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公开(公告)号：US12205931B2
公开(公告)日：2025-01-21
申请号：US18236246
申请日：2023-08-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyungwook Hwang , Junsik Hwang , Sungwoo Hwang
IPC: H01L25/075 , H01L23/00 , H01L33/00
Abstract: A method of transferring a micro light emitting diode (LED) to a pixel array panel includes transferring the micro LED by spraying using an inkjet method, wherein the micro LED comprises an active layer comprising a first portion emitting light in a first direction and a second portion emitting the light in a second direction different from the first direction.
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公开(公告)号：US12165571B2
公开(公告)日：2024-12-10
申请号：US18085162
申请日：2022-12-20
Inventor： Junsik Hwang , Geonwook Yoo , Hojin Lee , Yongchan Kim , Kyungwook Hwang
IPC: G09G3/32
Abstract: A driving circuit board includes a driving circuit board includes: a plurality of driving electrode regions on a surface of the driving circuit board; a plurality of driving electrodes symmetrically arranged on the plurality of driving electrode regions; and a driving circuit electrically connected to at least one of the plurality of driving electrodes, wherein the plurality of driving electrodes include at least one dummy electrode that is not connected to the driving circuit.
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公开(公告)号：US12080585B2
公开(公告)日：2024-09-03
申请号：US18312641
申请日：2023-05-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyungwook Hwang , Junsik Hwang
IPC: H01L21/683 , H01L25/075 , H01L33/50 , H01L33/52 , H01L33/62
CPC classification number: H01L21/6835 , H01L25/0753 , H01L33/50 , H01L33/52 , H01L33/62 , H01L2221/68309 , H01L2221/68313 , H01L2221/68354 , H01L2221/68368 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
Abstract: A wet alignment method for a micro-semiconductor chip and a display transfer structure are provided. The wet alignment method for a micro-semiconductor chip includes: supplying a liquid to a transfer substrate including a plurality of grooves; supplying the micro-semiconductor chip onto the transfer substrate; scanning the transfer substrate by using an absorber capable of absorbing the liquid. According to the wet alignment method, the micro-semiconductor chip may be transferred onto a large area.
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公开(公告)号：US11869880B2
公开(公告)日：2024-01-09
申请号：US17090077
申请日：2020-11-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyungwook Hwang , Junsik Hwang , Sungwoo Hwang
IPC: H01L25/075 , H01L23/00 , H01L33/00
CPC classification number: H01L25/0753 , H01L24/08 , H01L24/24 , H01L24/80 , H01L24/95 , H01L33/0095 , H01L24/82 , H01L2224/08225 , H01L2224/16225 , H01L2224/245 , H01L2224/24137 , H01L2224/8014 , H01L2224/80986 , H01L2224/9512 , H01L2224/95102 , H01L2224/95136 , H01L2924/10156 , H01L2924/12041 , H01L2933/0041 , H01L2224/245 , H01L2924/0549 , H01L2924/0543 , H01L2924/01049 , H01L2924/0544 , H01L2924/0105 , H01L2924/00014
Abstract: A method of transferring a micro light emitting diode (LED) to a pixel array panel includes transferring the micro LED by spraying using an inkjet method, wherein the micro LED includes an active layer including a first portion emitting light in a first direction and a second portion emitting the light in a second direction different from the first direction.
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公开(公告)号：US20230402435A1
公开(公告)日：2023-12-14
申请号：US18234798
申请日：2023-08-16
Applicant: Samsung Electronics Co., Ltd
Inventor： Seogwoo HONG , Junsik Hwang , Kyungwook Hwang
IPC: H01L25/075 , H01L27/12 , H01L33/50 , H01L33/62
CPC classification number: H01L25/0753 , H01L27/1214 , H01L33/50 , H01L33/62 , H01L2933/0066
Abstract: The present disclosure provides a micro-light-emitting diode display apparatus and a method of manufacturing the same. Provided is a micro-light-emitting diode (LED) display apparatus including a plurality of pixels, the micro-LED display apparatus including a driving circuit substrate, a first electrode provided on the driving circuit substrate, one or more microlight-emitting diodes (LEDs) provided on the first electrode, an insulating layer provided on the one or more micro-LEDs, a via pattern provided in the insulating layer, electrical contacts provided in the via pattern, and a second electrode provided on the electrical contacts, wherein the via pattern exposes a portion of the one or more micro-LEDs.
