公开(公告)号：US11191185B2

公开(公告)日：2021-11-30

申请号：US16749254

申请日：2020-01-22

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Rakesh Chopra ,  Mandy Hin Lam ,  M. Baris Dogruoz ,  Joel Richard Goergen

IPC: H05K7/20

Abstract: In one embodiment, a network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis, at least a portion of the modules each comprising a connector for receiving coolant for cooling components on the module, a controller for controlling coolant distribution to the modules, and a leak detection system for identifying a leak of the coolant and transmitting an indication of the leak to the controller.

公开(公告)号：US20210231890A1

公开(公告)日：2021-07-29

申请号：US16922383

申请日：2020-07-07

Applicant: Cisco Technology, Inc.

Inventor： Rakesh Chopra ,  M. Baris Dogruoz ,  Mark Nowell ,  Mandy Hin Lam

IPC: G02B6/42 ,  H01R13/518

Abstract: Presented herein are optical module cage designs and heatsink configurations for improved air cooling of pluggable optical modules disposed within the optical module cages. The designs and configurations presented herein facilitate efficient air cooling of higher power pluggable optical modules by enhancing airflow through the optical module cages, increasing contact between the optical modules and the heatsinks, and/or increasing the heatsink dissipation surface area.

公开(公告)号：US20210112686A1

公开(公告)日：2021-04-15

申请号：US16697463

申请日：2019-11-27

Applicant: Cisco Technology, Inc.

Inventor： M. Baris Dogruoz ,  Joel Goergen

IPC: H05K7/20 ,  H05K1/02

Abstract: A combined liquid and air cooling system is provided over a printed circuit board (PCB) of an electronic device, where the PCB includes an integrated circuit package including an application specific integrated circuit (ASIC) die and a plurality of high bandwidth memory (HBM) modules located proximate the ASIC die, and the combined liquid and air cooling system includes a liquid cooling system located over the integrated circuit package and an air cooling system integrated with the liquid cooling system and a portion of the PCB. The system operates in a normal mode, where both liquid and air cooling systems provide cooling to components of the PCB, and a fail-safe mode, where the liquid cooling system is not operating (e.g., due to a detected condition) but the air cooling system operation is adjusted such that it provides sufficient cooling to PCB components which facilitates continuous operation of the electronic device.

公开(公告)号：US20150062820A1

公开(公告)日：2015-03-05

申请号：US14018189

申请日：2013-09-04

Applicant: Cisco Technology, Inc.

Inventor： Mandy Hin Lam ,  Hong Tran Huynh ,  M. Baris Dogruoz

IPC: H01L23/473

CPC classification number: H01L23/473 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus is provided that includes a planar heat conducting material that comprises a first heat sink conduction portion configured to conduct heat between a first integrated circuit and a first heat sink, a second heat sink conduction portion configured to conduct heat between a second integrated circuit and a second heat sink, and a thermal bridge portion configured to conduct heat between the first heat sink conduction portion and the second heat sink conduction portion, such that the thermal bridge portion allows for flexural compensation for a height difference between the first integrated circuit and the second integrated circuit.

Abstract translation: 提供了一种装置，其包括平面导热材料，其包括构造成在第一集成电路和第一散热器之间传导热量的第一散热器传导部分，第二散热器传导部分，被配置为在第二集成电路和 第二散热器和热桥部分，其构造成在第一散热器传导部分和第二散热器传导部分之间传导热量，使得热桥部分允许对第一集成电路和第二散热器传导部分之间的高度差进行挠曲补偿 第二集成电路。

公开(公告)号：US20220225537A1

公开(公告)日：2022-07-14

申请号：US17145816

申请日：2021-01-11

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Mark Nowell ,  M. Baris Dogruoz ,  Mandy Hin Lam ,  Rakesh Chopra

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/44

Abstract: In one embodiment, an apparatus is configured for insertion into a network device and includes a printed circuit board, at least one electronic component mounted on the printed circuit board and configured for direct air-cooling, and an enclosure comprising a plurality of electronic components, an electrical connector, a fluid inlet connector, and a fluid outlet connector. A dielectric liquid is disposed within the enclosure for immersion cooling of said plurality of electronic components during operation of the network device.

