:US20200023586A1
公开(公告)日:2020-01-23
申请号:US16499370
申请日:2018-03-27
Applicant: Korea Electronics Technology Institute
Inventor: Hwa Seon SHIN , Sung Hwan CHUN , Hye In LEE
IPC: B29C64/386
Abstract: Provided is a method for monitoring 3D printing equipped with a 3D printing slicer and a recursive loop structure. A 3D printing method according to an embodiment of the present invention sets up a slicing environment for 3D printing of a 3D model, generates a mechanical code by performing slicing according to the setup environment, monitors the status of the 3D printing according to the generated mechanical code, and, depending on the monitoring result, determines whether or not to re-perform the setup and subsequent steps. Accordingly, by semi- or fully automating the 3D printing engineering process, the time and effort for engineering performance involving human participation are reduced, and the human resource is concentrated on a more important area, such that the effects of enhancing the 3D printing output quality and assuring the quality can be expected.
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公开(公告)号:US20240232783A1
公开(公告)日:2024-07-11
申请号:US18572514
申请日:2022-12-14
Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE
Inventor: Hwa Seon SHIN , Hye In LEE , Jae Ho SHIN , Sung Hwan CHUN , Sung Hun PARK
IPC: G06Q10/067 , G06F8/35
CPC classification number: G06Q10/067 , G06F8/35
Abstract: A method and a system for providing a domain-based process framework are provided. The method for providing a domain-specific process framework, according to one embodiment of the present invention, comprises steps in which: a process framework provision system generates a process model on the basis of a pre-stored meta-model (primitive) and a relationship model (relation); and the process framework provision system distributes the generated process model. Therefore, a process framework capable of reflecting domain knowledge is introduced so that different business processes between companies can be normalized by domain.
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13.
公开(公告)号:US20240005620A1
公开(公告)日:2024-01-04
申请号:US18038785
申请日:2021-11-03
Applicant: Korea Electronics Technology Institute
Inventor: Hye In LEE , Hwa Seon SHIN , Sung Hwan CHUN , Sung Hun PARK
IPC: G06T19/20 , G06T17/20 , B33Y50/00 , B29C64/386
CPC classification number: G06T19/20 , G06T17/20 , B33Y50/00 , B29C64/386 , G06T2219/2021
Abstract: Provided is a method for modifying a design on the basis of an additive cross-section outline for 3D printing of an additive manufacturing method. The method for modifying a design on the basis of an additive cross-section outline according to an embodiment of the present invention comprises the steps of: slicing a 3D model into a plurality of 2D layers; calculating a difference region between a first layer and a second layer that is a lower layer adjacent to the first layer; calculating a modified outline that minimizes a region required for support by reducing the outline of the difference region; and merging the modified outline and the outline of the second layer. Accordingly, a design can be modified with fewer calculation processes compared to the prior art, models can be modified for additive manufacturing without additional design knowledge, and since the design has been modified to minimize the region required for support, the amount of support can be reduced, thereby increasing material or printing time efficiency, and strengthening a design structure.
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14.
公开(公告)号:US20220410485A1
公开(公告)日:2022-12-29
申请号:US17780206
申请日:2020-11-10
Applicant: Korea Electronics Technology Institute
Inventor: Hye In LEE , Sung Hun PARK , Hwa Seon SHIN , Sung Hwan CHUN , Jin Min JANG
IPC: B29C64/386 , B33Y50/02 , G06T3/00
Abstract: Provided is a slicing 2D data-based pattern application method for generating an output code in which the inside of a model is filled with a pattern, so as to reduce a binder usage amount and maintain a strength and a shape in sand binder jetting additive manufacturing. A slicing 2D data-based pattern application method according to an embodiment of the present invention comprises the steps of: generating 2D data by slicing an output model; generating an inner pattern in at least one of layers forming an output model in consideration of the set thickness of the layers and the outer thickness thereof and generating an output code by applying the generated inner pattern. Therefore, the cost of producing an additive manufacturing output can be reduced by reducing the binder usage amount through the application of the inner pattern. In addition, reducing the binder usage amount enables a mold to be destroyed with less force than conventionally used, can increase the proportion of molding sand reuse by reducing the binder usage amount, and can reduce recovery treatment costs of the molding sand. Furthermore, casting defects due to increased ventilation can be reduced.
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公开(公告)号:US20220055307A1
公开(公告)日:2022-02-24
申请号:US17275373
申请日:2020-02-19
Applicant: Korea Electronics Technology Institute
Inventor: Hwa Seon SHIN , Hye In LEE , Sung Hwan CHUN , Sung Hun PARK , Ji Min JANG
IPC: B29C64/386 , B29C64/40 , B33Y50/00 , G05B19/4099
Abstract: Provided is a 3D printing slicing method for solving a quantization error problem. A 3D model slicing method according to an embodiment of the present invention comprises: receiving, as input, data of a 3D model to be three-dimensionally printed; calculating the height of the input 3D model; revising the height of the 3D model on the basis of a result of the calculation; and slicing the 3D model having the revised height. Accordingly, the present invention can easily and reliably solve a slicing quantization error problem even without changing the lamination thickness of a 3D printer.
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公开(公告)号:US20210362426A1
公开(公告)日:2021-11-25
申请号:US17256880
申请日:2019-08-29
Applicant: Korea Electronics Technology Institute
Inventor: Hwa Seon SHIN , Hye In LEE , Sung Hwan CHUN , Sung Hun PARK
IPC: B29C64/386 , B33Y50/00 , G06F30/10 , G06T7/12 , G06T17/10
Abstract: Provided is a method for creating a 2D slicing polyline based support structure for 3D printing. A method for creating a support structure according to an embodiment of die present invention comprises: slicing a 3D model into a plurality of 2D layers; comparing the 2D layers to calculate a support position for each of the 2D layers; and creating supports at the calculated positions. As a result, the supports can be created at precise and meaningful positions, a stable output is possible, and additional slicing work is not necessary on the created supports, whereby improvement of speed can be expected.
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