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Patent Agency Ranking
公开(公告)号：US11626530B2
公开(公告)日：2023-04-11
申请号：US17171636
申请日：2021-02-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seogwoo Hong , Junsik Hwang , Hyunjoon Kim , Joonyong Park , Kyungwook Hwang
IPC: H01L33/00 , H01L25/075
Abstract: A method of transferring micro-light emitting diodes is provided. The method includes preparing a transfer substrate including a first groove, a second groove, and a third groove; forming a first transfer prevention film on the second groove and forming a second transfer prevention film on the third groove; transferring, into the first groove, a first micro-light emitting diode configured to emit a first color light; removing the first transfer prevention film formed on the second groove; transferring, into the second groove, a second micro-light emitting diode configured to emit a second color light; removing the second transfer prevention film formed on the third groove; and transferring, into the third groove, a third micro-light emitting diode configured to emit a third color light.
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公开(公告)号：US11450710B2
公开(公告)日：2022-09-20
申请号：US17191619
申请日：2021-03-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyungwook Hwang , Hoyoung Ahn , Junhee Choi , Kiho Kong , Joohun Han
Abstract: A display device includes a substrate, an emissive layer; a plurality of color converting layers that share the emissive layer, a barrier arranged on the emissive layer between the plurality of color converting layers, a first insulating layer provided between the plurality of color converting layers and the emissive layer and a second insulating layer provided between the first insulating layer and the plurality of color converting layers. The barrier spatially separates the plurality of color converting layers from each other and the first insulating layer has a plurality of first openings respectively corresponding to the plurality of color converting layers.
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公开(公告)号：US11450650B2
公开(公告)日：2022-09-20
申请号：US16593635
申请日：2019-10-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hoyoung Ahn , Junhee Choi , Kyungwook Hwang , Jinjoo Park
Abstract: A display device includes a substrate, an emission layer provided on the substrate and a reflective layer provided on the emission layer. The emission layer has an emission region that emits light, the reflective layer has a first opening, the emission region overlaps the first opening in a direction perpendicular to an upper surface of the substrate and a first width of the emission region is smaller than a second width of the first opening.
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公开(公告)号：US20220173275A1
公开(公告)日：2022-06-02
申请号：US17531210
申请日：2021-11-19
Inventor： Kyungwook Hwang , Ho Won Jang , Junsik Hwang
Abstract: An LED device includes a light emission layer including a first semiconductor layer including a first surface and a second surface facing the first surface, the second surface having an area larger than an area of the first surface, an active layer on the first surface, and a second semiconductor layer on the active layer, an insulating layer on the first surface, the insulating layer defining an open region of the first semiconductor layer, a first electrode that contacts the first semiconductor layer via the open region, and a second electrode on the second semiconductor layer and contacting the second semiconductor layer.
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10.发明授权公开(公告)号：US11329187B2
公开(公告)日：2022-05-10
申请号：US16883363
申请日：2020-05-26
Inventor： Kyungwook Hwang , Jungel Ryu , Sungjin Kang , Jongmyeong Kim , Jehong Oh , Euijoon Yoon , Seungmin Lee , Junsik Hwang
Abstract: A method of aligning micro LEDs and a method of manufacturing a micro LED display using the same are provided. The method of aligning micro LEDs includes providing micro LEDs, each having a first surface that has a first maximum width and a second surface opposite to the first surface and has a second maximum width that is greater than the first maximum width, providing a transfer substrate including a transfer mold that has an array of openings, each of the openings being configured to accommodate the first surface of a corresponding micro LED and not accommodate the second surface of the corresponding micro LED and aligning the micro LEDs in one direction in the openings of the transfer mold by inserting the micro LEDs into the openings of the transfer mold so that the first surface of each of the micro LEDs is positioned within a corresponding opening.
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