公开(公告)号：US11184994B2

公开(公告)日：2021-11-23

申请号：US15983305

申请日：2018-05-18

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Mandy Hin Lam ,  Vic Hong Chia ,  M. Baris Dogruoz

IPC: H05K7/20

Abstract: According to one aspect, an apparatus includes a first component, a plurality of line card slots, a fan array, and a sensor arrangement. The first component has a first opening defined therein and a second opening defined therein. The first component includes a first configurable line card flapper is arranged to at least partially cover the first opening and a second configurable line card flapper is arranged to at least partially cover the second opening. The plurality of line card slots includes a first line card slot associated with the first opening and a second line card slot associated with the second opening. The fan array includes a plurality of fans. The sensor arrangement includes at least one sensor arranged to monitor at least one condition. The first and second configurable line card flappers are arranged to be configured using information obtained from the sensor arrangement.

公开(公告)号：US11122705B2

公开(公告)日：2021-09-14

申请号：US16246914

申请日：2019-01-14

Applicant: Cisco Technology, Inc.

Inventor： M. Baris Dogruoz ,  Mandy Hin Lam ,  Pirooz Tooyserkani

IPC: H05K7/20 ,  H04B1/06

Abstract: An apparatus includes a cage structure and a cooling plate configured to contain a cooling liquid to cool the cage structure. The cage structure has a front end, a top surface adjacent to the front end, a first opening at the front end, and a second opening on the top surface. The first opening is configured to receive a pluggable optical module. The cooling plate is disposed on top of the second opening of the cage structure. The apparatus may further include a deformable pad disposed at the second opening of the cage structure and beneath the cooling plate.

公开(公告)号：US20200229321A1

公开(公告)日：2020-07-16

申请号：US16246914

申请日：2019-01-14

Applicant: Cisco Technology, Inc.

Inventor： M. Baris Dogruoz ,  Mandy Hin Lam ,  Pirooz Tooyserkani

IPC: H05K7/20

Abstract: An apparatus includes a cage structure and a cooling plate configured to contain a cooling liquid to cool the cage structure. The cage structure has a front end, a top surface adjacent to the front end, a first opening at the front end, and a second opening on the top surface. The first opening is configured to receive a pluggable optical module. The cooling plate is disposed on top of the second opening of the cage structure. The apparatus may further include a deformable pad disposed at the second opening of the cage structure and beneath the cooling plate.

公开(公告)号：US20200093031A1

公开(公告)日：2020-03-19

申请号：US16131629

申请日：2018-09-14

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Rakesh Chopra ,  Mandy Hin Lam ,  M. Baris Dogruoz

IPC: H05K7/20 ,  H05K7/02

Abstract: In one embodiment, an apparatus includes a chassis comprising a plurality of slots for receiving a plurality of modules, a first group of the modules received in a first orientation and a second group of the modules received in a second orientation orthogonal to said first orientation, and a coolant distribution module inserted into one of the slots in the first orientation for distributing coolant to at least one of the modules in the second group of modules. A method for distributing coolant to the modules is also disclosed herein.

公开(公告)号：US10582639B1

公开(公告)日：2020-03-03

申请号：US16131629

申请日：2018-09-14

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Rakesh Chopra ,  Mandy Hin Lam ,  M. Baris Dogruoz

IPC: H05K7/20 ,  H05K7/02

Abstract: In one embodiment, an apparatus includes a chassis comprising a plurality of slots for receiving a plurality of modules, a first group of the modules received in a first orientation and a second group of the modules received in a second orientation orthogonal to said first orientation, and a coolant distribution module inserted into one of the slots in the first orientation for distributing coolant to at least one of the modules in the second group of modules. A method for distributing coolant to the modules is also disclosed herein.