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公开(公告)号：US09407235B2
公开(公告)日：2016-08-02
申请号：US14303158
申请日：2014-06-12
发明人： Takashi Yamashita
CPC分类号： H03H9/059 , H01L2224/16225 , H01L2924/15174 , H03H9/0576 , H03H9/1071 , H03H9/1078 , H03H9/6483
摘要： An acoustic wave device includes: a chip; an acoustic wave element formed on a principal surface of the chip; a first pad formed on the principal surface of the chip and electrically connected to the acoustic wave element; a substrate having a principal surface facing the principal surface of the chip; a second pad formed on the principal surface of the substrate; a first bump formed between the first pad and the second pad and electrically connecting the first pad and the second pad; and a second bump formed between the chip and the substrate and making direct contact with the substrate.
摘要翻译： 声波装置包括：芯片; 形成在所述芯片的主表面上的声波元件; 形成在芯片的主表面上并电连接到声波元件的第一焊盘; 具有面向芯片的主面的主面的基板; 形成在所述基板的主表面上的第二焊盘; 形成在所述第一焊盘和所述第二焊盘之间并且电连接所述第一焊盘和所述第二焊盘的第一焊盘; 以及形成在所述芯片和所述基板之间并且与所述基板直接接触的第二凸块。
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2.发明授权Acoustic wave device and module including a dielectric film with an inclined upper surface 有权声波装置和模块包括具有倾斜上表面的电介质膜公开(公告)号：US08896399B2
公开(公告)日：2014-11-25
申请号：US13725514
申请日：2012-12-21
发明人： Michio Miura , Satoru Matsuda , Takashi Yamashita , Hiraki Domon
CPC分类号： H03H9/25 , H03H3/08 , H03H9/02858 , H03H9/64
摘要： An acoustic wave device includes: a substrate; a dielectric film formed on the substrate; opposing comb-shaped electrodes located between the substrate and the dielectric film, each of the opposing comb-shaped electrodes including an electrode finger, wherein at least one of the substrate and the dielectric film is a piezoelectric substance, an upper surface of the dielectric film, which is located above a gap between a tip of an electrode finger of one of the opposing comb-shaped electrodes and the other of the opposing comb-shaped electrodes, is inclined against an upper surface of the substrate in an extension direction of the electrode finger, and an inclination angle of the upper surface of the dielectric film against the upper surface of the substrate is equal to or larger than 30° and equal to or smaller than 50°.
摘要翻译： 声波装置包括：基板; 形成在基板上的电介质膜; 位于基板和电介质膜之间的相对的梳状电极，每个相对的梳形电极包括电极指，其中基板和电介质膜中的至少一个是压电材料，电介质膜的上表面 位于相对的梳状电极中的一个的电极指的尖端和相对的梳状电极中的另一个之间的间隙之上的电极在电极的延伸方向上相对于衬底的上表面倾斜 指状物和电介质膜的上表面相对于基板的上表面的倾斜角度等于或大于30°且等于或小于50°。
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公开(公告)号：US09197190B2
公开(公告)日：2015-11-24
申请号：US14063144
申请日：2013-10-25
发明人： Takashi Yamashita
CPC分类号： H03H9/25 , H03H9/0547 , H03H9/1092 , H03H9/173 , H03H9/54 , H03H9/64 , H03H9/6483
摘要： An electronic component module includes: a multi-layered wiring board formed by stacking insulating layers, an inner wiring layer formed between the insulating layers, and a surface wiring layer formed on an outermost insulating layer of the insulating layers; and an acoustic wave device located inside the multi-layered wiring board, wherein the acoustic wave device includes a functional element and a sealing portion, the functional element being located on a substrate and exciting an acoustic wave, and the sealing portion sealing the functional element so as to form an air-space above the functional element, and a terminal portion of the surface wiring layer does not overlap the air-space of the acoustic wave device as viewed from a stacking direction of the multi-layered wiring board, the terminal portion being a region to which a terminal of an electronic component is fixed in the surface wiring layer.
摘要翻译： 电子部件模块包括：通过堆叠绝缘层，形成在绝缘层之间的内部布线层和形成在绝缘层的最外层绝缘层上的表面布线层而形成的多层布线板; 以及位于所述多层布线基板内的声波装置，其中所述声波装置包括功能元件和密封部，所述功能元件位于基板上并激发声波，所述密封部将所述功能元件 以便在功能元件上方形成空气空间，并且表面布线层的端子部分与多层布线板的层叠方向观察时不与声波装置的空气空间重叠，所以端子 部分是电子部件的端子固定在表面布线层中的区域。
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公开(公告)号：US09035535B2
公开(公告)日：2015-05-19
申请号：US13666520
申请日：2012-11-01
发明人： Takashi Yamashita
IPC分类号： H01L41/053 , H03H3/08 , H03H9/02 , H03H9/05 , H03H9/10
CPC分类号： H01L41/053 , H03H3/08 , H03H9/02102 , H03H9/02149 , H03H9/0547 , H03H9/1071
摘要： An acoustic wave device includes: a substrate; a functional element that is located on the substrate and excites acoustic waves; a side wall portion that is made of a metal and is located on the substrate so as to surround the functional element; a metal plate that is located above the functional element and the side wall portion, and seals the functional element so that a space is formed above the functional element; and a terminal that is located on the substrate and further out than the side wall portion, and is electrically connected to the functional element.
摘要翻译： 声波装置包括：基板; 功能元件位于基板上并激发声波; 侧壁部，其由金属制成并且位于所述基板上以围绕所述功能元件; 金属板，其位于功能元件和侧壁部分上方，并且密封功能元件，使得在功能元件上方形成空间; 以及位于所述基板上并且比所述侧壁部更远的端子，并且与所述功能元件电连接。
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公开(公告)号：US09608193B2
公开(公告)日：2017-03-28
申请号：US13912997
申请日：2013-06-07
发明人： Takashi Yamashita
CPC分类号： H01L41/08 , H01L41/29 , H03H3/08 , H03H9/02559 , H03H9/02992 , H03H9/14555 , Y10T29/42
摘要： An acoustic wave device includes: a piezoelectric substrate of which four sides of an upper surface are approximate cleavage directions; and an electrode that is formed on the upper surface of the piezoelectric substrate, and excites an acoustic wave propagating in a direction different from the approximate cleavage directions.
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公开(公告)号：US11271542B2
公开(公告)日：2022-03-08
申请号：US15686621
申请日：2017-08-25
发明人： Takashi Yamashita
IPC分类号： H01L41/313 , H03H9/25 , H01L41/047 , H03H9/05 , H01L41/053 , H01L41/187 , H03H3/08 , H03H9/64
摘要： An acoustic wave device includes: a mounting substrate; a first wiring layer located on an upper surface of the mounting substrate, the first wiring layer including a first bond region and a first connection region connecting with the first bond region and having a thickness substantially equal to a thickness of the first bond region; an element substrate mounted on the mounting substrate; an acoustic wave element located on a lower surface of the element substrate; and a second wiring layer located on the lower surface of the element substrate, the second wiring layer including a second bond region and a second connection region, the second bond region directly bonding with the first bond region of the first wiring layer, the second connection region connecting the acoustic wave element with the second bond region and having a thickness substantially equal to a thickness of the second bond region.
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