Abstract:
A differential transmission board set includes a mounting board on which a compression connector is mounted and a contact board configured to come into contact with the compression connector. In the contact board, a second conductor layer is a ground layer and has a penetrating hole. The penetrating hole is formed in such a way that a first signal pad and a second signal pad are both located inside an inner edge of the penetrating hole. In the contact board, the penetrating hole is formed to overlap an outer region of the first ground pad and an outer region of the second ground pad.
Abstract:
An information processing system includes a housing, a circuit board in the housing, a functional module in the housing, and a module fixing device in the housing. The functional module is inserted into the circuit board. The module fixing device is connected to the functional module and is connected to the circuit board. The module fixing device comprises a clamping member and an elastic member. The clamping member is movably connected to the circuit board in a first direction and a second direction opposite to the first direction, the clamping member comprises a first clamping portion to clamp the functional module. The elastic member is connected to the clamping member, the elastic member is deformable in the first direction to drive the clamping member to move in the first direction to clamp the functional module.
Abstract:
An electrical connector includes an insulating body and conductive terminals. The insulating body defines receiving holes, each of the receiving holes receiving a respective one of the conductive terminals. Each receiving hole includes a first hole portion, a second hole portion and a third hole portion. Each conductive terminal includes a main body, an elastic arm, and a connection portion. The main body is received in the second hole portion, the first hole portion and the third hole portion are respectively positioned on two opposite sides of the main body, and the elastic arm is at least partially positioned above the first hole portion. The insulating body includes a support portion located on a side of the main body, and the support portion and the third hole portion are located on the same side of the main body.
Abstract:
An electrical connector includes an insulating body having multiple receiving holes, and multiple conductive terminals respectively received in the receiving holes. Each conductive terminal has first and second elastic arms, and third and fourth elastic arms. When a chip module downwardly presses the conductive terminals, the first elastic arm are conducted upwardly with the chip module, and the third elastic arm are conducted downwardly with a circuit board. At the same time, the first elastic arm elastically deform to urge against the second elastic arm, and the third elastic arm elastically deform to urge against the fourth elastic arm, thereby forming two conductive paths to reduce terminal impedance, and improving signal transmission performance. Further, the second elastic arm provide elastic force for the first elastic arm and the fourth elastic arm provide elastic force for the third elastic arm.
Abstract:
A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.
Abstract:
A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.
Abstract:
To improve a seating property of a mounting member with respect to a supporting member and enhance the positional accuracy of the mounting member. The mounting member has a protruding portion that protrudes from a support face of a frame body, and a shaft body that is thinner than the protruding portion. At a base portion of the shaft body, a relief recess is formed over the entire circumference of a boundary region with the protruding portion, and a supported face of the protruding portion is configured so as to contact with a support face of the frame body in a state in which the mounting member is supported by the frame body. In a preferred embodiment of the present invention, the mounting member is used as a guide pin of a floating plate that accommodates an IC socket.
Abstract:
A microelectronic socket having a two piece construction, wherein a first piece comprises a conductive socket substrate and the second piece comprises an insulative insert. The conductive socket substrate has a first surface, a second surface, and at least one opening extending therebetween. The insulative insert has a base portion with at least one projection extending therefrom. The insulative insert is mated with the conductive socket substrate such that the at least one projection resides within a corresponding conductive socket substrate opening. The insulative insert further includes a plurality of vias, wherein at least one of the plurality of vias extends through the insulative base and through an insulative insert projection, wherein a contact may be disposed within the via.
Abstract:
A disclosed socket for a semiconductor component includes a plate-shaped insulator having a first main surface and a second main surface, where a through hole being formed in the insulator, a terminal inserted in the through hole, the terminal having one end configured to be connected to a signal electrode of the semiconductor component and having another end configured to be connected to a signal electrode of a printed circuit board, and a shield buried in the insulator to surround the terminal from sides of the terminal, the shield including a first contact protruding from the first main surface and configured to be connected to a ground electrode of the semiconductor component, and a second contact protruding from the second main surface and configured to be connected to a ground electrode of the printed circuit board.
Abstract:
To improve a seating property of a mounting member with respect to a supporting member and enhance the positional accuracy of the mounting member. The mounting member has a protruding portion that protrudes from a support face of a frame body, and a shaft body that is thinner than the protruding portion. At a base portion of the shaft body, a relief recess is formed over the entire circumference of a boundary region with the protruding portion, and a supported face of the protruding portion is configured so as to contact with a support face of the frame body in a state in which the mounting member is supported by the frame body. In a preferred embodiment of the present invention, the mounting member is used as a guide pin of a floating plate that accommodates an IC socket.