公开(公告)号：US09068701B2

公开(公告)日：2015-06-30

申请号：US13358901

申请日：2012-01-26

Applicant: Curt Progl

Inventor： Curt Progl

IPC: F21V29/00 ,  F21K99/00 ,  F21Y111/00 ,  F21V3/00 ,  F21Y101/02 ,  F21V29/77

CPC classification number: F21V29/51 ,  F21K9/232 ,  F21K99/00 ,  F21V3/00 ,  F21V29/006 ,  F21V29/77 ,  F21V29/773 ,  F21V29/777 ,  F21Y2107/40 ,  F21Y2115/10

Abstract: LED based lamps and bulbs are disclosed that comprise an elevating element to arrange LEDs above the lamp or bulb base. The elevating element can at least partially comprise a thermally conductive material. A heat sink structure is included, with the elevating element thermally coupled to the heat sink structure. A diffuser can be arranged in relation to the LEDs so that at least some light from the LEDs passes through the diffuser and is dispersed into the desired emission pattern. In some lamps and bulbs utilize a heat pipe for the elevating elements, with heat from the LEDs conducting through the heat pipe to the heat sink structure where it can dissipate in the ambient.

Abstract translation: 公开了基于LED的灯和灯泡，其包括用于将LED布置在灯或灯泡基座上方的升降元件。 升降元件可以至少部分地包括导热材料。 包括散热器结构，其中升降元件热耦合到散热器结构。 扩散器可以相对于LED布置，使得来自LED的至少一些光通过扩散器并且被分散到期望的发射图案中。 在一些灯泡和灯泡中使用用于升降元件的热管，其中来自LED的热量通过热管传导到散热器结构，其中它可以在环境中消散。

公开(公告)号：US08878435B2

公开(公告)日：2014-11-04

申请号：US13358938

申请日：2012-01-26

Applicant: Randy Demuynck ,  Curt Progl

Inventor： Randy Demuynck ,  Curt Progl

IPC: H01J17/28

CPC classification number: F21V23/006 ,  F21K9/232 ,  F21K9/238 ,  F21V3/00 ,  F21V23/0457 ,  F21Y2115/10 ,  H05B33/0803 ,  H05B33/0872

Abstract: A thermal compensating circuit board (TCB) assembly comprising a substrate, the substrate comprising at least one thermal compensating circuit deposited thereon, the substrate devoid of a solid state emitter, and at least one electrical connector coupled to the at least one thermal compensating circuit, the connector configured to couple with a solid state emitter assembly and/or power supply. Lighting devices comprising the TCB assembly are provided.

Abstract translation: 一种热补偿电路板（TCB）组件，包括衬底，所述衬底包括沉积在其上的至少一个热补偿电路，没有固态发射极的衬底以及耦合到所述至少一个热补偿电路的至少一个电连接器， 所述连接器被配置为与固态发射器组件和/或电源耦合。 提供包括TCB组件的照明装置。

公开(公告)号：US08777463B2

公开(公告)日：2014-07-15

申请号：US13167387

申请日：2011-06-23

Applicant: Paul Pickard ,  Curt Progl

Inventor： Paul Pickard ,  Curt Progl

IPC: F21V21/00

CPC classification number: F21V29/004 ,  F21K9/233 ,  F21V7/0008 ,  F21V29/51 ,  F21V29/74 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106

Abstract: An assembly for use in a solid state directional lamp is disclosed. The assembly includes a multilayer FR4 printed circuit board and a metal heat spreader assembled with the multilayer FR4 printed circuit board. The assembly is configured to mount a plurality of solid state light emitters. The multilayer FR4 printed circuit board defines an aperture and a least a portion of the metal heat spreader is positioned in the aperture of the multilayer FR4 printed circuit board. The portion of the heat spreader positioned in the aperture of the multilayer FR4 printed circuit board is in communication with heat dissipation means.

Abstract translation: 公开了一种用于固态定向灯的组件。 组件包括多层FR4印刷电路板和与多层FR4印刷电路板组装的金属散热器。 组件被配置成安装多个固态发光器。 多层FR4印刷电路板限定孔，并且金属散热器的至少一部分位于多层FR4印刷电路板的孔中。 位于多层FR4印刷电路板的孔中的散热器的部分与散热装置连通。

公开(公告)号：US20130113358A1

公开(公告)日：2013-05-09

申请号：US13607300

申请日：2012-09-07

Applicant: CURT PROGL ,  Praneet Athalye ,  Gerald Negley

Inventor： CURT PROGL ,  Praneet Athalye ,  Gerald Negley

IPC: F21V29/00

CPC classification number: F21V29/004 ,  F21K9/232 ,  F21V3/04 ,  F21V15/02 ,  F21V29/006 ,  F21V29/505 ,  F21V29/506 ,  F21V29/51 ,  F21V29/58 ,  F21V29/77 ,  F21V29/85 ,  F21V29/86 ,  F21V29/87 ,  F21V29/89 ,  F21Y2115/10

Abstract: LED based lamps and bulbs are disclosed that comprise an elevating element to arrange. LEDs above the lamp or bulb base. The elevating element can at least partially comprise a thermally conductive material. A heat sink structure is included, with the elevating element thermally coupled to the heat sink structure. A diffuser can be arranged in relation to the LEDs so at least some light from the LEDs passes through the diffuser and is dispersed into the desired emission pattern. Some lamps and bulbs utilize a heat pipe for the elevating elements, with heat from the LEDs conducting through the heat pipe to the heat sink structure where it can dissipate in the ambient. The LED lamps can include other features to aid in thermal management and to produce the desired emission pattern, such as internal optically transmissive and thermally conductive materials, and heat sinks with different heat fin arrangements.

Abstract translation: 公开了基于LED的灯和灯泡，其包括用于布置的升降元件。 LED或灯泡基座上方的LED。 升降元件可以至少部分地包括导热材料。 包括散热器结构，其中升降元件热耦合到散热器结构。 扩散器可以相对于LED布置，使得来自LED的至少一些光通过扩散器并且被分散到期望的发射图案中。 一些灯泡和灯泡利用用于升降元件的热管，其中来自LED的热量通过热管传导到散热器结构，在那里可以在环境中消散。 LED灯可以包括其他特征以帮助热管理并产生期望的发射图案，例如内部透光和导热材料，以及具有不同散热片布置的散热器。

公开(公告)号：US09322543B2

公开(公告)日：2016-04-26

申请号：US13467670

申请日：2012-05-09

Applicant: Christopher P. Hussell ,  John Adam Edmond ,  Gerald H. Negley ,  Curt Progl ,  Mark Edmond ,  Praneet Athalye

Inventor： Christopher P. Hussell ,  John Adam Edmond ,  Gerald H. Negley ,  Curt Progl ,  Mark Edmond ,  Praneet Athalye

IPC: F21V29/00 ,  H05K13/00 ,  F21V29/65 ,  F21K99/00 ,  F21V3/04 ,  H01K1/00 ,  F21V29/60 ,  F21V29/85 ,  F21Y101/02 ,  F21Y111/00 ,  F21V29/506 ,  F21V29/63 ,  F21V29/67

CPC classification number: F21V29/65 ,  F21K9/232 ,  F21V3/10 ,  F21V29/506 ,  F21V29/60 ,  F21V29/63 ,  F21V29/67 ,  F21V29/85 ,  F21Y2107/00 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01K1/00 ,  Y10T29/49002

Abstract: A gas cooled LED lamp and submount is disclosed. The centralized nature of the LEDs allows the LEDs to be configured near the central portion of the optical envelope of the lamp. In example embodiments, the LEDs can be cooled and/or cushioned by a gas in thermal communication with the LED array to enable the LEDs to maintain an appropriate operating temperature for efficient operation and long life. In some embodiments, the LED assembly is mounted on a glass stem. In some embodiments a thermal resistant path is created that prevents overtemperature of the LED array during the making of the lamp. In some embodiments the LED assembly comprises a lead frame and/or metal core board that is bent into a three-dimensional shape to create a desired light pattern in the enclosure or an extruded submount formed into a three-dimensional shape.

Abstract translation: 公开了一种气体冷却的LED灯和底座。 LED的集中性使得LED可以配置在灯的光学外壳的中心部分附近。 在示例性实施例中，可以通过与LED阵列热连通的气体来冷却和/或缓冲LED，以使得LED能够保持适当的操作温度以有效地操作和长寿命。 在一些实施例中，LED组件安装在玻璃杆上。 在一些实施例中，产生耐热路径，其防止在制造灯时LED阵列的过热。 在一些实施例中，LED组件包括引导框架和/或金属芯板，其被弯曲成三维形状以在外壳中产生期望的光图案或形成为三维形状的挤压式基座。

公开(公告)号：US09234655B2

公开(公告)日：2016-01-12

申请号：US13607300

申请日：2012-09-07

Applicant: Curt Progl ,  Praneet Athalye ,  Gerald Negley

Inventor： Curt Progl ,  Praneet Athalye ,  Gerald Negley

IPC: F21V29/00 ,  F21K99/00 ,  F21V3/04 ,  F21V15/02 ,  F21V29/505 ,  F21V29/77 ,  F21V29/85 ,  F21V29/87 ,  F21V29/89 ,  F21Y101/02 ,  F21V29/506 ,  F21V29/58

CPC classification number: F21V29/004 ,  F21K9/232 ,  F21V3/04 ,  F21V15/02 ,  F21V29/006 ,  F21V29/505 ,  F21V29/506 ,  F21V29/51 ,  F21V29/58 ,  F21V29/77 ,  F21V29/85 ,  F21V29/86 ,  F21V29/87 ,  F21V29/89 ,  F21Y2115/10

Abstract: LED based lamps and bulbs are disclosed that comprise an elevating element to arrange LEDs above the lamp or bulb base. The elevating element can at least partially comprise a thermally conductive material. A heat sink structure is included, with the elevating element thermally coupled to the heat sink structure. A diffuser can be arranged in relation to the LEDs so at least some light from the LEDs passes through the diffuser and is dispersed into the desired emission pattern. Some lamps and bulbs utilize a heat pipe for the elevating elements, with heat from the LEDs conducting through the heat pipe to the heat sink structure where it can dissipate in the ambient. The LED lamps can include other features to aid in thermal management and to produce the desired emission pattern, such as internal optically transmissive and thermally conductive materials, and heat sinks with different heat fin arrangements.

Abstract translation: 公开了基于LED的灯和灯泡，其包括用于将LED布置在灯或灯泡基座上方的升降元件。 升降元件可以至少部分地包括导热材料。 包括散热器结构，其中升降元件热耦合到散热器结构。 扩散器可以相对于LED布置，使得来自LED的至少一些光通过扩散器并且被分散到期望的发射图案中。 一些灯泡和灯泡利用用于升降元件的热管，其中来自LED的热量通过热管传导到散热器结构，在那里可以在环境中消散。 LED灯可以包括其他特征以帮助热管理并产生期望的发射图案，例如内部透光和导热材料，以及具有不同散热片布置的散热器。

公开(公告)号：US20130271987A1

公开(公告)日：2013-10-17

申请号：US13467670

申请日：2012-05-09

Applicant: Christopher P. Hussell ,  John Adam Edmond ,  Gerald H. Negley ,  Curt Progl ,  Mark Edmond ,  Praneet Athalye

Inventor： Christopher P. Hussell ,  John Adam Edmond ,  Gerald H. Negley ,  Curt Progl ,  Mark Edmond ,  Praneet Athalye

IPC: F21V29/00 ,  H05K13/00

CPC classification number: F21V29/65 ,  F21K9/232 ,  F21V3/10 ,  F21V29/506 ,  F21V29/60 ,  F21V29/63 ,  F21V29/67 ,  F21V29/85 ,  F21Y2107/00 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01K1/00 ,  Y10T29/49002

