Wafer processing equipment and method of manufacturing semiconductor device

    公开(公告)号:US12287147B2

    公开(公告)日:2025-04-29

    申请号:US17493346

    申请日:2021-10-04

    Abstract: A fluid supply device configured to supply a processing fluid to a wafer processing device that includes a chamber is provided. The fluid supply device includes a reservoir configured to change the processing fluid into a supercritical fluid state; a wafer protecting device comprising a body configured to prevent a wafer in the chamber of the wafer processing device from being damaged by the processing fluid in the supercritical fluid state by receiving the processing fluid in the supercritical fluid state and limiting a speed of the processing fluid; and a fluid supply line configured to provide a path for the processing fluid between the reservoir and the wafer protecting device and a path for the processing fluid between the wafer protecting device and the wafer processing device.

    ELECTRONIC DEVICE AND CONTROL METHOD THEREFOR

    公开(公告)号:US20250126236A1

    公开(公告)日:2025-04-17

    申请号:US18999397

    申请日:2024-12-23

    Abstract: An electronic device may include: a projector; at least one sensor; at least one processor; memory storing instructions that, when executed by the at least one processor, cause the at least one processor to: identify a user gaze based on first sensing data obtained through the at least one sensor; divide a projection image stored in the memory into a first image region corresponding to the user gaze and a second image region which is a remaining region other than the first image region; modify the projection image to include the first image region of a first luminance value and the second image region of a second luminance value different from the first luminance value; and control the projector to project the modified projection image.

    INTEGRATED CIRCUIT DEVICES
    5.
    发明申请

    公开(公告)号:US20250038110A1

    公开(公告)日:2025-01-30

    申请号:US18663344

    申请日:2024-05-14

    Abstract: An integrated circuit device includes a substrate having a front side and a back side opposite to the front side and including a fin-type active region in the front side and a substrate recess in the back side, an isolation film in the substrate defining the fin-type active region, a source/drain region on the fin-type active region, a contact plug above the substrate, a backside power rail at least partially filling the substrate recess, and a via power rail electrically connected to the contact plug, the via power rail extending into the isolation film and connected to the backside power rail. A side surface of the backside power rail and a side surface of the via power rail form an obtuse angle at a portion where the backside power rail is connected to the via power rail.

    Electronic device including flexible display

    公开(公告)号:US12082357B2

    公开(公告)日:2024-09-03

    申请号:US17855115

    申请日:2022-06-30

    CPC classification number: H05K5/0217 H01B1/02 H05K5/0017

    Abstract: An electronic device includes: a flexible display that is configured to be deformable to a first state, in which an exposed amount of a display area of the flexible display has a first size, and a second state, in which the exposed amount of the display area is expanded in a first direction; a deformable member including a liquid-state electrode, the deformable member configured to deform in a length direction based on the flexible display transitioning between the first state and the second state; a deformation sensing circuit configured to sense a resistance component of the liquid-state electrode, the resistance component corresponding to an exposure degree of the display area; a connector member electrically connecting the deformable member and the deformation sensing circuit; a rigid member coupled to the deformable member; and a fixed structure contacting a partial area of the rigid member.

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