公开(公告)号：US09899361B2

公开(公告)日：2018-02-20

申请号：US15254259

申请日：2016-09-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyoungjoon Kim ,  Kwangil Park ,  Seok-Hong Kwon ,  Chulsung Park ,  Eunsung Seo ,  Heejin Lee ,  Kijong Park

IPC: H01L23/02 ,  H01L25/18 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L25/18 ,  H01L24/17 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311

Abstract: A semiconductor package includes a logic chip mounted on a substrate, a first memory chip disposed on the logic chip, which includes a first active surface, and a second memory chip disposed on the first memory chip. The second memory chip is disposed on the first memory chip in such a way that the first memory chip and second memory chip are offset from each other. The second memory chip has a second active surface. The first active surface and the second active surface face each other and are electrically connected to each other through a first solder bump.