公开(公告)号：US20250054878A1

公开(公告)日：2025-02-13

申请号：US18632437

申请日：2024-04-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sujie Kang ,  Minsoo Han ,  Minwoo Rhee ,  Kyoungwhan Oh ,  Kyeongbin Lim

IPC: H01L23/00 ,  H01L21/66

Abstract: A warpage control method includes measuring displacement in a vertical direction perpendicular to a front surface of a wafer and dividing the front surface of the wafer into a first stress region with a negative displacement value and a second stress region with a positive displacement value, to thereby derive a warpage model, defining a portion of a region, overlapping the first stress region, on the front surface of the wafer as a first compensation region based on the warpage model and defining a region, other than the first compensation region, on the front surface of the wafer as a second compensation region based on the warpage model, to thereby derive a stress compensation film pattern model, and forming a mask pattern in a region on a back surface of the wafer.

公开(公告)号：US20250070079A1

公开(公告)日：2025-02-27

申请号：US18622040

申请日：2024-03-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： YongChul SHIN ,  Minwoo Rhee ,  Sujie Kang ,  Sun-woo Park ,  Nungpyo Hong ,  Kyeongbin Lim

IPC: H01L23/00 ,  B32B43/00 ,  H01L21/78

Abstract: A semiconductor package manufacturing method includes: bonding a carrier to a wafer; dicing the wafer together with the carrier which is bonded to the wafer into a plurality of die-carrier assemblies, each of the plurality of die-carrier assemblies including a die and a carrier piece bonded to the die; disposing the plurality of die-carrier assemblies on a target substrate; and separating the carrier pieces from the plurality of die-carrier assemblies by irradiating the plurality of die-carrier assemblies with light.

公开(公告)号：US20240367376A1

公开(公告)日：2024-11-07

申请号：US18772836

申请日：2024-07-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungwoo Cho ,  Minwoo Rhee ,  Hyunjin Lee ,  Seungdon Lee ,  Sujie Kang ,  Sunwoo Park ,  Kyoungwhan Oh ,  Jungshin Lee ,  Juhyung Lee

IPC: B29C64/277 ,  B29C64/112 ,  B29C64/209 ,  B29C64/245 ,  B33Y30/00

Abstract: A 3D printing apparatus includes a substrate stage configured to support a substrate, a droplet ejector including at least one droplet nozzle configured to discharge a photo-curable droplet on the substrate, a first photo curing unit configured to irradiate light to a drop path along which the droplet discharged from the droplet nozzle falls to change a viscosity of the droplet, and a second photo curing unit configured to irradiate light onto the droplet that has landed on the substrate to cure the droplet.

公开(公告)号：US12070903B2

公开(公告)日：2024-08-27

申请号：US17864738

申请日：2022-07-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungwoo Cho ,  Minwoo Rhee ,  Hyunjin Lee ,  Seungdon Lee ,  Sujie Kang ,  Sunwoo Park ,  Kyoungwhan Oh ,  Jungshin Lee ,  Juhyung Lee

IPC: B29C64/277 ,  B29C64/112 ,  B29C64/209 ,  B29C64/245 ,  B33Y30/00

CPC classification number: B29C64/277 ,  B29C64/209 ,  B29C64/245 ,  B33Y30/00 ,  B29C64/112

Abstract: A 3D printing apparatus includes a substrate stage configured to support a substrate, a droplet ejector including at least one droplet nozzle configured to discharge a photo-curable droplet on the substrate, a first photo curing unit configured to irradiate light to a drop path along which the droplet discharged from the droplet nozzle falls to change a viscosity of the droplet, and a second photo curing unit configured to irradiate light onto the droplet that has landed on the substrate to cure the droplet.

公开(公告)号：US20240186282A1

公开(公告)日：2024-06-06

申请号：US18239454

申请日：2023-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sumin Kim ,  Minwoo Rhee ,  Ilyoung Han ,  Sujie Kang ,  Juno Kim ,  Daeho Min ,  Kyeongbin Lim

IPC: H01L23/00

CPC classification number: H01L24/75 ,  H01L2224/75252 ,  H01L2224/75735 ,  H01L2224/75745 ,  H01L2224/75804 ,  H01L2224/75841 ,  H01L2924/2064

Abstract: A die bonding apparatus comprising a stage configured to support a first die, a pickup head configured to pick up a second die, regions of magnetic materials arranged on the first die and the second die, an electromagnet arranged on a surface of the pickup head or the stage; and a controller configured to apply a current to the electromagnet to generate a magnetic field when the first die and the second die are disposed at a predetermined distance from each other in a vertical direction. As a result of the magnetic field generated by the electromagnet, the regions of magnetic material arranged on first die and the second die are aligned with one another in the vertical direction.

公开(公告)号：US20230138834A1

公开(公告)日：2023-05-04

申请号：US17864738

申请日：2022-07-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungwoo Cho ,  Minwoo Rhee ,  Hyunjin Lee ,  Seungdon Lee ,  Sujie Kang ,  Sunwoo Park ,  Kyoungwhan Oh ,  Jungshin Lee ,  Juhyung Lee

IPC: B29C64/277 ,  B29C64/245 ,  B29C64/209 ,  B33Y30/00

Abstract: A 3D printing apparatus includes a substrate stage configured to support a substrate, a droplet ejector including at least one droplet nozzle configured to discharge a photo-curable droplet on the substrate, a first photo curing unit configured to irradiate light to a drop path along which the droplet discharged from the droplet nozzle falls to change a viscosity of the droplet, and a second photo curing unit configured to irradiate light onto the droplet that has landed on the substrate to cure the droplet.