公开(公告)号：US10051355B2

公开(公告)日：2018-08-14

申请号：US15036678

申请日：2014-09-11

Applicant: Robert Bosch GmbH

Inventor： Jochen Zoellin ,  Ricardo Ehrenpfordt ,  Christoph Schelling

IPC: H04R3/00 ,  H04R19/04 ,  H04R1/04 ,  H05K1/18 ,  H04R31/00 ,  H05K1/02 ,  H05K1/11

Abstract: Measures are described by which the back volume of a microphone component can be realized regardless of its packaging. Within the framework of a microphone module, a circuit board is used for the 2nd-level mounting of at least one microphone component part, in whose surface at least one connection opening is formed, which terminates in a cavity in the layer structure of the circuit board. In addition, the circuit board surface having the connection opening is configured for a sealing mounting of the microphone component part above the connection opening, so that the microphone component is acoustically connected to the cavity in the circuit board via the connection opening in the circuit board surface, and this cavity functions as backside volume for the microphone component part.

公开(公告)号：US10011479B2

公开(公告)日：2018-07-03

申请号：US14314624

申请日：2014-06-25

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling ,  Yvonne Bergmann ,  Jochen Reinmuth

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00158 ,  B81B3/0021 ,  B81B2201/0257

Abstract: For simplifying the manufacture of a MEMS structural component including a deflectable diaphragm which spans an opening in the rear side of the structural component, and including a fixed counter-element, which is provided with passage openings, the counter-element from the base substrate of the MEMS structural component is patterned and the deflectable diaphragm is implemented in a layered structure on the base substrate. These measures are intended to improve the diaphragm properties and reduce the overall height of the MEMS structural component.

公开(公告)号：US20170247246A1

公开(公告)日：2017-08-31

申请号：US15506068

申请日：2015-06-23

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling ,  Benedikt Stein ,  Michael Stumber

IPC: B81B3/00

CPC classification number: B81B3/0086 ,  B81B2201/01 ,  B81B2201/0228 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0136 ,  B81C1/00801

Abstract: A layer material which is particularly suitable for the realization of self-supporting structural elements having an electrode in the layer structure of a MEMS component. The self-supporting structural element is at least partially made up of a silicon carbonitride (Si1-x-yCxNy)-based layer.

公开(公告)号：US09451366B2

公开(公告)日：2016-09-20

申请号：US14257558

申请日：2014-04-21

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling ,  Stefan Singer ,  Jochen Zoellin

IPC: H01L29/84 ,  H04R19/04 ,  H04R19/00

CPC classification number: H04R19/005 ,  B81B7/0041 ,  B81B2201/0257 ,  H01L29/84 ,  H04R19/04 ,  H04R2201/003

Abstract: Measures are provided for increasing the resistance to compression of a component having a micromechanical microphone pattern. In particular, the robustness of the microphone pattern to highly dynamic pressure fluctuations is to be increased, without the microphone sensitivity, i.e. the microphone performance, being impaired. The microphone pattern of such a component is implemented in a layer construction on a semiconductor substrate and includes at least one acoustically active diaphragm, which spans a sound hole on the substrate backside, and a stationary acoustically penetrable counterelement having through hole openings, which is situated above/below the diaphragm in the layer construction. At least one outflow channel is developed which makes possible a rapid pressure equalization between the two sides of the diaphragm. In addition, at least one controllable closing element is provided, with which the at least one outflow channel is optionally able to be opened or closed.

Abstract translation: 提供了用于增加具有微机械麦克风图案的部件的压缩阻力的措施。 特别地，麦克风图案对于高动态压力波动的鲁棒性将被增加，而麦克风灵敏度（即麦克风性能）受损。 这种部件的麦克风图案以半导体衬底上的层结构实现，并且包括跨越衬底背面上的声孔的至少一个声学活动隔膜和具有通孔开口的固定的声学可穿透的反应体 在隔膜的上方/下方的层结构。 至少有一个流出通道可以在隔膜的两侧之间进行快速的压力平衡。 此外，提供了至少一个可控制的关闭元件，至少一个流出通道可选地能够通过该开闭元件打开或关闭。

