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公开(公告)号:US20210135109A1
公开(公告)日:2021-05-06
申请号:US16635690
申请日:2018-07-30
Applicant: Corning Incorporated
Inventor: Mingqian He , Yang Li , Karan Mehrotra , Hongxiang Wang
IPC: H01L51/00 , C08G61/12 , C09D127/20
Abstract: The present disclosure describes a method of crosslinking fluoroelastomers, or more precisely thermally-crosslinkable fluorine-containing polymers, and to devices such as OTFTs (organic thin film transistors) incorporating such polymers. In some embodiments, a method comprises mixing: a solvent, a thermally crosslinkable fluorine-containing polymer, and one or more organic bases to form a mixed solution. The mixed solution is deposited over a substrate to form a first layer. The first layer is then crosslinked by thermal treatment to form a crosslinked first layer. The polymer is selected from: homopolymers of vinylidene fluoride; and copolymers of vinylidene fluoride with fluorine-containing ethylenic monomers. The one or more organic bases each have a pKa of 10 to 14.
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公开(公告)号:US12052911B2
公开(公告)日:2024-07-30
申请号:US17291406
申请日:2019-10-22
Applicant: Corning Incorporated
Inventor: Huayun Deng , Mingqian He , Xin Li , Yang Li , Weijun Niu , Arthur Lawrence Wallace , Hongxiang Wang
CPC classification number: H10K85/113 , C08G61/126 , H10K85/151 , C08G2261/124 , C08G2261/1412 , C08G2261/18 , C08G2261/228 , C08G2261/3223 , C08G2261/3241 , C08G2261/3243 , C08G2261/92 , H10K10/466 , H10K10/484
Abstract: A cross-bred organic semiconductor (OSC) polymer, includes a diketopyrrolopyrrole (DPP)-fused thiophene polymeric material, such that: the DPP-fused thiophene polymeric material comprises a first linear alkyl-substituted DPP portion and a second branched alkyl-substituted DPP portion, the cross-bred OSC polymer comprises a repeat unit having both the first linear alkyl-substituted DPP portion and the second branched alkyl-substituted DPP portion, and the fused thiophene is beta-substituted.
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公开(公告)号:US12048236B2
公开(公告)日:2024-07-23
申请号:US17283359
申请日:2019-10-07
Applicant: Corning Incorporated
Inventor: Mingqian He , Jenny Kim , Xin Li , Yang Li , Hongxiang Wang
CPC classification number: H10K85/113 , C08L53/02 , G03F7/038 , H10K85/111 , G03F7/2002 , G03F7/30 , H10K10/466 , H10K71/15
Abstract: A polymer blend includes an organic semiconductor polymer blended with an isolating polymer; at least one photoinitiator for generating active radicals; and at least one crosslinker comprising C═C bonds, thiols, or combinations thereof, such that the organic semiconductor polymer is a diketopyrrolopyrrole-fused thiophene polymeric material, the fused thiophene is beta-substituted, and the isolating polymer has a non-conjugated backbone. A method of forming an organic semiconductor device having the polymer blend is also presented.
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公开(公告)号:US11707411B2
公开(公告)日:2023-07-25
申请号:US16939478
申请日:2020-07-27
Applicant: CORNING INCORPORATED
Inventor: Lingke Li , Yang Li , Arlin Lee Weikel
CPC classification number: A61J1/1468 , B65D1/40 , B65D65/42 , B65D85/70 , C03C17/005 , C03C17/322 , C09D179/04 , C03C2217/78 , C03C2218/111 , C03C2218/32
Abstract: The present disclosure is directed to pharmaceutical packages which include a coating that comprises polycyanurate, and methods for the production of such. In one or more embodiments of the present disclosure, a pharmaceutical package may comprise a glass container comprising a first surface and a second surface opposite the first surface. The first surface may be an outer surface of the glass container. The pharmaceutical package may further comprise a coating positioned over at least a portion of the first surface of the glass container. The coating may comprise polycyanurate.
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15.
公开(公告)号:US20230148341A1
公开(公告)日:2023-05-11
申请号:US17912628
申请日:2020-03-11
Applicant: CORNING INCORPORATED
Inventor: Weimin Hou , Yang Li , Jianguo Wang , Qing Zhou
Abstract: A cement composition for plugging a honeycomb body, a plugged honeycomb body, and methods of plugging a honeycomb body are provided. The cement composition includes a source of inorganic particles, an inorganic binder, an organic binder, and a crosslinking agent that is capable of reacting with the inorganic binder and the organic binder. The cement composition can be dried without firing to form water-resistant plugs in a honeycomb body.
