公开(公告)号：US20070013043A1

公开(公告)日：2007-01-18

申请号：US11302736

申请日：2005-12-13

Applicant: Yu-Tang Pan ,  Cheng-Ting Wu ,  Shih-Wen Chou ,  Hui-Ping Liu

Inventor： Yu-Tang Pan ,  Cheng-Ting Wu ,  Shih-Wen Chou ,  Hui-Ping Liu

IPC: H01L23/02

CPC classification number: H01L21/6835 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49534 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A chip package without a core, including a patterned circuit layer, a chip, a solder mask, a molding compound and multiple outer terminals, is provided. The patterned circuit layer has a first surface and a second surface opposite to each other. The chip disposed on the first surface is electrically connected to the patterned circuit layer. The solder mask disposed on the second surface has a plurality of first openings by which part of the patterned circuit layer is exposed. The molding compound with a plurality of through holes cover the pattern circuit layer and fix the chip onto the patterned circuit layer. Each outer terminal disposed in the through hole is electrically connected to the patterned circuit layer.

Abstract translation: 提供了不具有芯的芯片封装，包括图案化电路层，芯片，焊接掩模，模塑料和多个外部端子。 图案化电路层具有彼此相对的第一表面和第二表面。 布置在第一表面上的芯片电连接到图案化电路层。 设置在第二表面上的焊料掩模具有多个第一开口，图案化电路层的一部分露出。 具有多个通孔的成型复合物覆盖图形电路层，并将芯片固定在图案化电路层上。 布置在通孔中的每个外部端子电连接到图案化电路层。

公开(公告)号：US09004070B2

公开(公告)日：2015-04-14

申请号：US13540646

申请日：2012-07-03

Applicant: Mao-Tsun Wu ,  Chen Yang ,  Yen-Ni Hung ,  Hui-Ping Liu

Inventor： Mao-Tsun Wu ,  Chen Yang ,  Yen-Ni Hung ,  Hui-Ping Liu

IPC: A61M16/00 ,  A61M16/04

CPC classification number: A61M16/0465 ,  A61M16/0445 ,  A61M16/0459 ,  A61M16/0488 ,  A61M2202/0208 ,  A61M2202/0007

Abstract: A tracheotomy tube set is provided with a tracheotomy tube including: a cannula including a connecting member at a proximal end and a bellows member joining to the connecting member, a balloon cuff formed proximal to a distal end of the cannula, a first wing extending from one side of one end of the balloon cuff, a second wing extending from the other side of one end of the balloon cuff, a first wedge balloon formed between the first wing and an insertion section between the balloon cuff and the distal end of the cannula, an opposite second wedge balloon formed between the second wing and the insertion section, and a line having one end communicating with both the first and second wedge balloons; and a fixation device including a split flange, a hole through the split flange, and two slots formed at both sides of the fixation device respectively.

Abstract translation: 气管切开管组设置有气管切开管，其包括：套管，其包括在近端处的连接构件和连接到所述连接构件的波纹管构件，在所述套管的远端附近形成气囊，第一翼从 气球箍的一端的一侧，从气球箍的一端的另一侧延伸的第二翼，形成在第一翼与气囊和袖带的远端之间的插入部之间的第一楔形球囊 形成在所述第二翼和所述插入部之间的相对的第二楔形球囊以及具有与所述第一楔形球和所述第二楔形球两者相通的一端的线; 以及固定装置，其包括分割凸缘，穿过分割凸缘的孔和分别形成在固定装置两侧的两个槽。

公开(公告)号：US20140012174A1

公开(公告)日：2014-01-09

申请号：US13540659

申请日：2012-07-03

Applicant: Mao-Tsun Wu ,  Yen-Ni Hung ,  Chen Yang ,  Hui-Ping Liu

Inventor： Mao-Tsun Wu ,  Yen-Ni Hung ,  Chen Yang ,  Hui-Ping Liu

IPC: A61F13/02

CPC classification number: A61F13/025 ,  A61F13/0223 ,  A61F13/0226 ,  A61F13/0273 ,  A61F2013/00102 ,  A61F2013/0028 ,  A61F2013/00468 ,  A61F2013/00851

Abstract: An adhesive bandage is provided with a support cup having an annular marking formed on a periphery of an outer surface; a circular cushion member fitted in the support cup; a sliding cup; a sliding disc in the sliding cup and engaged the cushion member, the sliding disc being capable of sliding into the support cup; and a resilient main body including a transparent dome for concealing the sliding cup, the cushion member, the sliding disc, and the support cup, a first adhesive strip extending from a periphery of the dome; a second adhesive strip, opposite the first adhesive strip, extending from the periphery of the dome; a hook and loop fabric fastener on ends of the first and second adhesive strips.