公开(公告)号：US09416000B2

公开(公告)日：2016-08-16

申请号：US14731666

申请日：2015-06-05

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling ,  Ralf Reichenbach ,  Jens Frey ,  Antoine Puygranier

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0041 ,  B81B2203/0315 ,  B81C1/00269 ,  B81C1/00285 ,  B81C1/00293 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/037

Abstract: To implement cavities having different internal pressures in joining two semiconductor elements, at least one of the two element surfaces to be joined is structured, so that at least one circumferential bonding frame area is recessed or elevated in comparison with at least one other circumferential bonding frame area. At least one connecting layer should then be applied to this structured element surface and at least two circumferential bonding frames should be structured out of this connecting layer on different surface levels of the element surface. The topography created in the element surface permits sequential bonding in which multiple cavities between the two elements may be successively hermetically sealed, so that a defined internal pressure prevails in each of the cavities.

公开(公告)号：US09233841B2

公开(公告)日：2016-01-12

申请号：US14052812

申请日：2013-10-14

Applicant: Robert Bosch GmbH

Inventor： Friedjof Heuck ,  Christoph Schelling ,  Mirko Hattass ,  Benjamin Schmidt

IPC: B81C1/00 ,  G01C19/5769

CPC classification number: B81C1/00531 ,  B81B2201/0242 ,  B81C1/00595 ,  B81C1/00619 ,  B81C2201/0132 ,  B81C2201/0133 ,  G01C19/5769

Abstract: A production process for a micromechanical component includes at least partially structuring at least one structure from at least one monocrystalline silicon layer by at least performing a crystal-orientation-dependent etching step on an upper side of the silicon layer with a given (110) surface orientation of the silicon layer. For the at least partial structuring of the at least one structure, at least one crystal-orientation-independent etching step is additionally performed on the upper side of the silicon layer with the given (110) surface orientation of the silicon layer.

Abstract translation: 用于微机械部件的制造方法包括至少部分地从至少一个单晶硅层构造至少一个结构，至少通过给定的（110）表面在硅层的上侧执行晶体取向依赖性蚀刻步骤 硅层的取向。 对于至少一个结构的至少部分结构，在硅层的给定（110）表面取向附近在硅层的上侧附加地执行至少一个不依赖晶体取向的蚀刻步骤。

公开(公告)号：US20150365751A1

公开(公告)日：2015-12-17

申请号：US14732368

申请日：2015-06-05

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling ,  Rolf Scheben ,  Ricardo Ehrenpfordt

IPC: H04R1/08

CPC classification number: H04R19/005 ,  H04R19/04 ,  H04R31/00

Abstract: A micromechanical sensor system combination, and a corresponding manufacturing method, includes an interposer chip including a first front side and a first back side which includes first electrical contacts on the first front side and second electrical contacts on the first back side, the interposer chip having first electrical vias which electrically connect the first electrical contacts to the second electrical contacts; as well as a micromechanical sensor chip system including a second front side a second back side including at least one first sensor device and a second sensor device which are laterally adjacent, the first front side being attached on the second front side so that the first sensor device and the second sensor device are electrically and mechanically connected to the first electrical contacts.

Abstract translation: 微机械传感器系统组合和相应的制造方法包括插入器芯片，其包括第一前侧和第一后侧，该第一前侧和第一后侧包括第一前侧上的第一电触点和第一背面侧的第二电触点，所述插入器芯片具有 第一电气通孔，其将第一电触头电连接到第二电触点; 以及包括第二前侧的微机械传感器芯片系统，第二后侧包括至少一个横向相邻的第一传感器装置和第二传感器装置，第一前侧附接在第二前侧，使得第一传感器 装置和第二传感器装置电连接和机械地连接到第一电触点。

公开(公告)号：US09082882B2

公开(公告)日：2015-07-14

申请号：US14032649

申请日：2013-09-20

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling ,  Ando Feyh

IPC: H01L29/84 ,  H01L21/306 ,  B81B3/00 ,  H01L29/66 ,  B81C1/00 ,  G01P15/12

CPC classification number: H01L29/84 ,  B81B2201/025 ,  B81C1/00182 ,  G01P15/124 ,  H01L29/66477

Abstract: A microelectronic component includes a semiconductor substrate having a top side and a reverse side, an elastically movable mass device on the top side of the substrate, at least one source region provided in or on the mass device, at least one drain region provided in or on the mass device, and a gate region suspended on a conductor track arrangement above the at least one source region and at least one drain region and spaced apart from the mass device by a gap. The conductor track arrangement is anchored on the top side of the substrate in a periphery of the mass device such that the gate region remains fixed when the mass device has been moved.

