Abstract:
Provided is a wireless power transmission system. The wireless power transmission system includes a power supply unit generating amplified power; a wireless power transmission unit receiving and converting the amplified power into wireless power; a wireless power reception unit receiving and converting the wireless power into charging power; and a charging unit receiving the charging power, wherein the charging unit includes a battery to store the charging power and the power supply unit includes a power detection unit identifies the charged state of the battery based on the amplified voltage and amplified current of the amplified power.
Abstract:
The present disclosure relates to an ultrasonic rechargeable battery module and an ultrasonic rechargeable battery apparatus of a polyhedral structure including the same. The ultrasonic rechargeable battery module includes: a packaging including an accommodation part; a reception vibration panel coupled to a peripheral portion of the packaging by using a flexible hinge to seal the packaging; an ultrasonic wave receiving element formed in a lower surface of the reception vibration panel, and configured to convert vibration energy generated by ultrasonic waves to electric energy; a circuit board formed inside the packaging, and configured to convert the electric energy converted by the ultrasonic wave receiving element to electric energy having a predetermined size; and a secondary battery formed inside the packaging and configured to store the electric energy converted by the circuit board, in which the packaging, the flexible hinge, and the reception vibration panel are formed of a titanium alloy.
Abstract:
A condenser microphone having a flexure hinge diaphragm and a method of manufacturing the same are provided. The method includes the steps of: forming a lower silicon layer and a first insulating layer; forming an upper silicon layer on the first insulating layer; forming sound holes by patterning the upper silicon layer; forming a second insulating layer and a conductive layer on the upper silicon layer; forming a passivation layer on the conductive layer; forming a sacrificial layer on the passivation layer; depositing a diaphragm on the sacrificial layer, and forming air holes passing through the diaphragm; forming electrode pads on the passivation layer and a region of the diaphragm; and etching the layers to form an air gap between the diaphragm and the upper silicon layer. Consequently, a manufacturing process may improve the sensitivity and reduce the size of the condenser microphone.