公开(公告)号：US10984733B2

公开(公告)日：2021-04-20

申请号：US16854920

申请日：2020-04-22

Applicant: Novatek Microelectronics Corp.

Inventor： Chung-Wen Wu ,  Wen-Chi Lin ,  Jiun-Yi Lin

IPC: G09G3/34 ,  G09G3/36

Abstract: A circuit arrangement for controlling a backlight source and an operation method are provided. The circuit arrangement includes a generator. The generator receives a sync signal and generates a pulse width modulation signal synchronous with the sync signal to control the backlight source. The sync signal indicates a frequency of a video including a series of image frames. The sync signal includes a sync period corresponding to a frame of the video. The pulse width modulation signal includes a first waveform pattern in a first sub-period of the sync period and a second waveform pattern in a second sub-period of the sync period. Each of the first waveform pattern and the second waveform pattern includes at least one active pulse. The first waveform pattern is substantially identical to the second waveform pattern.

公开(公告)号：US20210110131A1

公开(公告)日：2021-04-15

申请号：US17037665

申请日：2020-09-30

Applicant: Novatek Microelectronics Corp.

Inventor： Wu-Wei Lin ,  Cheng-Hsun Chan

IPC: G06K9/00 ,  H01L27/146

Abstract: A fingerprint recognition apparatus including a frontplane, a backplane and a display medium layer is provided. The frontplane includes an upper substrate, a black matrix layer and a color filter layer. The black matrix layer is disposed on the upper substrate, and the color filter layer is disposed on the black matrix layer. The black matrix layer includes a plurality of pixel apertures and a plurality of first apertures. The backplane includes a lower substrate and a sensor layer. The sensor layer includes a plurality of photo sensing elements. The photo sensing elements are configured to receive reflected lights from an object through the first apertures of the black matrix layer. Areas of the photo sensing elements are overlapped with the first apertures in a longitudinal direction. The display medium layer is disposed between the frontplane and the backplane.

公开(公告)号：US10971110B2

公开(公告)日：2021-04-06

申请号：US16550382

申请日：2019-08-26

Applicant: NOVATEK MICROELECTRONICS CORP.

Inventor： Chih-Peng Nien ,  Chien-Wen Lin

IPC: G09G5/00 ,  G09G5/14 ,  H04N7/10

Abstract: A circuit for use in a first display device to facilitate communication with a second display device is provided. The first display device and the second display device each include a connector compliant with a digital display interface standard. The circuit includes a digital display interface circuit and a control unit. The digital display interface circuit is used for transmission or receiving of video data according to the digital display interface standard, the digital display interface circuit for being connected to the connector of the first display device. The control unit is configured to transmit at least one first communication signal through at least one first pin of the connector of the first display device to communicate with the second display device, wherein the at least one first communication signal is non-standard with respect to the digital display interface standard.

公开(公告)号：US10970512B2

公开(公告)日：2021-04-06

申请号：US16424506

申请日：2019-05-29

Applicant: NOVATEK Microelectronics Corp.

Inventor： Jung-Chen Chung ,  Chi-Ting Chen

IPC: G06K9/00 ,  G06K9/20

Abstract: A fingerprint sensing apparatus having a large-area sensing mechanism is provided that includes at least three optical fingerprint sensing circuits and a processing circuit. The at least three optical fingerprint sensing circuits are configured to perform sensing within a plurality of sensing areas to obtain a plurality of sensed images, wherein each of the sensing areas corresponds to one of the optical fingerprint sensing circuits. The processing circuit is electrically coupled to the optical fingerprint sensing circuits to receive the sensed images and is configured to splice the sensed images together to form an integrated sensed image.

公开(公告)号：US20210098345A1

公开(公告)日：2021-04-01

申请号：US16988741

申请日：2020-08-10

Applicant: Novatek Microelectronics Corp.

Inventor： Chiao-Ling Huang ,  Tai-Hung Lin

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L23/12

Abstract: A chip on film package includes a base film, a patterned circuit layer, a chip and a reinforcing sheet. The base film includes a first surface, a second surface opposite to the first surface and a mounting region located on the first surface. The patterned circuit layer is disposed on the first surface. The chip is mounted on the mounting region and electrically connected to the patterned circuit layer. The reinforcing sheet is disposed on the first surface and/or the second surface and exposes the chip, wherein a flexibility of the reinforcing sheet is substantially equal to or greater than a flexibility of the base film.

公开(公告)号：US20210097318A1

公开(公告)日：2021-04-01

申请号：US17015085

申请日：2020-09-09

Applicant: NOVATEK Microelectronics Corp.

