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公开(公告)号：US20200083487A1
公开(公告)日：2020-03-12
申请号：US15572788
申请日：2017-06-22
Inventor： Jiangjiang JIN , Hsianglun HSU
Abstract: A flexible organic light-emitting diode (OLED) display and a method for manufacturing the same are provided. The method includes: forming an organic light-emitting display layer on a flexible substrate; coating a nanocomposite material on the organic emitting display layer to form a nanocomposite layer; and forming a first inorganic layer on the nanocomposite layer. The nanocomposite material is obtained by modifying surfaces of a plurality of nanoparticles with oleyl phosphate and then dispersing the modified nanoparticles in an organic monomer.
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公开(公告)号：US20180212186A1
公开(公告)日：2018-07-26
申请号：US15319771
申请日：2016-12-02
Inventor： Jiangjiang JIN , Hsiang-lun HSU , Jinchang HUANG , Qian JIANG
IPC: H01L51/52
Abstract: The present disclosure teaches a packaging layer, including a first inorganic functional layer, and an organic buffer layer on a top side of the first inorganic functional layer. The top side of the first inorganic functional layer has a number of indentations. A bottom side of the organic buffer layer interfacing the first inorganic functional layer has a number of bulges corresponding to and matching with the indentations. Each bulge is embedded into a corresponding indentation. The present disclosure also teaches a device by packaged the packaging layer.
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公开(公告)号：US20180053916A1
公开(公告)日：2018-02-22
申请号：US15310099
申请日：2016-08-19
Inventor： Jiangjiang JIN
CPC classification number: H01L51/5268 , H01L51/0097 , H01L51/525 , H01L51/5253 , H01L51/5262 , H01L51/56 , H01L2251/301 , H01L2251/303 , H01L2251/5338 , H01L2251/558
Abstract: A flexible organic light emitting diode display and a method of fabricating the same are provided. The method has steps of: performing a patterning process on a photoresist layer to form a plurality of photoresist portions; etching a fluoropolymer layer to form a plurality of polymerization portions; depositing a material of a light extracting enhanced layer on the photoresist portions to form a plurality of light extracting enhanced portions; removing the fluoropolymer layer and the photoresist layer; fabricating a buffer layer on the light extracting enhanced portions; and fabricating a second waterproof layer on the buffer layer.
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公开(公告)号：US20200052230A1
公开(公告)日：2020-02-13
申请号：US15570384
申请日：2017-06-09
Inventor： Jiangjiang JIN , Hsianglun HSU
Abstract: A flexible organic light emitting diode display and a manufacturing method thereof are provided. The manufacturing method includes steps of forming an active array layer and a photoresist layer sequentially on a flexible substrate, patterning the photoresist layer to form a plurality of pixel units, forming a light emitting main layer between two of the pixel units adjacent to each other, removing the pixel units with an organic solvent, forming a conductive transport layer on the light emitting main layer, and forming an encapsulation layer on the conductive transport layer.
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公开(公告)号：US20180315956A1
公开(公告)日：2018-11-01
申请号：US15572540
申请日：2017-06-09
Inventor： Jiangjiang JIN , Bokun SU , Hsiang-Iun HSU
CPC classification number: H01L51/5253 , H01L27/3244 , H01L51/0097 , H01L51/56 , H01L2227/323 , H01L2251/5338
Abstract: A flexible organic light emitting diode display and a manufacturing method are provided. The method includes steps of forming an active array layer and an organic light emitting display layer sequentially on a flexible substrate, forming a protective layer on the organic light emitting display layer, forming an organic layer on the protective layer, wherein a cross section of the organic layer is trapezoidal, and forming an inorganic layer on the organic layer.
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Patent Agency Ranking
公开(公告)号：US20180294439A1
公开(公告)日：2018-10-11
申请号：US15567566
申请日：2017-05-03
Inventor： Simin PENG , Jiangjiang JIN , HSIANG LUN HSU
CPC classification number: H01L51/5265 , H01L51/001 , H01L51/0035 , H01L51/0097 , H01L51/5012 , H01L51/5072 , H01L51/5088 , H01L51/5209 , H01L51/5225 , H01L51/5253 , H01L51/5256 , H01L51/56 , H01L2251/5338 , H01L2251/556 , H01L2251/558
Abstract: The present disclosure relates to the field of liquid crystal display technology, and more particularly, to the flexible display panel and the manufacturing method thereof. The method includes forming the polymer on the anode layer from vapor of the organic dimer as the micro-cavity adjusting layer by the chemical vapor deposition method at the controlled temperature between 650° C. to 750° C. The structural formula of the organic dimer is as shown in Formula 1, wherein R is selected from one of H, F, Cl, and Br. The cathodic protective layer and the encapsulation layer can be formed by the same material and processes. The present disclosure discloses preparing the micro-cavity adjustment layer, the cathodic protective layer, and the encapsulation layer of the flexible OLED with the same material, which can simplify the preparation processes.
