公开(公告)号：US20140104452A1

公开(公告)日：2014-04-17

申请号：US13828591

申请日：2013-03-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae Chan KIM ,  Min Ho KIM ,  Dong Ki MIN ,  Sang Chul SUL ,  Tae Seok OH ,  Kwang Hyun LEE ,  Tae Yon LEE ,  Jae Jin JUNG ,  Young Gu JIN

IPC: H01L31/02 ,  H01L27/146 ,  H04N5/232

CPC classification number: H01L31/02016 ,  H01L27/14609 ,  H04N5/23229 ,  H04N5/378

Abstract: A sub pixel includes a photodetector and a column line output circuit. The photodetector is configured to output an electrical signal based on a detected amount of photons. The column line output circuit is configured to generate an output signal based on the electrical signal. The output signal is one of a current from a current source and a comparison signal indicative of binary output data.

Abstract translation: 子像素包括光电检测器和列线输出电路。 光电检测器被配置为基于检测到的光子量输出电信号。 列线输出电路被配置为基于电信号产生输出信号。 输出信号是来自电流源的电流和表示二进制输出数据的比较信号之一。

公开(公告)号：US20140104473A1

公开(公告)日：2014-04-17

申请号：US14051993

申请日：2013-10-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae Chan KIM ,  Min Ho KIM ,  Dong Ki MIN ,  Sang Chul SUL ,  Tae Seok OH ,  Kwang Hyun LEE ,  Tae Yon LEE ,  Jung Hoon JUNG ,  Young Gu JIN

IPC: H04N5/374

CPC classification number: H04N5/374 ,  H01L27/14627 ,  H01L27/14634

Abstract: An image sensor chip includes a first wafer and a second wafer. The first wafer includes an image sensor having a plurality of sub-pixels, each of which is configured to detect at least one photon and output a sub-pixel signal according to a result of the detection. The image processor is configured to process sub-pixel signals for each sub-pixel and generate image data. The first wafer and the second wafer are formed in a wafer stack structure.

Abstract translation: 图像传感器芯片包括第一晶片和第二晶片。 第一晶片包括具有多个子像素的图像传感器，每个子像素被配置为检测至少一个光子并根据检测结果输出子像素信号。 图像处理器被配置为处理每个子像素的子像素信号并生成图像数据。 第一晶片和第二晶片形成为晶片堆叠结构。