公开(公告)号：US20190295952A1

公开(公告)日：2019-09-26

申请号：US15926044

申请日：2018-03-20

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Kamal K. Sikka ,  Jon A. Casey ,  Joshua Rubin ,  Arvind Kumar ,  Dinesh Gupta ,  Charles L. Arvin ,  Mark W. Kapfhammer ,  Steve Ostrander ,  Maryse Cournoyer ,  Valérie A. Oberson ,  Lawrence A. Clevenger

IPC: H01L23/538 ,  H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

Abstract: Direct bonding heterogeneous integration packaging structures and processes include a packaging substrate with first and second opposing surfaces. A trench or a pedestal is provided in the first surface. A bridge is disposed in the trench or is adjacent the pedestal sidewall, wherein the bridge includes an upper surface coplanar with the first surface of the package substrate. At least two chips in a side by side proximal arrangement overly the bridge and the packaging substrate, wherein the bridge underlies peripheral edges of the at least two chips in the side by side proximal arrangement. The at least two chips include a plurality of electric connections that are directly coupled to corresponding electrical connections on the bridge and on the packaging substrate.

公开(公告)号：US20190172787A1

公开(公告)日：2019-06-06

申请号：US15828463

申请日：2017-12-01

Applicant: International Business Machines Corporation

Inventor： Francois Arguin ,  Luc Guerin ,  Maryse Cournoyer ,  Steve E. Whitehead ,  Jean Audet ,  Richard D. Langlois ,  Christian Bergeron ,  Pascale Gagnon ,  Nathalie Meunier

IPC: H01L23/538 ,  H01L25/18 ,  H01L23/498

Abstract: A package and system for high-density chip-to-chip interconnection is provided. Embodiments of the present invention utilizes a plurality of circuit dies including a laminate substrate adjacent to the plurality of circuit dies. It also includes a conductive spacer disposed between the laminate substrate and one of the plurality of circuit dies, a silicon bridge and a conductive interposer disposed between the laminate substrate and the plurality of dies and adjacent to the conductive spacer. Furthermore the embodiment of this present invention can include a top layer of a printed circuit board (PCB) coupled with a bottom layer of the laminate substrate. The conductive spacer comprises, at least of, a laminate, organic or copper material.