公开(公告)号：US20220262759A1

公开(公告)日：2022-08-18

申请号：US17427759

申请日：2020-02-03

Applicant: Sony Interactive Entertainment Inc.

Inventor： Shinya Tsuchida ,  Nils Sabelstrom ,  Mitsuharu Morishita ,  Kenji Hirose ,  Masanori Hayashibara ,  Tetsuji Tamura ,  Sei Oonishi ,  Nobuyuki Sugawara

IPC: H01L23/00 ,  H01L23/10 ,  H01L25/16

Abstract: In a structure using a metal having fluidity as a thermally conductive material, the thermally conductive material is prevented from entering an unintended region even in a case where a change in attitude of a semiconductor device or vibration occurs. An electronic apparatus has a thermally conductive material (31) formed between a radiator (50) and a semiconductor chip (11). The thermally conductive material (31) has fluidity at least at a time of operation of the semiconductor chip (11). In addition, the thermally conductive material (31) has electric conductivity. The thermally conductive material (31) is surrounded by a seal member (33). A capacitor (16) is covered by an insulating portion (15).