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公开(公告)号：US20180212192A1
公开(公告)日：2018-07-26
申请号：US15328897
申请日：2016-12-15
Inventor： Jiangjiang JIN , Hsianglun HSU
CPC classification number: H01L51/5256 , H01L51/5237 , H01L51/524 , H01L51/5246 , H01L51/5253 , H01L51/56 , H05B33/04
Abstract: The present invention provides an OLED display and a manufacturing method thereof. The OLED display of the present invention is such that in a thin film encapsulation layer, an inorganic passivation that is located under and adjacent to each organic buffer layer forms a stepped zone at a portion between an outer edge of the organic buffer layer and an outer edge of the inorganic passivation layer and each stepped zone is provided with a DLC layer that covers the stepped zone. In other words, the present invention uses DLC for later side encapsulation and in the thin film encapsulation layer, each organic buffer layer is provided, on an outer side thereof, with a DLC layer to thereby effectively block external moisture and oxygen from attacking the OLED device from a lateral side and also to eliminate an issue of loss for light of a top emission device to travel through DLC.
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公开(公告)号：US20180294435A1
公开(公告)日：2018-10-11
申请号：US15328404
申请日：2016-12-26
Inventor： Jiangjiang JIN
CPC classification number: H01L51/5253 , H01L51/5268 , H01L51/56
Abstract: The disclosure discloses an OLED device packaged by a thin film, including an OLED display device and at least one packaging structure packaged on the OLED display device. The packaging structure includes a first inorganic packaging layer made by waterproof inorganic material, an organic scattering layer disposed on the first inorganic packaging layer and a second inorganic packaging layer disposed on the organic scattering layer. The organic scattering layer is configured to improve optical coupling output of the OLED display device. The second inorganic packaging layer is made by waterproof inorganic material. The disclosure discloses a thin film packaging method of the OLED device. According to the disclosure, the inorganic waterproof packaging layer and the organic scattering layer disposed on the OLED display device can guarantee enough ability of preventing water and oxygen of the OLED device with relatively high optical coupling output.
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公开(公告)号：US20180212191A1
公开(公告)日：2018-07-26
申请号：US15328895
申请日：2016-12-13
Inventor： Jiangjiang JIN
CPC classification number: H01L51/5256 , H01L25/0753 , H01L27/1214 , H01L27/1248 , H01L27/1251 , H01L27/1259 , H01L27/32 , H01L27/3213 , H01L27/3246 , H01L51/5237 , H01L51/5253 , H01L51/5296 , H01L51/56
Abstract: The present invention provides an OLED display and a manufacturing method thereof. The OLED display of the present invention includes an OLED substrate and a thin film encapsulation layer disposed on the OLED substrate. The thin film encapsulation layer includes a patterned the high thermal conductivity layer and the high thermal conductivity layer is provided with a plurality of openings formed therein to correspond, in a one to one manner, to a plurality of sub-pixel areas of the OLED substrate so as to prevent the high thermal conductivity layer from absorbing light and also help eliminate the constraint that a top emission device is only allowed to use a material having a high transmission rate, thereby allowing for effective transfer of heat generated during an operation of an OLED device without deteriorating light emission efficiency of the device, reducing thermal decomposition of a material of the OLED device, and ensuring the device possesses sufficiency capability of blocking external moisture and oxygen to thus extend the service life of the device.
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公开(公告)号：US20180212187A1
公开(公告)日：2018-07-26
申请号：US15328387
申请日：2016-12-26
Inventor： Jiangjiang JIN
CPC classification number: H01L51/5253 , H01L51/0018 , H01L51/0097 , H01L51/5256 , H01L51/56 , H01L2251/303 , H01L2251/5338
Abstract: A packaging method for organic semiconductor device is disclosed, and comprising steps of manufacturing an organic semiconductor device on a flexible base; forming a photoresist block having a predetermined interval with respect to the organic semiconductor device and located at two sides of the organic semiconductor device on the flexible base; depositing an inorganic layer on the photoresist block, the organic semiconductor device and the flexible base; removing the photoresist block and inorganic layer on the photoresist block; and depositing an organic layer on the inorganic layer disposed on the organic semiconductor device. The present invention can form an inorganic/organic flexible OLED packaging structure. The packaging structure cannot only omit a deposition mask used in depositing an inorganic layer in the conventional thin-film packaging art, but also effectively increase a blocking property of moisture and oxygen of OLED device in order to increase the life of the OLED device.
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