公开(公告)号：US11004733B2

公开(公告)日：2021-05-11

申请号：US16399066

申请日：2019-04-30

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Ssu-Chiang Weng ,  Ping-Hao Lin ,  Fu-Cheng Chang

IPC分类号： H01L21/768 ,  H01L23/522 ,  H01L23/528 ,  H01L25/065 ,  H01L23/31 ,  H01L23/48 ,  H01L21/311

摘要： A method includes bonding a first wafer to a second wafer. The first wafer includes a plurality of dielectric layers, a metal pipe penetrating through the plurality of dielectric layers, and a dielectric region encircled by the metal pipe. The dielectric region has a plurality of steps formed of sidewalls and top surfaces of portions of the plurality of dielectric layers that are encircled by the metal pipe. The method further includes etching the first wafer to remove the dielectric region and to leave an opening encircled by the metal pipe, extending the opening into the second wafer to reveal a metal pad in the second wafer, and filling the opening with a conductive material to form a conductive plug in the opening.

公开(公告)号：US20150048467A1

公开(公告)日：2015-02-19

申请号：US13968260

申请日：2013-08-15

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Ssu-Chiang Weng ,  Kuo-Cheng Lee ,  Chi-Cherng Jeng

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L31/0232 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/1464 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/18

摘要： An image sensor device and a method for manufacturing the image sensor device are provided. An image sensor device includes a substrate, sensor elements disposed at a front surface of the substrate, and a dielectric grid disposed over a back surface of the substrate. The dielectric grid includes a first dielectric layer as a bottom portion, a metal pillar, as a core portion of a upper portion, disposed over the first dielectric layer and a second dielectric layer wrapping around the metal pillar. The image sensor device also includes a stack of layers disposed over the back surface of the substrate. Refractive index of each layers increases from top layer to bottom layer. The image sensor device also includes a color filter and a microlens disposed over the back surface of the substrate.

摘要翻译： 提供了图像传感器装置和图像传感器装置的制造方法。 图像传感器装置包括基板，设置在基板的前表面的传感器元件和布置在基板的后表面上的电介质栅格。 电介质栅格包括作为底部的第一电介质层，设置在第一电介质层上的作为上部的芯部的金属柱和围绕金属柱缠绕的第二电介质层。 图像传感器装置还包括设置在基板的背面上的层叠层。 每层的折射率从顶层增加到底层。 图像传感器装置还包括滤色器和设置在基板的后表面上的微透镜。

公开(公告)号：US20200006128A1

公开(公告)日：2020-01-02

申请号：US16399066

申请日：2019-04-30

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Ssu-Chiang Weng ,  Ping-Hao Lin ,  Fu-Cheng Chang

IPC分类号： H01L21/768 ,  H01L21/311 ,  H01L23/31 ,  H01L23/522 ,  H01L23/528 ,  H01L23/48 ,  H01L25/065

摘要： A method includes bonding a first wafer to a second wafer. The first wafer includes a plurality of dielectric layers, a metal pipe penetrating through the plurality of dielectric layers, and a dielectric region encircled by the metal pipe. The dielectric region has a plurality of steps formed of sidewalls and top surfaces of portions of the plurality of dielectric layers that are encircled by the metal pipe. The method further includes etching the first wafer to remove the dielectric region and to leave an opening encircled by the metal pipe, extending the opening into the second wafer to reveal a metal pad in the second wafer, and filling the opening with a conductive material to form a conductive plug in the opening.

公开(公告)号：US09130077B2

公开(公告)日：2015-09-08

申请号：US13968260

申请日：2013-08-15

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Ssu-Chiang Weng ,  Kuo-Cheng Lee ,  Chi-Cherng Jeng

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L31/0232 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14629 ,  H01L27/1464 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/18

摘要： An image sensor device and a method for manufacturing the image sensor device are provided. An image sensor device includes a substrate, sensor elements disposed at a front surface of the substrate, and a dielectric grid disposed over a back surface of the substrate. The dielectric grid includes a first dielectric layer as a bottom portion, a metal pillar, as a core portion of a upper portion, disposed over the first dielectric layer and a second dielectric layer wrapping around the metal pillar. The image sensor device also includes a stack of layers disposed over the back surface of the substrate. Refractive index of each layers increases from top layer to bottom layer. The image sensor device also includes a color filter and a microlens disposed over the back surface of the substrate.

摘要翻译： 提供了图像传感器装置和图像传感器装置的制造方法。 图像传感器装置包括基板，设置在基板的前表面的传感器元件和布置在基板的后表面上的电介质栅格。 电介质栅格包括作为底部的第一电介质层，设置在第一电介质层上的作为上部的芯部的金属柱和围绕金属柱缠绕的第二电介质层。 图像传感器装置还包括设置在基板的背面上的层叠层。 每层的折射率从顶层增加到底层。 图像传感器装置还包括滤色器和设置在基板的后表面上的微透镜。