公开(公告)号：US20150036288A1

公开(公告)日：2015-02-05

申请号：US14519422

申请日：2014-10-21

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： G06F1/20

CPC分类号： H05K7/20818 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/2029 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20809

摘要： Methods of facilitating cooling an electronic system are provided, which include: providing a heat sink(s) configured to cool an electronic component(s), the heat sink(s) including a coolant-carrying channel for a first coolant, the first coolant providing two-phase cooling to the electronic component(s) and being discharged from the heat sink(s) as coolant exhaust with coolant vapor; providing a node-level condensation module coupled in fluid communication with the heat sink(s), the condensation module receiving first coolant exhaust from the heat sink(s) and being liquid-cooled via a second coolant to condense coolant vapor before return to a rack-level return manifold; automatically controlling at least one of liquid-cooling of the heat sink(s), or liquid-cooling of the condensation module(s); and providing a control valve for adjusting flow rate of the second coolant to the condensation module(s), the control valve being automatically controlled based on a characterization of the coolant vapor in the coolant exhaust.

摘要翻译： 提供了方便冷却电子系统的方法，其包括：提供被配置为冷却电子部件的散热器，所述散热器包括用于第一冷却剂的冷却剂传送通道，所述第一冷却剂 向电子部件提供两相冷却，并以冷却剂蒸气作为冷却剂排出从散热器排出; 提供与所述散热器流体连通的节点级冷凝模块，所述冷凝模块从所述散热器接收第一冷却剂排出物，并经由第二冷却剂进行液冷，以冷却冷却剂蒸汽，然后返回到 机架式回流歧管; 自动控制散热器的液体冷却中的至少一个或冷凝模块的液体冷却; 并且提供用于调节第二冷却剂到冷凝模块的流量的控制阀，基于冷却剂排气中的冷却剂蒸汽的表征来自动控制控制阀。

公开(公告)号：US20140124174A1

公开(公告)日：2014-05-08

申请号：US13671857

申请日：2012-11-08

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： F28D15/00

CPC分类号： F28D15/02 ,  F28F3/048 ,  F28F3/12 ,  F28F2250/08 ,  H05K7/203 ,  H05K7/20772 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49359

摘要： Cooling apparatuses and methods of fabrication thereof are provided to facilitate two-phase, immersion-cooling of one or more electronic components. The cooling apparatus includes a housing having a compartment within which dielectric fluid is disposed which facilitates immersion-cooling of the electronic component(s). A liquid-cooled heat sink is associated with the housing and cools a cooling surface exposed within the compartment. One or more pumps are disposed within the compartment and configured to pump dielectric fluid liquid within the compartment towards the cooling surface to facilitate cooling the liquid within the compartment below a saturation temperature of the dielectric fluid. The heat sink includes or is coupled to condensing and sub-cooling regions exposed within the compartment.

摘要翻译： 提供冷却装置及其制造方法以便于一个或多个电子部件的两相浸没冷却。 冷却装置包括壳体，该壳体具有隔室，在该隔室中布置介质流体，其有利于电子部件的浸入冷却。 液体冷却散热器与壳体相关联并且冷却暴露在隔间内的冷却表面。 一个或多个泵设置在隔室内，并且构造成将腔室内的介质流体液体朝向冷却表面泵送，以便于冷却介质流体的饱和温度以下室内的液体。 散热器包括或耦合到暴露在隔室内的冷凝和次冷却区域。

公开(公告)号：US20140123492A1

公开(公告)日：2014-05-08

申请号：US13780613

申请日：2013-02-28

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： F28D15/00

CPC分类号： F28D15/02 ,  F28F3/048 ,  F28F3/12 ,  F28F2250/08 ,  H05K7/203 ,  H05K7/20772 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49359

摘要： A method of fabricating a cooling apparatus is provided to facilitate two-phase, immersion-cooling of one or more electronic components. The cooling apparatus includes a housing having a compartment within which dielectric fluid is disposed which facilitates immersion-cooling of the electronic component(s). A liquid-cooled heat sink is associated with the housing and cools a cooling surface exposed within the compartment. One or more pumps are disposed within the compartment and configured to pump dielectric fluid liquid within the compartment towards the cooling surface to facilitate cooling the liquid within the compartment below a saturation temperature of the dielectric fluid. The heat sink includes or is coupled to condensing and sub-cooling regions exposed within the compartment.

