公开(公告)号：US20250118720A1

公开(公告)日：2025-04-10

申请号：US18823660

申请日：2024-09-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin YANG ,  WooPoung KIM ,  Ramkumar SUBRAMANIAN ,  Sriram BALASUBRAMANIAN ,  Martin SCOTT

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538 ,  H01L25/00 ,  H10B80/00

Abstract: Disclosed herein are methods, systems and devices including a first layer, the first layer including a first compute device, a first multi-device package, and a second multi-device package. The first compute device may be between the first multi-device package and the second multi-device package. A second layer may include a first redistribution layer on a first side of the second layer facing the first layer, the first redistribution layer electrically connecting the first compute device to the first multi-device package and the first redistribution layer electrically connecting the first compute device to the second multi-device package. The first layer may include a third multi-device package and a fourth multi-device package, with the first compute device between the third multi-device package and the fourth multi-device package.

公开(公告)号：US20250118677A1

公开(公告)日：2025-04-10

申请号：US18791420

申请日：2024-07-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin YANG ,  WooPoung KIM ,  Ramkumar SUBRAMANIAN ,  Sriram BALASUBRAMANIAN ,  Martin Philip SCOTT

IPC: H01L23/538 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/48 ,  H01L25/065 ,  H01L25/18 ,  H10B80/00

Abstract: A method, system and devices are disclosed providing a first layer, the first layer including a first device region and a second device region, and a second layer including an interconnection die, the interconnection die including an interface logic. The first device region and the second device region are mounted on a first side of the interconnection die, and the first device region and the second device region are communicatively coupled to the interface logic.