公开(公告)号：US20230142196A1

公开(公告)日：2023-05-11

申请号：US17844802

申请日：2022-06-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： YONGJIN SEOL ,  SEONHYANG YOU ,  WONJAE LEE ,  WOOIK JANG

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/31 ,  H01L23/29

CPC classification number: H01L23/66 ,  H01L23/49827 ,  H01L23/3107 ,  H01L23/29

Abstract: A semiconductor package includes a package substrate, a semiconductor chip on the package substrate, a mold layer on the package substrate to cover the semiconductor chip, the mold layer having a first side surface and a first trench disposed at the first side surface, and the first trench extending from a top surface of the mold layer toward a bottom surface of the mold layer, an antenna pattern on the mold layer, and a first connection terminal filling the first trench. The antenna pattern is electrically connected to the package substrate through the first connection terminal.