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16.
公开(公告)号:US20220155683A1
公开(公告)日:2022-05-19
申请号:US17440387
申请日:2020-03-05
Applicant: Corning Incorporated
Inventor: Huayun Deng , Mingqian He , Yang Li , Weijun Niu , Hongxiang Wang
Abstract: A polymer blend, including at least one organic semiconductor (OSC) polymer, such that: the at least one OSC polymer is a diketopyrrolopyrrole-fused thiophene polymeric material, the fused thiophene is beta-substituted, the at least one OSC polymer has a first portion and a second portion, and at least one of the first portion or the second portion includes at least one UV-curable side chain.
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公开(公告)号:US11283023B2
公开(公告)日:2022-03-22
申请号:US16620050
申请日:2018-06-01
Applicant: Corning Incorporated
Inventor: Mingqian He , Yang Li , James Robert Matthews , Karan Mehrotra , Weijun Niu , Arthur Lawrence Wallace
Abstract: Disclosed is a polymer blend comprising an organic semiconductor (OSC) polymer blended with an isolating polymer and method for making the same. The OSC polymer includes a diketopyrrolopyrrole fused thiophene polymeric material, and the fused thiophene is beta-substituted. The isolating polymer includes a non-conjugated backbone, and the isolating polymer may be one of polyacrylonitrile, alkyl substituted polyacrylonitrile, polystyrene, polysulfonate, polycarbonate, an elastomer block copolymer, derivatives thereof, copolymers thereof and mixtures thereof. The method includes blending the OSC polymer with an isolating polymer in an organic solvent to create a polymer blend and depositing a thin film of the polymer blend over a substrate. Also disclosed is an organic semiconductor device that includes a thin semiconducting film comprising OSC polymer.
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公开(公告)号:US20210300855A1
公开(公告)日:2021-09-30
申请号:US17209699
申请日:2021-03-23
Applicant: Corning Incorporated , Liaoning Shihua University
Inventor: Mingqian He , Yang Li , Jing Sun , Hongxiang Wang , Mong-dong Zhou
IPC: C07C51/305 , C07C41/30 , C07C29/10 , B01J27/122 , B01J31/22
Abstract: A method includes: providing a mixture including at least one alkyl tosylate and a Grignard reagent; and reacting the at least one alkyl tosylate with the Grignard reagent in a C—C coupling reaction mechanism to form a branched aliphatic alcohol.
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公开(公告)号:US20210038474A1
公开(公告)日:2021-02-11
申请号:US16939478
申请日:2020-07-27
Applicant: CORNING INCORPORATED
Inventor: Lingke Li , Yang Li , Arlin Lee Weikel
Abstract: The present disclosure is directed to pharmaceutical packages which include a coating that comprises polycyanurate, and methods for the production of such. In one or more embodiments of the present disclosure, a pharmaceutical package may comprise a glass container comprising a first surface and a second surface opposite the first surface. The first surface may be an outer surface of the glass container. The pharmaceutical package may further comprise a coating positioned over at least a portion of the first surface of the glass container. The coating may comprise polycyanurate.
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公开(公告)号:US20240367420A1
公开(公告)日:2024-11-07
申请号:US18290835
申请日:2022-07-11
Applicant: Corning Incorporated
Inventor: Kiyomi DeLige Fahy , Jenny Kim , Lingke Li , Yang Li , Kevin Robert McCarthy , Hongxiang Wang , Arlin Lee Weikel
Abstract: Laminates can comprise a substrate and a film. The film can comprise a film thickness from about 5 micrometers to about 400 micrometers and a tri-block copolymer comprising a first block positioned between two second blocks. The first block can be grafted with a first functional group. The first block can comprise a first glass transition temperature of about 0° C. or less. The two second blocks can each comprise a glass transition temperature of about 50° C. or more. A combined weight of the two second blocks can be from about 10 wt % to about 50 wt % of the tri-block copolymer. The film can comprise a refractive index from about 1.48 to about 1.55. Methods of forming a laminate can comprise disposing a film over a substrate. Methods can further comprise heating the film and the substrate to a first temperature and then a second temperature.
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