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公开(公告)号：US10131118B2
公开(公告)日：2018-11-20
申请号：US14759354
申请日：2014-01-06
Applicant: Corning Incorporated , Kiat Chyai Kang , Sue Camille Lewis , Govindarajan Natarajan , Yu Xiao , Chunhe Zhang
Inventor： Kiat Chyai Kang , Sue Camille Lewis , Govindarajan Natarajan , Yu Xiao , Chunhe Zhang
Abstract: A laminated glass structure comprising a non-glass substrate and a glass sheet bonded to the non-glass substrate to form the laminated glass structure, wherein the laminated glass structure withstands a ball drop test wherein a 535 g stainless steel ball is dropped from a height of 0.8 m onto the laminated glass structure, with the glass sheet being impacted by the ball. The glass sheet has a thickness such that the glass sheet exhibits, without cracking, deformation to adapt to any shape change of the non-glass substrate as imparted by the ball of the ball drop test.
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公开(公告)号：US20160083282A1
公开(公告)日：2016-03-24
申请号：US14785457
申请日：2014-04-14
Applicant: CORNING INCORPORATED
Inventor： Jean-Marc Martin Gerard Jouanno , Kiat Chyai Kang , Sue Camille Lewis , Govindarajan Natarajan , Yu Xiao
IPC: C03B27/012 , B32B37/10 , B32B37/06 , B32B37/08
CPC classification number: C03B27/012 , B29C35/0238 , B29C35/0277 , B29C43/30 , B29C43/52 , B29C44/06 , B29C44/24 , B32B17/061 , B32B17/064 , B32B17/10036 , B32B37/06 , B32B37/08 , B32B37/10 , B32B2457/20
Abstract: A method of forming a laminated glass structure includes introducing a continuous ribbon of flexible glass substrate having a thickness of no greater than about 0.3 mm to a substrate material. The substrate material has a coefficient of thermal expansion (CTE) that is greater than that of the flexible glass substrate. The flexible glass substrate is laminated to the substrate material at an elevated temperature. The substrate material is cooled to introduce a compressive stress across a thickness of the flexible glass substrate.
Abstract translation: 形成夹层玻璃结构的方法包括向衬底材料引入具有不大于约0.3mm的厚度的柔性玻璃衬底的连续带。 衬底材料的热膨胀系数（CTE）大于柔性玻璃衬底的热膨胀系数。 柔性玻璃基板在升高的温度下层压到基底材料上。 冷却基板材料以在柔性玻璃基板的厚度上引入压缩应力。
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公开(公告)号：US11508575B2
公开(公告)日：2022-11-22
申请号：US16916385
申请日：2020-06-30
Applicant: CORNING INCORPORATED
Inventor： Jin Su Kim , Yu Xiao
Abstract: A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a core glass having a core glass coefficient of thermal expansion αcore, the first clad layer and the second clad layer each comprising a clad glass having a clad glass coefficient of thermal expansion αclad, where αclad>αcore; affixing integrated circuit devices to the second clad layer of the laminate sheet or wafer; forming a fan-out layer on or above the integrated circuit devices; and removing some of the first clad layer to decrease warp of the sheet or wafer with integrated circuit devices and a fan-out layer thereon. A method of producing a laminate sheet or wafer having a selected CTE is also disclosed.
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公开(公告)号：US09963374B2
公开(公告)日：2018-05-08
申请号：US14785457
申请日：2014-04-14
Applicant: Corning Incorporated
Inventor： Jean-Marc Martin Gerard Jouanno , Kiat Chyai Kang , Sue Camille Lewis , Govindarajan Natarajan , Yu Xiao
IPC: B29C65/00 , C03B27/012 , B32B17/06 , B32B17/10 , B32B37/06 , B32B37/08 , B32B37/10 , B29C44/06 , B29C35/02 , B29C44/24 , B29C43/30 , B29C43/52
CPC classification number: C03B27/012 , B29C35/0238 , B29C35/0277 , B29C43/30 , B29C43/52 , B29C44/06 , B29C44/24 , B32B17/061 , B32B17/064 , B32B17/10036 , B32B37/06 , B32B37/08 , B32B37/10 , B32B2457/20
Abstract: A method of forming a laminated glass structure includes introducing a continuous ribbon of flexible glass substrate having a thickness of no greater than about 0.3 mm to a substrate material. The substrate material has a coefficient of thermal expansion (CTE) that is greater than that of the flexible glass substrate. The flexible glass substrate is laminated to the substrate material at an elevated temperature. The substrate material is cooled to introduce a compressive stress across a thickness of the flexible glass substrate.
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