Invention Application
- Patent Title: 3D PRINTING APPARATUS AND 3D PRINTING METHOD
-
Application No.: US17864738Application Date: 2022-07-14
-
Publication No.: US20230138834A1Publication Date: 2023-05-04
- Inventor: Jungwoo Cho , Minwoo Rhee , Hyunjin Lee , Seungdon Lee , Sujie Kang , Sunwoo Park , Kyoungwhan Oh , Jungshin Lee , Juhyung Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0149876 20211103
- Main IPC: B29C64/277
- IPC: B29C64/277 ; B29C64/245 ; B29C64/209 ; B33Y30/00

Abstract:
A 3D printing apparatus includes a substrate stage configured to support a substrate, a droplet ejector including at least one droplet nozzle configured to discharge a photo-curable droplet on the substrate, a first photo curing unit configured to irradiate light to a drop path along which the droplet discharged from the droplet nozzle falls to change a viscosity of the droplet, and a second photo curing unit configured to irradiate light onto the droplet that has landed on the substrate to cure the droplet.
Public/Granted literature
- US12070903B2 3D printing apparatus and 3D printing method Public/Granted day:2024-08-27
Information query
IPC分类: