公开(公告)号：US20190237390A1

公开(公告)日：2019-08-01

申请号：US16263408

申请日：2019-01-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soojung RHO ,  Chisung OH ,  Kyomin SOHN ,  Yong-Ki KIM ,  Jong-Ho MOON ,  SeungHan WOO ,  Jaeyoun YOUN

IPC: H01L23/48 ,  H01L23/522 ,  H01L23/528 ,  H01L23/538

Abstract: A semiconductor device includes first to M-th semiconductor dies stacked in a first direction. Each of the first to M-th semiconductor dies includes a substrate, first to K-th through silicon vias passing through the substrate in the first direction, and a first circuit to receive power through a power supply line electrically connected to the first through silicon via. Each of first to K-th through silicon vias of the N-th semiconductor die is electrically connected to a through silicon via of first to K-th through silicon vias of the (N+1)-th semiconductor die that is spaced apart therefrom in a plan view.

公开(公告)号：US20150311059A1

公开(公告)日：2015-10-29

申请号：US14656645

申请日：2015-03-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-Ki KIM ,  Joo-Hoon CHOI

IPC: H01L21/02 ,  B01D53/26

CPC classification number: B01D53/261 ,  H01L21/67034 ,  H01L21/6838

Abstract: Provided is a vacuum adsorption apparatus and a method of adsorbing a semiconductor package in a vacuum state. The vacuum adsorption apparatus includes a housing having an opening formed on its top surface, a vacuum adsorption unit disposed in the housing, and a stage formed on the opening formed in the housing and including a plurality of holes. A pressure generated from the vacuum adsorption unit is applied to the top surface of the stage through the opening and the plurality of holes.

Abstract translation: 提供一种真空吸附装置和在真空状态下吸附半导体封装的方法。 真空吸附装置包括：壳体，其顶面上形成有开口，设置在壳体中的真空吸附单元，以及形成在壳体中形成的开口并包括多个孔的台。 从真空吸附单元产生的压力通过开口和多个孔施加到载物台的顶表面。