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公开(公告)号:US20240070926A1
公开(公告)日:2024-02-29
申请号:US18466141
申请日:2023-09-13
Applicant: Intel Corporation
Inventor: Joydeep Ray , Ben Ashbaugh , Prasoonkumar Surti , Pradeep Ramani , Rama Harihara , Jerin C. Justin , Jing Huang , Xiaoming Cui , Timothy B. Costa , Ting Gong , Elmoustapha Ould-ahmed-vall , Kumar Balasubramanian , Anil Thomas , Oguz H. Elibol , Jayaram Bobba , Guozhong Zhuang , Bhavani Subramanian , Gokce Keskin , Chandrasekaran Sakthivel , Rajesh Poornachandran
CPC classification number: G06T9/002 , G06F12/023 , G06T15/005 , G06F2212/302 , G06F2212/401
Abstract: Embodiments are generally directed to compression in machine learning and deep learning processing. An embodiment of an apparatus for compression of untyped data includes a graphical processing unit (GPU) including a data compression pipeline, the data compression pipeline including a data port coupled with one or more shader cores, wherein the data port is to allow transfer of untyped data without format conversion, and a 3D compression/decompression unit to provide for compression of untyped data to be stored to a memory subsystem and decompression of untyped data from the memory subsystem.
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公开(公告)号:US20230230289A1
公开(公告)日:2023-07-20
申请号:US18152643
申请日:2023-01-10
Applicant: Intel Corporation
Inventor: Joydeep Ray , Ben Ashbaugh , Prasoonkumar Surti , Pradeep Ramani , Rama Harihara , Jerin C. Justin , Jing Huang , Xiaoming Cui , Timothy B. Costa , Ting Gong , Elmoustapha Ould-ahmed-vall , Kumar Balasubramanian , Anil Thomas , Oguz H. Elibol , Jayaram Bobba , Guozhong Zhuang , Bhavani Subramanian , Gokce Keskin , Chandrasekaran Sakthivel , Rajesh Poornachandran
CPC classification number: G06T9/002 , G06F12/023 , G06T15/005 , G06F2212/401 , G06F2212/302
Abstract: Embodiments are generally directed to compression in machine learning and deep learning processing. An embodiment of an apparatus for compression of untyped data includes a graphical processing unit (GPU) including a data compression pipeline, the data compression pipeline including a data port coupled with one or more shader cores, wherein the data port is to allow transfer of untyped data without format conversion, and a 3D compression/decompression unit to provide for compression of untyped data to be stored to a memory subsystem and decompression of untyped data from the memory subsystem.
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公开(公告)号:US11636319B2
公开(公告)日:2023-04-25
申请号:US16108817
申请日:2018-08-22
Applicant: Intel Corporation
Inventor: Gokce Keskin , Anil Thomas , Oguz Elibol
Abstract: An embodiment of a semiconductor package apparatus may include technology to process one or more vectors with a sum of squares operation with a layer of a multi-layer neural network, and determine a fixed-point approximation for the sum of squares operation. Other embodiments are disclosed and claimed.
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