公开(公告)号：US20160240426A1

公开(公告)日：2016-08-18

申请号：US15019573

申请日：2016-02-09

Applicant: APPLIED MATERIALS, INC.

Inventor： ARAVIND MIYAR KAMATH ,  CHENG-HSIUNG TSAI ,  JALLEPALLY RAVI ,  TOMOHARU MATSUSHITA ,  YU CHANG

IPC: H01L21/687 ,  H01L21/67

CPC classification number: H01L21/67248 ,  H01J37/32082 ,  H01J37/32532 ,  H01J37/32724 ,  H01L21/67103 ,  H01L21/68792

Abstract: Apparatus for processing a substrate are provided herein. In some embodiments, a substrate support includes a body having a support surface; an RF electrode disposed in the body proximate the support surface to receive RF current from an RF source; a shaft to support the body; a conductive element having an interior volume and extending through the shaft, wherein the conductive element is coupled to the RF electrode; and an RF gasket; wherein the conductive element includes features that engage the RF gasket to return the RF current to ground.

Abstract translation: 本文提供了用于处理基板的装置。 在一些实施例中，衬底支撑件包括具有支撑表面的本体; RF电极，设置在靠近支撑表面的本体中以从RF源接收RF电流; 轴支撑身体; 具有内部体积并延伸穿过所述轴的导电元件，其中所述导电元件耦合到所述RF电极; 和RF垫片; 其中所述导电元件包括​​接合所述RF垫圈以将所述RF电流返回地面的特征。