发明申请
- 专利标题： LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING APPARATUS COMPRISING THE SAME
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申请号： US17119136申请日： 2020-12-11
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公开(公告)号： US20210098654A1公开(公告)日： 2021-04-01
- 发明人: Yuriy BILENKO , Ki Yon PARK
- 申请人： SEOUL VIOSYS CO., LTD.
- 申请人地址： KR Gyeonggi-do
- 专利权人： SEOUL VIOSYS CO., LTD.
- 当前专利权人： SEOUL VIOSYS CO., LTD.
- 当前专利权人地址： KR Gyeonggi-do
- 优先权： KR10-2018-0066557 20180611
- 主分类号： H01L33/48
- IPC分类号： H01L33/48 ; H01L25/13
摘要：
A light emitting diode package includes a main frame including a base frame and a middle frame disposed on the base frame, a holding frame disposed on the middle frame, a light emitting diode chip disposed on the base frame, and a window secured by the main frame and the holding frame. The middle frame includes a middle frame open portion exposing the light emitting diode chip. The holding frame includes a holding frame open portion at least partially overlapping with the middle frame open portion on a plane. The holding frame open portion has an area decreasing in a direction away from the main frame.
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