摘要翻译： 提供一种制造冷却装置的方法，以便于一个或多个电子部件的两相浸没冷却。 冷却装置包括壳体，该壳体具有隔室，在该隔室中布置介质流体，其有利于电子部件的浸入冷却。 液体冷却散热器与壳体相关联并且冷却暴露在隔间内的冷却表面。 一个或多个泵设置在隔室内，并且构造成将腔室内的介质流体液体朝向冷却表面泵送，以便于冷却介质流体的饱和温度以下室内的液体。 散热器包括或耦合到暴露在隔室内的冷凝和次冷却区域。

公开(公告)号：US20140102669A1

公开(公告)日：2014-04-17

申请号：US13758143

申请日：2013-02-04

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS ,  Prabjit SINGH ,  Jing ZHANG

IPC分类号： F28D1/02

CPC分类号： H05K7/20836 ,  F28F2265/14

摘要： An automated multi-fluid cooling method is provided for cooling an electronic component(s). The method includes obtaining a coolant loop, and providing a coolant tank, multiple valves, and a controller. The coolant loop is at least partially exposed to outdoor ambient air temperature(s) during normal operation, and the coolant tank includes first and second reservoirs containing first and second fluids, respectively. The first fluid freezes at a lower temperature than the second, the second fluid has superior cooling properties compared with the first, and the two fluids are soluble. The multiple valves are controllable to selectively couple the first or second fluid into the coolant in the coolant loop, wherein the coolant includes at least the second fluid. The controller automatically controls the valves to vary first fluid concentration level in the coolant loop based on historical, current, or anticipated outdoor air ambient temperature(s) for a time of year.

摘要翻译： 提供了用于冷却电子部件的自动多流体冷却方法。 该方法包括获得冷却剂回路，以及提供冷却剂箱，多个阀和控制器。 在正常操作期间，冷却剂回路至少部分地暴露于室外环境空气温度，并且冷却剂箱分别包括容纳第一和第二流体的第一和第二储存器。 第一流体在比第二流体低的温度下冻结，第二流体与第一流体相比具有优异的冷却性能，并且两种流体是可溶的。 多个阀是可控制的，以选择性地将第一或第二流体耦合到冷却剂回路中的冷却剂中，其中冷却剂至少包括第二流体。 控制器根据一年中的历史，当前或预期的室外空气环境温度，自动控制阀门改变冷却剂回路中的第一个液体浓度水平。

公开(公告)号：US20140102668A1

公开(公告)日：2014-04-17

申请号：US14134017

申请日：2013-12-19

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/208 ,  F25B39/02 ,  F25B49/02 ,  F25B2400/01 ,  F25B2500/06 ,  H05K7/20809 ,  H05K7/20836 ,  Y10T29/49826

摘要： Apparatus and method are provided for cooling an electronic component. The apparatus includes a refrigerant evaporator in thermal communication with a component(s) to be cooled, and a refrigerant loop coupled in fluid communication with the evaporator for facilitating flow of refrigerant through the evaporator. The apparatus further includes a compressor in fluid communication with a refrigerant loop, an air-cooled heat sink coupled to the refrigerant evaporator, for providing backup cooling to the electronic component in a backup, air cooling mode, and a controllable refrigerant heater coupled to the heat sink. The refrigerant heater is in thermal communication across the heat sink with refrigerant passing through the refrigerant evaporator, and is controlled in a primary, refrigeration cooling mode to apply an auxiliary heat load to refrigerant passing through the refrigerant evaporator to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state.

摘要翻译： 提供了用于冷却电子部件的装置和方法。 该装置包括与要冷却的部件热连通的制冷剂蒸发器和与蒸发器流体连通的制冷剂回路，以便制冷剂流过蒸发器。 该装置还包括与制冷剂回路流体连通的压缩机，耦合到制冷剂蒸发器的空气冷却散热器，用于在备用空气冷却模式中向电子部件提供备用冷却，以及耦合到 散热器。 制冷剂加热器通过散热器与通过制冷剂蒸发器的制冷剂热连通，并且被控制在主要的冷冻冷却模式中，以对通过制冷剂蒸发器的制冷剂施加辅助热负荷，以确保制冷剂回路中的制冷剂 进入压缩机处于过热的热力学状态。

公开(公告)号：US20140085817A1

公开(公告)日：2014-03-27

申请号：US13788987

申请日：2013-03-07

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： H05K7/20

CPC分类号： H05K7/20 ,  H05K7/20236 ,  H05K7/20772 ,  Y10T29/49117

摘要： A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.

摘要翻译： 提供了一种用于对诸如多节点机架的节点或书的电子系统的所选择的电子部件进行抽吸浸没冷却的方法。 该方法包括提供围绕待冷却的部件限定隔室的壳体组件，该组件联接到印刷电路板的第一侧。 组件包括具有开口尺寸以容纳部件的第一框架和第二框架。 第一和第二框架分别经由第一粘合剂层和第二粘合剂层密封到板的相对侧。 印刷电路板至少部分地多孔于冷却剂流过隔间，并且第一框架，第二框架和第一和第二粘合剂层相对于冷却剂是无孔的，并且提供冷却剂密封到 印刷电路板的第一和第二面。

公开(公告)号：US20140082942A1

公开(公告)日：2014-03-27

申请号：US13788871

申请日：2013-03-07

申请人： International Business Machines Corporation

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT ,  Robert E. SIMONS

IPC分类号： B23P15/26

CPC分类号： B23P15/26 ,  H05K7/203 ,  H05K7/20336 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49396

摘要： A method is provided for facilitating cooling of electronic components of an electronic system. The method includes: providing a housing at least partially surrounding and forming a compartment about the components, and providing an immersion-cooling fluid is disposed within the compartment, at least one component of the electronic system being at least partially non-immersed within the fluid in the compartment; providing a wicking film element physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment; and securing, via a coupling element, the wicking film element in physical coupling to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component.

