公开(公告)号：US11069588B2

公开(公告)日：2021-07-20

申请号：US16357732

申请日：2019-03-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-young Oh ,  Hyun-ki Kim ,  Sang-soo Kim ,  Seung-hwan Kim ,  Yong-kwan Lee

IPC: H01L23/29 ,  H01L21/56 ,  H01L23/31 ,  H01L23/528 ,  H01L23/00

Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.

公开(公告)号：US11699626B2

公开(公告)日：2023-07-11

申请号：US17355831

申请日：2021-06-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jun-young Oh ,  Hyun-ki Kim ,  Sang-soo Kim ,  Seung-hwan Kim ,  Yong-kwan Lee

IPC: H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/528 ,  H01L23/00

CPC classification number: H01L23/295 ,  H01L21/561 ,  H01L21/565 ,  H01L23/291 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/5283 ,  H01L24/09 ,  H01L24/17 ,  H01L24/97

Abstract: A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers.