公开(公告)号：US09225115B2

公开(公告)日：2015-12-29

申请号：US13913337

申请日：2013-06-07

Applicant: Apple Inc.

Inventor： Shayan Malek ,  Astoush Y. Shukla ,  Michael B. Wittenberg

IPC: H01R13/62 ,  H01R13/639 ,  H01R43/26 ,  H01R12/70 ,  H01R12/79 ,  H05K3/36

CPC classification number: H01R13/639 ,  H01R12/7047 ,  H01R12/79 ,  H01R43/26 ,  H05K3/365 ,  H05K2201/09063 ,  H05K2203/167 ,  Y10T29/49126

Abstract: Board-to-board connectors that consume a minimal amount of board area, are simple to assemble, and provide a clear indication that a proper connection has been made. One example may consume minimal area, since only a retention key and slots in boards and connectors are needed. The connector may be simple to assemble since it may be as simple as stacking components, pushing down, and turning a retention key. Further, a first and a first line on a key and a cowling may be aligned after assembly to provide a clear indication that the connector has been properly assembled.

Abstract translation: 消耗最少电路板面积的板对板连接器组装简单，并提供了正确连接的明确指示。 一个示例可能消耗最小的面积，因为仅需要保留键和板和连接器中的插槽。 连接器可以容易组装，因为其可以像堆叠部件一样简单，向下推动和转动保持键。 此外，钥匙和整流罩上的第一线和第一线可以在组装之后对准，以提供连接器已被正确组装的清楚指示。

公开(公告)号：US08952272B2

公开(公告)日：2015-02-10

申请号：US13631236

申请日：2012-09-28

Applicant: Apple Inc.

Inventor： Shayan Malek ,  Scott A. Myers ,  Michael B. Wittenberg

IPC: H05K9/00

CPC classification number: H05K9/0032

Abstract: One embodiment of a molded shield can include a cavity to conform to and receive an electrical component, a slit to conform to and receive a metal frame and a metal layer coupled to the top and lateral sides of the molded shield. In one embodiment, the molded shield can be formed from silicon and can include material to enhance electrical conductivity. The molded shield can couple to the metal frame which in turn can be coupled to ground with the resulting configuration acting to reduce electrical emissions. The molded shield can transfer heat away from the electrical component through conduction.

Abstract translation: 模制屏蔽件的一个实施例可以包括符合并接收电气部件的空腔，适合和接收金属框架的狭缝以及耦合到模制屏蔽件的顶侧和侧面的金属层。 在一个实施例中，模制的屏蔽可以由硅形成，并且可以包括用于增强导电性的材料。 模制的屏蔽件可以耦合到金属框架，金属框架又可以耦合到地面，所得到的结构用于减少电气排放。 模制的屏蔽件可以通过传导将热量从电气部件传送出去。

公开(公告)号：US08794775B2

公开(公告)日：2014-08-05

申请号：US13628773

申请日：2012-09-27

Applicant: Apple Inc.

Inventor： Lee E. Hooton ,  Michael B. Wittenberg ,  Shayan Malek

IPC: G03B15/03

CPC classification number: G03B15/02 ,  G03B2215/0567

Abstract: An electronic device may be provided with an electronic component such as a camera light source containing a light-emitting diode. During operation, the light-emitting diode may produce heat. Thermally conducting elastomeric structures may have features such as sidewalls that mate with external surface of the camera light source or other electronic component to dissipate heat from the electronic component. Metal structures such as a bracket may be used to press the elastomeric structures and the electronic component towards a wall of a housing for the electronic device. Support structures may be interposed between the wall of the housing and the elastomeric structures. The support structures may have an opening that is aligned with an opening in the housing wall. Insert structures may be received within the opening in the support structures. The electronic component may be aligned with the insert structures and the opening in the support structures.

Abstract translation: 电子设备可以设置有诸如包含发光二极管的照相机光源的电子部件。 在操作期间，发光二极管可能产生热量。 导热弹性体结构可具有诸如与相机光源或其他电子部件的外表面相配合以散发来自电子部件的热量的侧壁的特征。 诸如支架的金属结构可用于将弹性体结构和电子部件朝向用于电子装置的壳体的壁挤压。 支撑结构可以插入在壳体的壁和弹性体结构之间。 支撑结构可以具有与壳体壁中的开口对准的开口。 插入结构可以被容纳在支撑结构内的开口内。 电子部件可以与插入结构和支撑结构中的开口对准。

公开(公告)号：US20140177180A1

公开(公告)日：2014-06-26

申请号：US13726509

申请日：2012-12-24

Applicant: APPLE INC.

Inventor： Shayan Malek ,  Michael B. Wittenberg ,  Sawyer I. Cohen ,  Ashutosh Y. Shukla

IPC: H05K1/02 ,  H05K1/11 ,  H05K13/00 ,  H05K9/00

CPC classification number: H05K1/0219 ,  H01R12/79 ,  H01R13/6595 ,  H05K3/363 ,  H05K3/368 ,  H05K7/142 ,  H05K9/0022 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10409 ,  Y10T29/49126

Abstract: Electrical components in an electronic device are mounted on substrates such as printed circuits. Printed circuits contain signal paths formed from metal traces. The signal lines in the signal paths of the printed circuits are coupled together using electrical connection structures such as printed circuit board-to-board connectors, contacts joined by anisotropic conductive film, or contacts joined using solder. Electrical connection structures may be surrounded by conductive resilient ring-shaped structures such as conductive foam structures or spring structures. The conductive foam structures may be provided with a metal layer with which the conductive foam structures are soldered to a ring of metal on a printed circuit. Strain relief structures may be formed from an elastomeric ring that surrounds the electrical connection structures or an overmolded plastic structure. Coating layers and conductive plastic may be used in providing strain relief structures with electromagnetic interference shielding capabilities.

Abstract translation: 电子设备中的电气部件安装在诸如印刷电路的基板上。 印刷电路包含由金属迹线形成的信号路径。 印刷电路的信号路径中的信号线通过诸如印刷电路板对板连接器，由各向异性导电膜连接的触点或使用焊料连接的触点之类的电连接结构耦合在一起。 电连接结构可以由诸如导电泡沫结构或弹簧结构的导电弹性环形结构围绕。 导电泡沫结构可以设置有金属层，导电泡沫结构通过该金属层焊接到印刷电路上的金属环。 应变消除结构可以由围绕电连接结构或包覆成型的塑料结构的弹性体环形成。 涂层和导电塑料可用于提供具有电磁干扰屏蔽能力的应变消除结构。

公开(公告)号：US20140113475A1

公开(公告)日：2014-04-24

申请号：US13913337

申请日：2013-06-07

Applicant: Apple Inc.

Inventor： Shayan Malek ,  Ashutoshl Y. Shukla ,  Michael B. Wittenberg

IPC: H01R13/639 ,  H05K3/36 ,  H01R43/26

CPC classification number: H01R13/639 ,  H01R12/7047 ,  H01R12/79 ,  H01R43/26 ,  H05K3/365 ,  H05K2201/09063 ,  H05K2203/167 ,  Y10T29/49126

Abstract: Board-to-board connectors that consume a minimal amount of board area, are simple to assemble, and provide a clear indication that a proper connection has been made. One example may consume minimal area, since only a retention key and slots in boards and connectors are needed. The connector may be simple to assemble since it may be as simple as stacking components, pushing down, and turning a retention key. Further, a first and a first line on a key and a cowling may be aligned after assembly to provide a clear indication that the connector has been properly assembled.

Abstract translation: 消耗最少电路板面积的板对板连接器组装简单，并提供了正确连接的明确指示。 一个示例可能消耗最小的面积，因为仅需要保留键和板和连接器中的插槽。 连接器可以容易组装，因为其可以像堆叠部件一样简单，向下推动和转动保持键。 此外，钥匙和整流罩上的第一线和第一线可以在组装之后对准，以提供连接器已被正确组装的清楚指示。