摘要翻译： 提供了一种便于冷却电子系统的电子部件的方法。 该方法包括：提供壳体，其至少部分地环绕和形成围绕部件的隔室，并且提供浸入冷却流体设置在隔室内，电子系统的至少一个部件至少部分地不浸入流体 在隔间; 提供物理耦合到所述至少一个部件的主表面并且部分地设置在所述隔室内的流体内的芯吸膜元件; 以及通过耦合元件将所述芯吸膜元件物理耦合到所述至少一个部件的主表面，而不将所述耦合元件覆盖在所述部件的主表面上。 作为增强，芯吸膜元件包裹在部件上以物理耦合到部件的两个相对的主侧。

公开(公告)号：US20140048242A1

公开(公告)日：2014-02-20

申请号：US14064322

申请日：2013-10-28

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28F3/00

CPC分类号： B23P15/26 ,  F28D15/0266 ,  F28F3/00 ,  F28F3/12 ,  F28F13/00 ,  G06F1/20 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/2029 ,  H05K7/20772 ,  Y10T29/4935

摘要： A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

公开(公告)号：US20130191096A1

公开(公告)日：2013-07-25

申请号：US13795030

申请日：2013-03-12

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Matthew R. ARCHIBALD ,  Richard C. CHU ,  Hendrik F. HAMANN, JR. ,  Madhusudan K. IYENGAR ,  Roger R. SCHMIDT

IPC分类号： G06F17/50

CPC分类号： G06F17/5009 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20609 ,  H05K7/20745

摘要： Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.

摘要翻译： 提供了设备和方法，以便于模拟电子子系统，电子机架或电子机架行的热气流排气。 该装置包括热模拟器，其包括空气移动装置和流体对空气热交换器。 空气移动装置建立从热模拟器的空气入口到空气出口侧的气流，其被定制成与要模拟的电子子系统，机架或行架排的加热气流排气相关联。 流体对空气热交换器通过热模拟器加热气流，使来自模拟器的气流的温度被调整为与正在模拟的电子子系统，机架或行架的加热气流排气的温度相关。 该装置还包括流体分配装置，其包括与流体模拟器分离设置的流体分配单元，并向热模拟器的流体对空气热交换器提供热流体。

公开(公告)号：US20130180686A1

公开(公告)日：2013-07-18

申请号：US13785275

申请日：2013-03-05

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Levi A. CAMPBELL ,  Richard C. CHU ,  Michael J. ELLSWORTH, Jr. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC分类号： F28D15/00

CPC分类号： F28D15/00 ,  G05D16/202

摘要： A pressure control unit and method are provided for facilitating single-phase heat transfer within a liquid-based cooling system. The pressure control unit includes a pressure vessel containing system coolant, and a pressurizing mechanism associated with the pressure vessel. A coolant line couples system coolant in the pressure vessel in fluid communication with the coolant loop of the cooling system, and a regulator mechanism couples to the pressurizing mechanism to maintain pressure within the pressure vessel at or above a defined pressure threshold, thus maintaining pressure within the coolant loop above the pressure threshold. The defined pressure threshold is set to facilitate system coolant within the coolant loop remaining single-phase throughout an operational temperature range of the system coolant within the coolant loop. More particularly, the pressure threshold is set to ensure pressure of system coolant within the coolant loop remains above the coolant's saturation pressure at maximum operational temperature.

摘要翻译： 提供了一种压力控制单元和方法，用于促进在液体冷却系统内的单相热传递。 压力控制单元包括容纳系统冷却剂的压力容器和与压力容器相关联的加压机构。 冷却剂管线将压力容器中的系统冷却剂与冷却系统的冷却剂回路流体连通，并且调节器机构联接到加压机构，以将压力容器内的压力维持在或高于限定的压力阈值，从而保持在 冷却剂回路高于压力阈值。 设定的压力阈值被设定为便于在冷却剂回路内的系统冷却剂的整个工作温度范围内，冷却剂回路内的系统冷却剂保持单相。 更具体地，设定压力阈值以确保冷却剂回路内的系统冷却剂的压力在最大工作温度下保持高于冷却剂的饱和压力。