公开(公告)号：US20210084402A1

公开(公告)日：2021-03-18

申请号：US17023237

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Jeffrey J. Terlizzi ,  Kathleen A. Bergeron ,  Ali N. Ergun ,  Dustin A. Hatfield ,  Ethan L. Huwe ,  Todd P. Marco ,  Jason Joseph LeBlanc ,  Robert D. Zupke ,  Michael B. Minerbi ,  Prathamesh R. Bhagwat ,  Daniel R. Bloom

IPC: H04R1/10

Abstract: A personal audio device (e.g., headphones, earphones) can have an earpiece (e.g., an ear cup or earbud) with a removable cushioning member (e.g., headphone cushions or ear tips for earbuds). The cushioning member can include an identification tag that encodes identification data for the cushioning member. When the cushioning member is attached to the earpiece, the identification tag is brought into proximity with a tag sensor in the earpiece and the earpiece can read the identification tag to determine identification data for the cushioning member. The identification data can be used to modify a behavior of the earpiece and/or of a host device communicably coupled to the earpiece.

公开(公告)号：US20250105502A1

公开(公告)日：2025-03-27

申请号：US18474012

申请日：2023-09-25

Applicant: Apple Inc.

Inventor： Alireza Pourghorban Saghati ,  Ali N. Ergun ,  Mohammed W. Mokhtar

IPC: H01Q3/24 ,  H01Q1/22

Abstract: An electronic device may include one or more radios and one or more antennas. The electronic device may include an input-output interface for connecting to a radio or an antenna. To facilitate selective external connections to the radio and the antenna, the electronic device may include a switch having a first terminal coupled to the radio, a second terminal coupled to the antenna, and a third terminal coupled to the input-output interface. The switch may be controlled to connect any two terminals of the three terminals to provide the corresponding connection, thereby facilitating the desired external connection(s) in some scenarios while enabling wireless circuitry operation with the radio and the antenna in other scenarios.

公开(公告)号：US12021290B2

公开(公告)日：2024-06-25

申请号：US17380491

申请日：2021-07-20

Applicant: Apple Inc.

Inventor： Alireza Pourghorban Saghati ,  Mohammed W. Mokhtar ,  Ali N. Ergun ,  Oren S. Levy ,  Arman Samimi-Dehkordi ,  Sean T. McIntosh

IPC: H01P5/02 ,  H01P3/08 ,  H04R1/10 ,  H05K1/02

CPC classification number: H01P5/028 ,  H01P3/08 ,  H04R1/1091 ,  H05K1/0243 ,  H04R2420/07 ,  H05K2201/10083 ,  H05K2201/10098

Abstract: An electronic device may include one or more radios and one or more antennas. Radio-frequency transmission lines may couple a radio to a corresponding antenna. To more efficiently form a radio-frequency transmission line, the radio-frequency transmission line may be formed from interconnected conductive traces distributed between a plurality of printed circuits. By integrating transmission line structures onto printed circuits that also serve other functions, the device can require less space to implement a radio-frequency transmission line. While one or more of these printed circuits may individually be unsuitable to implement a radio-frequency transmission line with a particular impedance, the composite impedance of these transmission line structures across the printed circuits, when properly configured, may provide a radio-frequency transmission line with the particular impedance.

公开(公告)号：US20240107249A1

公开(公告)日：2024-03-28

申请号：US18119600

申请日：2023-03-09

Applicant: Apple Inc.

Inventor： Kyusang KIM ,  Ali N. Ergun ,  Anthony D. Minervini ,  Bilal Mohamed Ibrahim Kani ,  Kishore N. Renjan

IPC: H04R31/00 ,  H04R1/04

CPC classification number: H04R31/00 ,  H04R1/04

Abstract: Embodiments of the present disclosure include a structure with a substrate, an electronic device, and a molding compound layer. The substrate has a first surface and a second surface opposite to the first surface, where the substrate includes a first opening. The electronic device is disposed on the first surface of the substrate and includes a second opening aligned with the first opening of the substrate. Further, the molding compound layer is disposed on the second surface of the substrate and includes a third opening aligned with the second opening of the electronic device.

公开(公告)号：US20230078536A1

公开(公告)日：2023-03-16

申请号：US17832346

申请日：2022-06-03

Applicant: Apple Inc.

Inventor： Ali N. Ergun ,  Bilal Mohamed Ibrahim Kani ,  Chang Liu ,  Ethan L. Huwe ,  Jeffrey J. Terlizzi ,  Jerzy S. Guterman ,  Jue Wang ,  Kishore N. Renjan ,  Kyusang Kim ,  Lan H. Hoang ,  Mandar S. Painaik ,  Manoj Vadeentavida ,  Sarah B. Gysbers ,  Takayoshi Katahira ,  Zhiqi Wang

IPC: H05K1/02 ,  H05K1/11 ,  H01Q1/22 ,  H01Q1/36

Abstract: System-in-package modules that can provide a high level of functionality, are space efficient, and are readily manufactured. In an example, a high-functionality system-in-package module can include both a wireless circuit and an antenna. In an example, a space-efficient system-in-package module can include different vertical interconnect paths that can be used to connect the wireless circuit to the antenna. In an example, instead of being shaped as a traditional rectangular cuboid, a space-efficient system-in-package module can have a shape that more closely matches contours of an enclosure for an electronic device.

公开(公告)号：US20230056922A1

公开(公告)日：2023-02-23

申请号：US17806412

申请日：2022-06-10

Applicant: Apple Inc.

Inventor： Bilal Mohamed Ibrahim Kani ,  Ali N. Ergun ,  Kishore N. Renjan ,  Kyusang Kim ,  Manoj Vadeentavida ,  Benjamin J. Grena ,  David M. Kindlon ,  Lan H. Hoang

IPC: H01L25/16 ,  H01L23/498 ,  H01R12/79 ,  H01R13/6581 ,  H01L23/31 ,  H01R12/62 ,  H01L21/56 ,  H01R43/20 ,  H01R12/59 ,  G01D11/24

Abstract: Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.

公开(公告)号：US11115746B1

公开(公告)日：2021-09-07

申请号：US17032602

申请日：2020-09-25

Applicant: Apple Inc.

Inventor： Scott D. Morrison ,  Kirill Kalinichev ,  Ali N. Ergun

IPC: H04R1/10

Abstract: A charging case for a pair of earbuds that comprises: a body having one or more cavities configured to receive the pair of earbuds; a lid attached to the body and operable between a closed position where the lid is aligned over the one or more cavities covering the pair earbuds and an open position that allows a user to remove the pair of earbuds from the body; one or more sensors that generates sensor data; a controller coupled to receive the sensor data from the sensor and operable to detect when the charging case is in freefall and/or suffers an impact event based, at least in part, on the sensor data and generate a trigger signal in response to detecting the impact event; and an earbud protection mechanism responsive to the trigger signal and operable to retain the pair of earbuds within the charging case.