公开(公告)号：US20160051197A1

公开(公告)日：2016-02-25

申请号：US14703833

申请日：2015-05-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mitsuo UMEMOTO ,  Yung-Cheol KONG ,  Woon-Bae KIM ,  Pyoung-Wan KIM ,  Kyong-Soon CHO

IPC: A61B5/00 ,  A61B5/145 ,  A61B5/0215

CPC classification number: A61B5/6861 ,  A61B5/0031 ,  A61B5/0215 ,  A61B5/14503 ,  A61B5/14532 ,  A61B2562/162 ,  A61B2562/166

Abstract: Provided is a body-implantable package for processing biosensed-data for wireless communication to an external device. The package includes a tube closed by a cover, therein, a chip with a strained layer affixed thereto to form a flexible laminar circuit. The cover is fitted over an open end of the tube after the laminated chip and strained layer are inserted therein. The chip is constructed of and rolled in one or more turns into a generally cylindrical shape. The strained layer is affixed to a surface of the chip automatically to cause the flexible laminar circuit to curl into a generally cylindrical shape to fit within the tube.

Abstract translation: 提供了一种用于处理用于到外部设备的无线通信的生物许可数据的体内植入式包装。 该封装包括一个由盖子封闭的管，其中具有固定到其上的应变层的芯片形成柔性层流电路。 在层压芯片和应变层插入其中之后，将盖安装在管的开口端上。 芯片由一个或多个匝构成并卷成大致圆柱形。 应变层自动固定在芯片的表面上，使得柔性层流电路卷曲成大致圆柱形，以装配在管内。

公开(公告)号：US20210398870A1

公开(公告)日：2021-12-23

申请号：US17462269

申请日：2021-08-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung-Tae HWANG ,  Jae-Choon KIM ,  Kyung-Suk OH ,  Woon-Bae KIM ,  Jae-Min JUNG

IPC: H01L23/31 ,  H01L23/498 ,  H05K1/14

Abstract: A chip on film package includes: a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.