Abstract translation: 微电子部件包括具有顶侧和反面的半导体衬底，在衬底的顶侧上的可弹性移动的质量装置，设置在质量装置中或其上的至少一个源极区，设置在或 以及悬挂在所述至少一个源极区域上方的导体轨道装置上的栅极区域和至少一个漏极区域，并且通过间隙与所述质量装置间隔开。 导体轨道布置在质量装置的周边中锚定在衬底的顶侧上，使得当质量装置已经移动时，栅极区域保持固定。

公开(公告)号：US09035413B2

公开(公告)日：2015-05-19

申请号：US14032340

申请日：2013-09-20

Applicant: Robert Bosch GmbH

Inventor： Georg Bischopink ,  Silvia Kronmueller ,  Christoph Schelling

IPC: H01L31/058 ,  H01L21/00 ,  H01L27/142 ,  H01L31/18 ,  H01L31/0475

CPC classification number: H01L27/142 ,  H01L24/19 ,  H01L27/14649 ,  H01L31/0475 ,  H01L31/1876 ,  Y02E10/50

Abstract: A semiconductor device includes a carrier substrate having at least one conductor track, at least one converter element structured at least partly from a further semiconductor substrate, and conductive structures formed on a respective converter element. The at least one converter element is electrically linked to the at least one conductor track via at least one at least partly conductive supporting element arranged between a contact side of the carrier substrate and an inner side of the converter element. The inner side is oriented toward the carrier substrate. The at least one converter element is arranged on the contact side of the carrier substrate such that the inner side of the converter element is kept spaced apart from the contact side of the carrier substrate. The at least one converter element and the conductive structures formed thereon are completely embedded into at least one insulating material.

Abstract translation: 半导体器件包括具有至少一个导体轨道的载体衬底，至少一个由另一个半导体衬底构成的转换器元件，以及形成在相应的转换元件上的导电结构。 所述至少一个转换器元件经由布置在所述载体基板的接触侧和所述转换器元件的内侧之间的至少一个至少部分导电的支撑元件电连接到所述至少一个导体轨道。 内侧朝向载体基板。 所述至少一个转换器元件布置在所述载体衬底的接触侧上，使得所述转换器元件的内侧与所述载体衬底的接触侧保持间隔开。 至少一个转换器元件和其上形成的导电结构完全嵌入到至少一个绝缘材料中。

公开(公告)号：US20140124671A1

公开(公告)日：2014-05-08

申请号：US14071306

申请日：2013-11-04

Applicant: Robert Bosch GmbH

Inventor： Ingo Herrmann ,  Christoph Schelling

IPC: G01J5/10

CPC classification number: G01J5/10 ,  G01J5/0853 ,  G01J5/20

Abstract: An image pixel apparatus for detecting electromagnetic radiation includes an absorption structure device configured to absorb the electromagnetic radiation and to take it up as a quantity of heat. At least one plasmonic resonance structure device of the apparatus is configured to forward the electromagnetic radiation to the absorption structure device. A detection device that has at least one detection element is configured to detect the electromagnetic radiation by way of changes in an electrical property of the at least one detection element that are caused by the quantity of heat taken up.

Abstract translation: 用于检测电磁辐射的图像像素装置包括吸收结构装置，其被配置为吸收电磁辐射并且以一定的热量将其吸收。 装置的至少一个等离子体激元共振结构装置被配置为将电磁辐射转发到吸收结构装置。 具有至少一个检测元件的检测装置被配置为通过由所吸收的热量引起的至少一个检测元件的电特性的变化来检测电磁辐射。