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    Structured fabrics for electronic devices
    11.
    发明授权
    Structured fabrics for electronic devices 有权

    公开(公告)号：US10966332B2

    公开(公告)日：2021-03-30

    申请号：US15891533

    申请日：2018-02-08

    Applicant: Apple Inc.

    Inventor： Yohji Hamada ,  John J. Baker ,  Peter F. Coxeter ,  Benjamin M. Rappoport ,  Joseph B. Walker

    IPC: B32B3/26 ,  B32B5/02 ,  H05K5/03 ,  B32B37/12 ,  B32B37/18 ,  B32B38/00

    Abstract: Electronic equipment may include structured fabric. Structured fabric may be used as a protective case or cosmetic cover for an electronic device, may be used to form a band that holds an electronic device against a user's body, or may be used to cover one or more openings in an electronic device. Structured fabrics may be soft and pliable while maintaining the ability to hold a given shape without added support. Structured fabric may be formed by laminating fabric such as warp-knit fabric with a stiffener such as polymer film. Structured fabrics may include openings through which signals such as optical or audio signals pass. To maintain the geometry and shape of the openings in the structured fabric without covering the openings, the stiffener and adhesive that are attached to the fabric may be cut to form a pattern of openings that align with the openings in the fabric.

    Woven material including bonding fibers
    12.
    发明授权
    Woven material including bonding fibers 有权

    公开(公告)号：US10568396B2

    公开(公告)日：2020-02-25

    申请号：US15501926

    申请日：2015-07-12

    Applicant: Apple Inc.

    Inventor： Yoji Hamada ,  Peter F. Coxeter ,  Ying-Liang Su ,  Edward Siahaan ,  Whitney D. Mattson ,  Naoto Matsuyuki

    IPC: A44C5/00 ,  A44C27/00 ,  D03D11/00 ,  D03D15/00 ,  D03D1/00 ,  D03D3/00

    Abstract: A woven material (100) including bonding fibers (108) and a method of reinforcing woven material using bonding fibers is disclosed. The woven material (100) includes a plurality of warp threads (102), and at least one weft thread (104) coupled to the warp threads (102). The woven material (100) also includes a plurality of bonding fibers (108). The bonding fibers (108) are positioned in parallel with the warp threads (102), and/or in parallel with the weft thread(s) (104). Additionally, the bonding fibers (108) are formed from a material having a melting temperature that is lower than a melting temperature of the material(s) used to form the warp threads (102) and the weft thread(s) (104) of the woven material.

    Seamless Spacer Fabrics for Electronic Devices
    13.
    发明申请
    Seamless Spacer Fabrics for Electronic Devices 审中-公开

    公开(公告)号：US20180272644A1

    公开(公告)日：2018-09-27

    申请号：US15920340

    申请日：2018-03-13

    Applicant: Apple Inc.

    Inventor： Yohji Hamada ,  Siddhartha Hegde ,  Zebinah P. Masse ,  Rimple Bhatia ,  Peter F. Coxeter ,  Amit S. Barve ,  Donald L. Olmstead ,  Javier Mendez

    IPC: B32B1/08 ,  B32B5/02 ,  B32B3/26 ,  B32B27/08 ,  B32B27/12

    Abstract: Electronic equipment may include seamless spacer fabric. Seamless spacer fabric may be used as a protective case or cosmetic cover for an electronic device such as a speaker. A seamless spacer fabric may include a seamless fabric outer layer, a spacer fabric inner layer, and an adhesive layer that bonds the seamless outer layer to the spacer fabric inner layer. The spacer fabric layer may have a seam region where one portion of the spacer fabric layer is joined with another portion of the fabric layer. The seamless fabric outer layer may cover the seam region to hide it from view. One or more additional seam hiding layers or strips may be formed on opposing sides of the spacer fabric layer to cover the seam. The seamless spacer fabric may have an array of openings that extends uniformly around the perimeter of the seamless spacer fabric.

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