Inventor： Jung-Chen Chung ,  Jen-Yi Lin ,  Min Huang

IPC: G06K9/20 ,  H04N5/378 ,  G06K9/00

Abstract: An image sensing circuit includes a plurality of readout circuits and a pre-charge control circuit. Each of the readout circuits is coupled to a sensing line among a plurality of sensing lines and configured to receive a sensing voltage among a plurality of sensing voltages through the corresponding sensing line, wherein at least one of the readout circuits is further configured to receive at least one first pre-scan voltage through the corresponding sensing line prior to reception of the sensing voltage. The pre-charge control circuit, coupled to the readout circuits, is configured to perform a plurality of steps. The steps include receiving the at least one first pre-scan voltage from the at least one readout circuit; calculating a first pre-charge voltage according to the at least one first pre-scan voltage; and pre-charging the sensing lines to the first pre-charge voltage before the readout circuits receive the sensing voltages.

公开(公告)号：US20210090498A1

公开(公告)日：2021-03-25

申请号：US16576776

申请日：2019-09-20

Applicant: Novatek Microelectronics Corp.

Inventor： Chih-Yuan Chang ,  Feng-Lin Chan

IPC: G09G3/3233 ,  H03F3/393

Abstract: A sensing circuit of a display device is provided. The sensing circuit includes a chopper circuit, a first operational amplifier and a filter. The chopper circuit is configured to receive a sensing input signal of the display device and modulate the sensing input signal. The first operational amplifier is coupled to the chopper circuit. The first operational amplifier is configured to receive the modulated sensing input signal and output the modulated sensing input signal to the chopper circuit. The chopper circuit is further configured to demodulate the modulated sensing input signal from the first operational amplifier and output the demodulated sensing input signal. The filter is coupled to the chopper circuit. The filter is configured to filter the demodulated sensing input signal from the chopper circuit and output the filtered sensing input signal as a sensing output signal. A source driver including the sensing circuit is also provided.

公开(公告)号：US20210076463A1

公开(公告)日：2021-03-11

申请号：US16562457

申请日：2019-09-06

Applicant: NOVATEK Microelectronics Corp.

Inventor： Hsiang-Yi CHIU

IPC: H05B33/08

Abstract: A driving circuit, for providing a driving current to a light emitting diode, includes a PWM demodulator, a current source and a local clock generator. The PWM demodulator is configured to sample a PWM input signal in reference with a local clock signal and generate a brightness code according to a duty ratio of the PWM input signal. The current source is coupled with the PWM demodulator and the light emitting diode. The current source is configured to generate the driving current with a current amplitude according to the brightness code. The local clock generator is configured to generate the local clock signal according to a global clock signal during a first cycle period of successive cycle periods of the PWM input signal. The local clock generator suspends oscillation of the local clock signal during a second cycle period of the successive cycle periods of the PWM input signal.

公开(公告)号：US20210074228A1

公开(公告)日：2021-03-11

申请号：US16581780

申请日：2019-09-25

Applicant: NOVATEK Microelectronics Corp.

Inventor： Hongchun CONG ,  Jian-Hua LIANG ,  Xiao ZHANG

IPC: G09G3/36 ,  G09G3/34 ,  G02F1/1335 ,  G02F1/1347

Abstract: A dual cell LCD apparatus that includes a LCD display panel, a backlight circuit and a dual cell LCD control circuit. The LCD display panel includes a back cell and a front cell. The dual cell LCD control circuit includes a back cell control circuit, a backlight control circuit and a front cell control circuit. The back cell control circuit retrieves a plurality of luminance and color parameters of a display frame data to further generate back cell control parameters to control the back cell layer. The backlight control circuit performs a statistics analysis of the display frame data according to the luminance and color parameters to further generate a plurality of duty parameters to control the backlight circuit. The front cell control circuit performs an intensity compensation on the front cell according to the luminance and color parameters, the duty parameters and the display frame data.

公开(公告)号：US10937713B2

公开(公告)日：2021-03-02

申请号：US16005710

申请日：2018-06-12

Applicant: Novatek Microelectronics Corp.

Inventor： Chun-Yu Liao ,  Teng-Jui Yu ,  Jr-Ching Lin

IPC: H01L23/50 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H01L23/00

Abstract: A chip on film package is disclosed, including a flexible film, a patterned circuit layer, a chip, and a dummy metal layer. The flexible film includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The chip is mounted on the first surface and electrically connected to the patterned circuit layer. The dummy metal layer covers the second surface capable of dissipating heat of the chip. The dummy metal layer is electrically insulated from the patterned circuit layer.