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Patent Agency Ranking
公开(公告)号：US11515459B2
公开(公告)日：2022-11-29
申请号：US17158020
申请日：2021-01-26
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
Inventor： Ping-Hsiang Kao , Po-Lun Chen , Chun-Ta Chen , Po-Ching Lin , Ya-Chu Hsu , Chia-Ming Fan , Chien-Yu Huang
Abstract: The present invention relates to a micro light-emitting diode display panel and a method for producing the same. A backplane and a light-emitting diode display layer are subjected to a bonding process to form eutectic structures between the backplane and light-emitting diodes of the light-emitting diode display layer. Then, an adhesive bonding layer including a resin material and conducting materials is formed on a surface of the backplane, and a heating process is performed, thereby causing the conducting materials to form a plurality of metallic bridge connection structures. Therefore, a bonding between the light-emitting diode and the backplane is reinforced, and tensile strength of the micro light-emitting diode display panel is enhanced.
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公开(公告)号：US20220199596A1
公开(公告)日：2022-06-23
申请号：US17147729
申请日：2021-01-13
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
Inventor： Po-Lun Chen , Chun-Ta Chen , Po-Ching Lin
Abstract: The present invention is a display and manufacturing method thereof, including a thin film substrate, a plurality of packaging layers, and a stretch-resistant unit, wherein one side of the thin film substrate has a plurality of pixel areas, each pixel area contains at least one light-emitting element, and each packaging layer respectively covers one of the pixel areas to form an island-shape structure, and there is a spacing between any two adjacent island-shape structures, and each stretch-resistant unit deposed at the spacing and connects the adjacent island-shape structures.
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公开(公告)号：US11963385B2
公开(公告)日：2024-04-16
申请号：US17452233
申请日：2021-10-25
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
Inventor： Wen-You Lai , Ping-Hsiang Kao , Po-Lun Chen , Chun-Ta Chen , Po-Ching Lin , Ya-Chu Hsu
IPC: H10K50/844 , H01L25/075 , H01L27/15 , H01L33/52 , H10K59/90 , H10K71/00 , H10K77/10 , H10K102/00
CPC classification number: H10K50/844 , H01L25/0753 , H01L27/156 , H01L33/52 , H10K59/90 , H10K71/00 , H01L2933/005 , H10K77/111 , H10K2102/311
Abstract: The disclosure provides a local stretch packaging structure, including a substrate, a flexible electronic element, a plurality of light-emitting display elements, and a packaging layer. The flexible electronic element is disposed on the substrate. These light-emitting display elements are disposed on the flexible electronic element. The packaging layer includes a packaging area and a non-packaging area. The packaging area covers the upper surface and sidewalls of these light-emitting display elements. The non-packaging area is directly covered the flexible electronic element that is not disposed with these light-emitting display elements.
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公开(公告)号：US11895811B2
公开(公告)日：2024-02-06
申请号：US17519153
申请日：2021-11-04
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , Interface Optoelectronics (Wuxi) Co., Ltd. , General Interface Solution Limited
Inventor： Ping-Hsiang Kao , Wen-You Lai , Po-Lun Chen , Chun-Ta Chen , Po-Ching Lin , Ya-Chu Hsu
CPC classification number: H05K7/20963 , G09F9/301 , G06F3/0412 , G06F3/04164 , G06F2203/04102
Abstract: A curved electronic device and a method for manufacturing the same are disclosed. The curved electronic device includes a substrate, a component layer, and a modulation layer. The component layer is disposed on the substrate. The component layer is composed of a plurality of electronic components and their connecting wiring arranged on the substrate. The modulation layer is disposed on the component layer, and includes at least one pattern area and at least one blank area that are formed on the component layer. The blank area allows one part of the electronic components to be exposed out of the modulation layer. The modulation layer and the substrate have different heat absorption rates, so that the positions of the substrate corresponding to the blank area and the pattern area have different degrees of softening, so as to prevent the component layer from being damaged in the process of stretching the substrate.
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公开(公告)号：US11552064B2
公开(公告)日：2023-01-10
申请号：US17147729
申请日：2021-01-13
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
Inventor： Po-Lun Chen , Chun-Ta Chen , Po-Ching Lin
Abstract: The present invention is a display and manufacturing method thereof, including a thin film substrate, a plurality of packaging layers, and a stretch-resistant unit, wherein one side of the thin film substrate has a plurality of pixel areas, each pixel area contains at least one light-emitting element, and each packaging layer respectively covers one of the pixel areas to form an island-shape structure, and there is a spacing between any two adjacent island-shape structures, and each stretch-resistant unit deposed at the spacing and connects the adjacent island-shape structures.
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