MANUFACTURING METHOD OF ARRAY SUBSTRATE AND ARRAY SUBSTRATE

    公开(公告)号:US20210074742A1

    公开(公告)日:2021-03-11

    申请号:US16641663

    申请日:2019-11-06

    Abstract: A manufacturing method of an array substrate and the array substrate are provided. The method comprises: forming an active layer on a substrate; forming an insulation layer on the active layer; forming a first metal layer on the insulation layer; forming an interlayer dielectric layer and a pixel electrode layer on the first metal layer by a same mask; forming a second metal layer on the interlayer dielectric layer, wherein the second metal layer comprises a source electrode, a drain electrode, and a touch signal line; and forming a patterned protective layer and a patterned common electrode layer on the second metal layer.

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