Abstract translation: 粘合绷带设置有具有形成在外表面的周边上的环形标记的支撑杯; 安装在所述支撑杯中的圆形缓冲构件; 滑杯; 滑动杯中的滑动盘并且与缓冲构件接合，所述滑动盘能够滑动到所述支撑杯中; 以及弹性主体，其包括用于隐藏所述滑动杯，所述缓冲构件，所述滑动盘和所述支撑杯的透明圆顶，从所述圆顶的周边延伸的第一粘合带; 与第一粘合带相对的第二粘合带，从圆顶的周边延伸; 在第一和第二粘合剂条的端部上的钩和环织物紧固件。

公开(公告)号：US20100187692A1

公开(公告)日：2010-07-29

申请号：US12756377

申请日：2010-04-08

Applicant: Yu-Tang Pan ,  Cheng-Ting Wu ,  Shih-Wen Chou ,  Hui-Ping Liu

Inventor： Yu-Tang Pan ,  Cheng-Ting Wu ,  Shih-Wen Chou ,  Hui-Ping Liu

IPC: H01L23/498

CPC classification number: H01L21/6835 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49534 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A chip package including a base, a chip, a molding compound and a plurality of outer terminals is provided. The base is essentially consisted of a patterned circuit layer having a first surface and a second surface opposite to each other and a solder mask disposed on the second surface, wherein the solder mask has a plurality of first openings by which part of the patterned circuit layer is exposed. The chip is disposed on the first surface and is electrically connected to the patterned circuit layer. The molding compound covers the pattern circuit layer and fixes the chip onto the patterned circuit layer. The outer terminals are disposed in the first openings and electrically connected to the patterned circuit layer.

Abstract translation: 提供了包括基底，芯片，模塑料和多个外部端子的芯片封装。 该基底基本上由具有彼此相对的第一表面和第二表面的图案化电路层和设置在第二表面上的焊接掩模组成，其中该焊接掩模具有多个第一开口，通过该多个第一开口部分图案化电路层 被暴露。 芯片设置在第一表面上并且电连接到图案化电路层。 模塑料覆盖图案电路层并将芯片固定在图案化电路层上。 外部端子设置在第一开口中并电连接到图案化电路层。

公开(公告)号：US07436074B2

公开(公告)日：2008-10-14

申请号：US11302736

申请日：2005-12-13

Applicant: Yu-Tang Pan ,  Cheng-Ting Wu ,  Shih-Wen Chou ,  Hui-Ping Liu

Inventor： Yu-Tang Pan ,  Cheng-Ting Wu ,  Shih-Wen Chou ,  Hui-Ping Liu

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L21/6835 ,  H01L23/3128 ,  H01L23/4951 ,  H01L23/49534 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A chip package without a core, including a patterned circuit layer, a chip, a solder mask, a molding compound and multiple outer terminals, is provided. The patterned circuit layer has a first surface and a second surface opposite to each other. The chip disposed on the first surface is electrically connected to the patterned circuit layer. The solder mask disposed on the second surface has a plurality of first openings by which part of the patterned circuit layer is exposed. The molding compound with a plurality of through holes cover the pattern circuit layer and fix the chip onto the patterned circuit layer. Each outer terminal disposed in the through hole is electrically connected to the patterned circuit layer.

Abstract translation: 提供了不具有芯的芯片封装，包括图案化电路层，芯片，焊接掩模，模塑料和多个外部端子。 图案化电路层具有彼此相对的第一表面和第二表面。 布置在第一表面上的芯片电连接到图案化电路层。 设置在第二表面上的焊料掩模具有多个第一开口，图案化电路层的一部分露出。 具有多个通孔的成型复合物覆盖图形电路层，并将芯片固定在图案化电路层上。 布置在通孔中的每个外部端子电连接到图案化电路层。