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公开(公告)号：US20210351229A1
公开(公告)日：2021-11-11
申请号：US17314562
申请日：2021-05-07
发明人： Seom Geun LEE , Seong Kyu JANG , Yong Woo RYU
IPC分类号： H01L27/15 , H01L33/62 , H01L33/38 , H01L25/075
摘要： A light emitting device for a display according to an exemplary embodiment includes a first LED stack, a second LED stack located under the first LED stack, and a third LED stack located under the second LED stack. The light emitting device further includes a first bonding layer, a second bonding layer, a first planarization layer, a second planarization layer, lower buried vias, and upper buried vias. The first planarization layer is recessed inwardly to expose an edge of the second LED stack.
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公开(公告)号：US11152553B2
公开(公告)日：2021-10-19
申请号：US16737984
申请日：2020-01-09
发明人： Myoung Hak Yang
摘要： A light emitting device package including a base substrate having a front surface and a rear surface, and including a first recess portion recessed from the front surface, a plurality of outer electrodes disposed on the front surface, a light emitting device disposed in the first recess portion and configured to emit light in a direction away from the base substrate, and including a substrate, a light emitting structure disposed on the substrate, and a plurality of bump electrodes disposed on the substrate, and a plurality of connection electrodes connecting the light emitting device to the outer electrodes, in which an upper surface of the bump electrodes and an upper surface of the outer electrodes are disposed on substantially the same plane, and each of the connection electrodes is disposed on one of the bump electrodes and one of the outer electrodes that are adjacent to each other.
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93.发明申请公开(公告)号：US20210293392A1
公开(公告)日：2021-09-23
申请号：US17194906
申请日：2021-03-08
发明人： Sang Min KO
摘要： Disclosed herein are a light source module for plant cultivation and a light device including the same. The light source module for plant cultivation may include at least one main light source emitting white light. The white light from the main light source is provided to a plant during cultivation to improve the growth and phytochemical content of the plant. In addition, the white light may have peak wavelengths of 430 nm or less, 440 nm to 460 nm, 510 nm to 530 nm, and 600 nm to 630 nm.
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公开(公告)号：US11102971B2
公开(公告)日：2021-08-31
申请号：US16101389
申请日：2018-08-10
发明人： Mi So Ko , Chung Hoon Lee , Hoon Sik Eom , Sang Hyun Chang
摘要： The present invention relates to an insect trap for attracting insects using a UV LED and sucking and capturing the attracted insects with a fan. The insect trap of the present invention comprises: a body; a suction part provided on one side of the body; a fan installed behind the suction part; at least one UV LED, provided on the body at least around the fan, for irradiating ultraviolet rays forward; a discharge part for discharging air sucked in by the suction part in a direction different from the air suction direction of the suction part; a duct which is an air passage from the suction part to the discharge part; a first streamlined inner surface, provided on an inner wall side opposite to a direction in which the duct extends on the basis of the suction part, for guiding air sucked into the suction part toward the duct; and an insect net, installed in the discharge part, for passing the air therethrough and capturing insects being sucked in together with the air.
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公开(公告)号：US20210242371A1
公开(公告)日：2021-08-05
申请号：US17165177
申请日：2021-02-02
发明人： Yong Hyun BAEK , Ji Hun KANG , Chae Hon KIM , Ji Hoon PARK
摘要： A light emitting diode includes an n-type nitride semiconductor layer, a V-pit generation layer located over the n-type nitride semiconductor layer and having a V-pit, an active layer located on the V-pit generation layer, and a p-type nitride semiconductor layer located on the active layer. The active layer includes a well layer, which includes a first well layer portion formed along a flat surface of the V-pit generation layer and a second well layer portion formed in the V-pit of the V-pit generation layer. The light emitting diode emits light having at least two peak wavelengths at a single chip level.
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公开(公告)号：US11063185B2
公开(公告)日：2021-07-13
申请号：US16518169
申请日：2019-07-22
发明人： Seom Geun Lee , Chan Seob Shin
摘要： A light emitting diode with a zinc oxide layer and a method of fabricating the same are disclosed. The light emitting diode includes: a light emitting structure including a gallium nitride based first conductivity type semiconductor layer, a gallium nitride based second conductivity type semiconductor layer, and an active layer interposed therebetween; and a ZnO transparent electrode layer disposed on the second conductivity type semiconductor layer, wherein the ZnO transparent electrode layer comprises a ZnO seed layer and a ZnO bulk layer formed on the ZnO seed layer, wherein the ZnO bulk layer is porous compared to the ZnO seed layer, wherein an interface between the ZnO seed layer and the second conductivity type semiconductor layer is flatter than an interface between the ZnO seed layer and the ZnO bulk layer, and wherein the interface between the ZnO seed layer and the ZnO bulk layer has an irregular concavo-convex shape.
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公开(公告)号：US20210181267A1
公开(公告)日：2021-06-17
申请号：US17121638
申请日：2020-12-14
发明人： Young Ju LEE , lk Kyu YOU , Jung Jae LEE
摘要： A micro LED bond tester including a stage configured to mount a circuit board on which micro LEDs are mounted, and a gas blower configured to blow gas into at least one of the micro LEDs on the circuit board.
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公开(公告)号：US20210151628A1
公开(公告)日：2021-05-20
申请号：US17157600
申请日：2021-01-25
发明人： Jong Kyu KIM , Min Woo KANG , Se Hee OH , Hyoung Jin LIM
摘要： A chip-scale package type light emitting diode includes a first conductivity type semiconductor layer, a mesa, a second conductivity type semiconductor layer, a transparent conductive oxide layer, a dielectric layer, a lower insulation layer, a first pad metal layer, and a second pad metal layer, an upper insulation layer. The upper insulation layer covers the first pad metal layer and the second pad metal layer, and includes a first opening exposing the first pad metal layer and a second opening exposing the second pad metal layer. The openings of the dielectric layer include openings that have different sizes from one another.
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公开(公告)号：US20210098654A1
公开(公告)日：2021-04-01
申请号：US17119136
申请日：2020-12-11
发明人： Yuriy BILENKO , Ki Yon PARK
摘要： A light emitting diode package includes a main frame including a base frame and a middle frame disposed on the base frame, a holding frame disposed on the middle frame, a light emitting diode chip disposed on the base frame, and a window secured by the main frame and the holding frame. The middle frame includes a middle frame open portion exposing the light emitting diode chip. The holding frame includes a holding frame open portion at least partially overlapping with the middle frame open portion on a plane. The holding frame open portion has an area decreasing in a direction away from the main frame.
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公开(公告)号：US20210098653A1
公开(公告)日：2021-04-01
申请号：US17118731
申请日：2020-12-11
发明人： Jin Woong LEE , Kyoung Wan KIM , Tae Jun PARK , Sang Won WOO
摘要： A light emitting diode chip includes a substrate; a first conductivity type semiconductor layer disposed on the substrate; a mesa; a transparent electrode; a contact electrode; a current spreader; a first insulating reflection layer; a first pad electrode and a second pad electrode; and a second insulating reflection layer. The first insulating reflection layer covers one end of the substrate, the first conductivity type semiconductor layer, the mesa, the transparent electrode. The second insulating reflection layer is disposed on an opposite end of the substrate and includes a structure of a distributed Bragg reflector (DBR).
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