公开(公告)号：US20150187718A1

公开(公告)日：2015-07-02

申请号：US14656650

申请日：2015-03-12

Applicant: CALIFORNIA INSTITUTE OF TECHNOLOGY

Inventor： Muhammad Mujeeb-U-Rahman ,  Axel Scherer

IPC: H01L23/00

CPC classification number: H01L21/285 ,  A61B2562/125 ,  B81C1/00111 ,  B81C1/0038 ,  H01L21/02425 ,  H01L21/28556 ,  H01L24/14 ,  H01L29/41 ,  H01L31/00 ,  H01L33/387 ,  H01L2224/1401 ,  H01L2924/11

Abstract: Three dimensional high surface electrodes are described. The electrodes are fabricated by methods including the steps: designing the pillars; selecting a material for the formation of the pillars; patterning the material; transferring the pattern to form the pillars; insulating the pillars and providing a metal layer for increased conductivity. Alternative methods for fabrication of the electrodes and fabrication of the electrodes using CMOS are also described.

Abstract translation: 描述三维高表面电极。 电极通过以下方法制造：包括以下步骤：设计支柱; 选择用于形成支柱的材料; 图案化材料; 转移模式形成支柱; 绝缘柱并提供用于增加导电性的金属层。 还描述了用于制造电极和使用CMOS制造电极的替代方法。

公开(公告)号：US12144620B2

公开(公告)日：2024-11-19

申请号：US17489610

申请日：2021-09-29

Applicant: CALIFORNIA INSTITUTE OF TECHNOLOGY ,  THE TRUSTEES OF DARTMOUTH COLLEGE

Inventor： Axel Scherer ,  Meisam Honarvar Nazari ,  Muhammad Mujeeb-U-Rahman ,  Mehmet Sencan ,  Arti Gaur

IPC: A61B5/1473 ,  A61B5/00 ,  A61B5/07 ,  A61B5/145 ,  A61B5/1459 ,  A61B5/1486 ,  A61B17/34 ,  A61M5/142 ,  A61M5/172

Abstract: A fully integrated small size implantable sensing device is described, which can include a sensor and an electronic circuit to interface with the sensor and communicate with an external device. Various fabrication methods for the sensing device are described, including provision of wells, created using same fabrication technology as the electronic circuit, to contain electrodes of the sensor and corresponding functionalization chemicals. Such implantable sensing device can be used for a variety of electrochemical measuring applications within a living body as well as actuation by injecting a current into the living body.

公开(公告)号：US10376146B2

公开(公告)日：2019-08-13

申请号：US14174827

申请日：2014-02-06

Applicant: California Institute of Technology

Inventor： Muhammad Mujeeb-U-Rahman ,  Axel Scherer

IPC: A61B5/00 ,  A61B5/1473 ,  A61B5/145 ,  A61B5/1486

Abstract: An implantable device having a communication system, a sensor, and a monolithic substrate is described. The monolithic substrate has an integrated sensor circuit configured to process input from the sensor into a form conveyable by the communication system.

公开(公告)号：US10368788B2

公开(公告)日：2019-08-06

申请号：US15216675

申请日：2016-07-21

Applicant: CALIFORNIA INSTITUTE OF TECHNOLOGY ,  THE TRUSTEES OF DARTMOUTH COLLEGE

Inventor： Axel Scherer ,  Meisam Honarvar Nazari ,  Muhammad Mujeeb-U-Rahman ,  Mehmet Sencan ,  Arti Gaur

IPC: A61M5/142 ,  A61M5/172 ,  A61B5/1473 ,  A61B17/34 ,  A61B5/145 ,  A61B5/1486 ,  A61B5/00 ,  A61B5/1459 ,  A61B5/07

Abstract: A fully integrated small size implantable sensing device is described, which can include a sensor and an electronic circuit to interface with the sensor and communicate with an external device. Various fabrication methods for the sensing device are described, including provision of wells, created using same fabrication technology as the electronic circuit, to contain electrodes of the sensor and corresponding functionalization chemicals. Such implantable sensing device can be used for a variety of electrochemical measuring applications within a living body as well as actuation by injecting a current into the living body.

公开(公告)号：US09177933B2

公开(公告)日：2015-11-03

申请号：US14656650

申请日：2015-03-12

Applicant: CALIFORNIA INSTITUTE OF TECHNOLOGY

Inventor： Muhammad Mujeeb-U-Rahman ,  Axel Scherer

IPC: H01L21/283 ,  H01L23/00 ,  H01L21/285 ,  H01L29/41 ,  H01L33/38 ,  H01L31/00 ,  H01L21/02 ,  B81C1/00

CPC classification number: H01L21/285 ,  A61B2562/125 ,  B81C1/00111 ,  B81C1/0038 ,  H01L21/02425 ,  H01L21/28556 ,  H01L24/14 ,  H01L29/41 ,  H01L31/00 ,  H01L33/387 ,  H01L2224/1401 ,  H01L2924/11

Abstract: Three dimensional high surface electrodes are described. The electrodes are fabricated by methods including the steps: designing the pillars; selecting a material for the formation of the pillars; patterning the material; transferring the pattern to form the pillars; insulating the pillars and providing a metal layer for increased conductivity. Alternative methods for fabrication of the electrodes and fabrication of the electrodes using CMOS are also described.

Abstract translation: 描述三维高表面电极。 电极通过以下方法制造：包括以下步骤：设计支柱; 选择用于形成支柱的材料; 图案化材料; 转移模式形成支柱; 绝缘柱并提供用于增加导电性的金属层。 还描述了用于制造电极和使用CMOS制造电极的替代方法。

公开(公告)号：US20140167257A1

公开(公告)日：2014-06-19

申请号：US14106701

申请日：2013-12-13

Applicant: CALIFORNIA INSTITUTE OF TECHNOLOGY

Inventor： Muhammad Mujeeb-U-Rahman ,  Axel Scherer

IPC: H01L21/285 ,  H01L29/41

CPC classification number: H01L21/285 ,  A61B2562/125 ,  B81C1/00111 ,  B81C1/0038 ,  H01L21/02425 ,  H01L21/28556 ,  H01L24/14 ,  H01L29/41 ,  H01L31/00 ,  H01L33/387 ,  H01L2224/1401 ,  H01L2924/11

Abstract: A method for fabricating three dimensional high surface electrodes is described. The methods including the steps: designing the pillars; selecting a material for the formation of the pillars; patterning the material; transferring the pattern to form the pillars; insulating the pillars and providing a metal layer for increased conductivity. Alternative methods for fabrication of the electrodes and fabrication of the electrodes using CMOS are also described.

Abstract translation: 描述了制造三维高表面电极的方法。 方法包括步骤：设计支柱; 选择用于形成支柱的材料; 图案化材料; 转移模式形成支柱; 绝缘柱并提供用于增加导电性的金属层。 还描述了用于制造电极和使用CMOS制造电极的替代方法。