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公开(公告)号:US20240154074A1
公开(公告)日:2024-05-09
申请号:US17775980
申请日:2021-06-22
Applicant: BOE Technology Group Co., Ltd.
Inventor: Xiaoyan Zhu , Jin Yang , Guangcai Yuan , Xinhong Lu , Ling Li
IPC: H01L33/54 , H01L25/075 , H01L33/62
CPC classification number: H01L33/54 , H01L25/0753 , H01L33/62 , H01L2933/005 , H01L2933/0066
Abstract: The present application provides a display panel, a method for fabricating a display panel and a displaying device. The display panel particularly includes at least two neighboring displaying base plates; each of the them includes a flexible substrate and a transparent cover plate that are provided in stack; the flexible substrate is delimited into a displaying region, a bending region and a bonding region, the displaying region and the bonding region are connected by the bending region, the displaying region and the bonding region are parallel, and the bonding region is located on one side of the displaying region that is away from the transparent cover plate; the transparent cover plate is provided with a light shielding layer on one side that is closer to the flexible substrate, and an orthographic projection of the bending region on the transparent cover plate is within an area of the light shielding layer.
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公开(公告)号:US11063108B2
公开(公告)日:2021-07-13
申请号:US16531258
申请日:2019-08-05
Inventor: Liman Peng , Qi Liu , Yan Wu , Jin Yang , Qianqian Zhang , Zhiyong Xue
Abstract: An organic light emitting diode array substrate and an electronic device. The organic light emitting diode array substrate includes a display region, and a first package test electrode and a first package test lead which are outside the display region. The display region includes a first power supply line and a first signal line; the first package test lead is configured to connect the first package test electrode with the first power supply line to provide a first supply voltage for the display region; the first signal line is configured to provide a first electrical signal for the display region; and a thermal conductivity of the first package test lead is higher than a thermal conductivity of the first signal line.
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