DISPLAY SUBSTRATE, METHOD FOR FORMING THE SAME AND DISPLAY DEVICE

    公开(公告)号:US20220376007A1

    公开(公告)日:2022-11-24

    申请号:US17765397

    申请日:2021-04-15

    Abstract: A display substrate includes a base substrate, a thin film transistor array layer, a planarization layer, a first electrode and a pixel definition layer, the pixel definition layer defining a plurality of pixel openings, each pixel opening includes a first edge and a second edge adjacent to each other, the pixel definition layer includes a first pixel definition layer parallel to the first edge and a second pixel definition layer parallel to the second edge. A surface of the first pixel definition layer away from the base substrate is located at a level lower than a surface of the second pixel definition layer away from the base substrate, a groove parallel to the first edge is arranged in a surface of the planarization layer away from the base substrate, at least a part of the first pixel definition layer is arranged in the groove.

    PACKAGING METHOD OF DISPLAY PANEL, DISPLAY PANEL AND DISPLAY DEVICE

    公开(公告)号:US20190036071A1

    公开(公告)日:2019-01-31

    申请号:US15994401

    申请日:2018-05-31

    Inventor: Linlin WANG

    Abstract: A packaging method of a display panel, a display panel and a display device are provided. The packaging method includes: providing a first substrate; providing an adhesive with a magnetic material distributed therein; applying the adhesive to a surface of the first substrate to form a first adhesive layer having a first pattern; providing a magnetic field to drive the magnetic material to mobilize the adhesive on the surface of the first substrate, so as to transform the first adhesive layer having the first pattern into a second adhesive layer having a second pattern, wherein, an orthogonal projection of the first adhesive layer having the first pattern on the first substrate is different from an orthogonal projection of the second adhesive layer having the second pattern on the first substrate; and bonding a second substrate onto the adhesive layer having the second pattern.

    TAPE ATTACHMENT FIXTURE
    14.
    发明申请
    TAPE ATTACHMENT FIXTURE 有权
    胶带附件

    公开(公告)号:US20160299364A1

    公开(公告)日:2016-10-13

    申请号:US15088695

    申请日:2016-04-01

    CPC classification number: G02F1/1303

    Abstract: The present disclosure provides a tape attachment fixture, including: a bearing platform configured to bear a liquid crystal panel; a movement device connected to the bearing platform, and configured to control movement of the bearing platform when a tape is to be attached to different positions of the liquid crystal panel; and a working table fixedly connected to the movement device. The working table includes an accommodation cavity for accommodating the bearing platform.

    Abstract translation: 本公开提供了一种胶带附着夹具,包括:承载液晶面板的轴承平台; 连接到所述轴承平台的运动装置,并且构造成当将带粘附到所述液晶面板的不同位置时,控制所述轴承平台的运动; 以及与所述移动装置固定连接的工作台。 工作台包括用于容纳轴承平台的容纳腔。

    DISPLAY SUBSTRATE, DISPLAY DEVICE, AND MANUFACTURING METHOD

    公开(公告)号:US20220392980A1

    公开(公告)日:2022-12-08

    申请号:US17763211

    申请日:2021-05-20

    Inventor: Linlin WANG

    Abstract: A display substrate, a display device, and a manufacturing method. The display substrate includes a TFT substrate, and a pixel defining layer provided on the TFT substrate and surrounding a plurality of pixel pits, wherein an electroluminescent device layer, a connection layer, a first encapsulation layer, and a quantum dot layer are sequentially stacked in each pixel pit; the connection layers in the adjacent pixel pits are connected to the side of the pixel defining layer facing away from the TFT substrate; and the connection layers are configured to be electrically connected to the electroluminescent device layers in the two adjacent pixel pits.

    LIGHT EMITTING DIODE, METHOD OF MANUFACTURING THE SAME, AND LIGHT EMITTING DEVICE

    公开(公告)号:US20220037614A1

    公开(公告)日:2022-02-03

    申请号:US17279664

    申请日:2020-07-08

    Abstract: The present disclosure provides a light-emitting diode, including a first electrode, a light-emitting functional layer and a second electrode which are stacked, the first electrode is a transparent electrode, the second electrode includes a metal electrode layer and a semiconductor auxiliary layer, the metal electrode layer is attached to the light-emitting functional layer, the semiconductor auxiliary layer is located on a surface of the metal electrode layer away from the light-emitting functional layer. The metal electrode layer is made of a magnesium-silver alloy, a thickness of the metal electrode layer is between 3 nm and 5 nm, and the semiconductor auxiliary layer is made of IZO, a thickness of the semiconductor auxiliary layer is between 100 nm and 130 nm. The present disclosure further provides a light emitting device and a method of manufacturing a light emitting diode. The light-emitting diode has high color rendering index and low power consumption.

    LIGHT-EMITTING DIODE AND DRIVING METHOD THEREFOR, AND LIGHT SOURCE APPARATUS AND ELECTRONIC DEVICE

    公开(公告)号:US20220344537A1

    公开(公告)日:2022-10-27

    申请号:US17762654

    申请日:2021-05-17

    Abstract: A light emitting diode and a driving method thereof, a light source apparatus, and an electronic device are disclosed, relating to the technical field of semiconductors. The light emitting diode includes: a substrate; a reflective light-emitting layer disposed on the substrate; a first electrode, a second electrode, and a first insulating layer which are discretely disposed on the reflective light-emitting layer; a saturable absorber layer disposed on the first insulating layer; and a third electrode, a fourth electrode, and a reflective composite layer which are disposed on the saturable absorber layer, respectively, the reflectivity of the reflective light-emitting layer is greater than the reflectivity of the reflective composite layer; wherein the orthographic projections of the saturable absorber layer, the third electrode, the fourth electrode, and the reflective composite layer on the reflective light-emitting layer, respectively, do not overlap with the first electrode and the second electrode.

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