Abstract: A gas cooled LED lamp and submount is disclosed. The centralized nature of the LEDs allows the LEDs to be configured near the central portion of the optical envelope of the lamp. In example embodiments, the LEDs can be cooled and/or cushioned by a gas in thermal communication with the LED array to enable the LEDs to maintain an appropriate operating temperature for efficient operation and long life. In some embodiments, the LED assembly is mounted on a glass stem. In some embodiments a thermal resistant path is created that prevents overtemperature of the LED array during the making of the lamp. In some embodiments the LED assembly comprises a lead frame and/or metal core board that is bent into a three-dimensional shape to create a desired light pattern in the enclosure or an extruded submount formed into a three-dimensional shape.

Abstract translation: 公开了一种气体冷却的LED灯和底座。 LED的集中性使得LED可以配置在灯的光学外壳的中心部分附近。 在示例性实施例中，可以通过与LED阵列热连通的气体来冷却和/或缓冲LED，以使得LED能够保持适当的操作温度以有效地操作和长寿命。 在一些实施例中，LED组件安装在玻璃杆上。 在一些实施例中，产生耐热路径，其防止在制造灯时LED阵列的过热。 在一些实施例中，LED组件包括引导框架和/或金属芯板，其被弯曲成三维形状以在外壳中产生期望的光图案或形成为三维形状的挤压式基座。

公开(公告)号：US20130193850A1

公开(公告)日：2013-08-01

申请号：US13358938

申请日：2012-01-26

Applicant: RANDY DEMUYNCK ,  CURT PROGL

Inventor： RANDY DEMUYNCK ,  CURT PROGL

IPC: H05B37/02

CPC classification number: F21V23/006 ,  F21K9/232 ,  F21K9/238 ,  F21V3/00 ,  F21V23/0457 ,  F21Y2115/10 ,  H05B33/0803 ,  H05B33/0872

Abstract: A thermal compensating circuit board (TCB) assembly comprising a substrate, the substrate comprising at least one thermal compensating circuit deposited thereon, the substrate devoid of a solid state emitter, and at least one electrical connector coupled to the at least one thermal compensating circuit, the connector configured to couple with a solid state emitter assembly and/or power supply. Lighting devices comprising the TCB assembly are provided.

Abstract translation: 一种热补偿电路板（TCB）组件，包括衬底，所述衬底包括沉积在其上的至少一个热补偿电路，没有固态发射极的衬底以及耦合到所述至少一个热补偿电路的至少一个电连接器， 所述连接器被配置为与固态发射器组件和/或电源耦合。 提供包括TCB组件的照明装置。

公开(公告)号：USD676159S1

公开(公告)日：2013-02-12

申请号：US29401648

申请日：2011-09-14

Applicant: Long Larry Le ,  Curt Progl ,  William L. Dungan

Designer： Long Larry Le ,  Curt Progl ,  William L. Dungan

公开(公告)号：US20130016508A1

公开(公告)日：2013-01-17

申请号：US13182017

申请日：2011-07-13

Applicant: CURT PROGL ,  MARK DIXON

Inventor： CURT PROGL ,  MARK DIXON

IPC: F21V7/00 ,  F21V29/00 ,  B23P11/00 ,  F21V15/01

CPC classification number: F21V3/02 ,  F21V5/04 ,  F21V29/506 ,  F21V29/74 ,  F21V29/83 ,  F21Y2107/30 ,  F21Y2115/10 ,  Y10T29/49826

Abstract: A variable thickness globe for a lighting device comprises a wall including a curved outer surface and an inner surface. A thickness of the wall between the curved outer surface and the inner surface varies over a predetermined extent of the wall.

Abstract translation: 用于照明装置的可变厚度球体包括包括弯曲外表面和内表面的壁。 弯曲的外表面和内表面之间的壁的厚度在壁的预定范围内变化。