ELECTRONIC DEVICES WITH STRUCTURAL GLASS MEMBERS

    公开(公告)号:US20250123653A1

    公开(公告)日:2025-04-17

    申请号:US19002723

    申请日:2024-12-27

    Applicant: Apple Inc.

    Abstract: Electronic devices may be provided having internal components mounted to a structural glass support member. The structural glass support member may have a planar front surface that forms a front surface of the device. The structural glass support member may have bent portions that form sidewall surfaces of the device. Portions of the structural glass support member may form a transparent display cover layer. A rigid or flexible display may be mounted to the structural glass support member. Additional internal device components may be mounted to the display. A thin enclosure for enclosing the internal components in the device may be mounted to the structural glass support member. The thin enclosure may be mounted to the structural glass support member using a peripheral member. The thin enclosure may be free from attachments to internal components or may be adhesively bonded to one or more internal components.

    Systems With Cover Layer Sealing Structures
    146.
    发明公开

    公开(公告)号:US20240264449A1

    公开(公告)日:2024-08-08

    申请号:US18391247

    申请日:2023-12-20

    Applicant: Apple Inc.

    Abstract: A head-mounted device may have a head-mounted support structure. Rear-facing displays may present images to eye boxes at the rear of the head-mounted support structure. A forward-facing publicly viewable display may be supported on a front side of the head-mounted support structure facing away from the rear-facing displays. The forward-facing display may have pixels that form an active area in which images are displayed and may have a ring-shaped inactive border area that surrounds the pixels. A cover layer may cover the forward-facing display and other optical components. The cover layer may have laminates on front and rear surfaces. To protect an edge surface of the cover layer, encapsulation material may be provided on the edge surface or may otherwise separate the edge surface from an exterior of the device.

    Shared data and collaboration for head-mounted devices

    公开(公告)号:US12001751B2

    公开(公告)日:2024-06-04

    申请号:US18214448

    申请日:2023-06-26

    Applicant: Apple Inc.

    CPC classification number: G06F3/147 G06F3/012 G06F3/017 G06V20/20 H04N23/90

    Abstract: A system can include head-mounted devices that collaborate to process views from cameras of the respective head-mounted devices and identify objects from different perspectives and/or objects that are within the view of only one of the head-mounted devices. Sharing sensory input between multiple head-mounted devices can complement and enhance individual units by interpreting and reconstructing objects, surfaces, and/or an external environment with perceptive data from multiple angles and positions, which also reduces occlusions and inaccuracies. As more detailed information is available at a specific moment in time, the speed and accuracy of object recognition, hand and body tracking, surface mapping, and/or digital reconstruction can be improved. Such collaboration can provide more effective and efficient mapping of space, surfaces, objects, gestures and users.

    Electronic devices with structural glass members

    公开(公告)号:US11768517B2

    公开(公告)日:2023-09-26

    申请号:US17748958

    申请日:2022-05-19

    Applicant: Apple Inc.

    CPC classification number: G06F1/1626

    Abstract: Electronic devices may be provided having internal components mounted to a structural glass support member. The structural glass support member may have a planar front surface that forms a front surface of the device. The structural glass support member may have bent portions that form sidewall surfaces of the device. Portions of the structural glass support member may form a transparent display cover layer. A rigid or flexible display may be mounted to the structural glass support member. Additional internal device components may be mounted to the display. A thin enclosure for enclosing the internal components in the device may be mounted to the structural glass support member. The thin enclosure may be mounted to the structural glass support member using a peripheral member. The thin enclosure may be free from attachments to internal components or may be adhesively bonded to one or more internal components.

Patent Agency Ranking