摘要:
The production of optoelectronic components, optical components being mounted in the composite wafer. Provided to this end is a method for producing optoelectronic components, in particular image signal acquiring or image signal outputting components, in the case of which optical components are respectively provided, picked up and mounted on a wafer, the optical components preferably respectively being positioned individually or in groups relative to the position of assigned optoelectronic or optical components of the wafer or of a wafer to be connected thereto.