公开(公告)号：US20230213554A1

公开(公告)日：2023-07-06

申请号：US17884661

申请日：2022-08-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwangkyu BANG ,  Kiljoong YUN ,  Yun CHANG ,  Jaegyu CHOI

IPC: G01R1/04 ,  G01R31/28

CPC classification number: G01R1/0466 ,  G01R1/0483 ,  G01R31/2863 ,  G01R31/2884

Abstract: A module substrate for a semiconductor module includes: a wiring substrate having an upper surface and a lower surface opposite to the upper surface, wherein the wiring substrate includes a circuit wiring and a plurality of via holes extending from the upper surface to the lower surface in a thickness direction; a plurality of test terminals respectively provided on the via holes and electrically connected to the circuit wiring, and a fastening thin film provided on the wiring substrate and covering the via holes, wherein the fastening thin film has a predetermined thickness such that a portion of the fastening thin film is penetrated when an interface is pin is inserted into the portion of the fastening thin film through the via hole from the upper surface, and the portion of the penetrated fastening thin film holds the penetrating interface inspection pin.

公开(公告)号：US20220418097A1

公开(公告)日：2022-12-29

申请号：US17898907

申请日：2022-08-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunki YUN ,  Kwangkyu BANG ,  Jihong KIM ,  Eunji YU ,  Kyungjae KIM ,  Yusuf CINAR

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

Abstract: A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.

公开(公告)号：US20220124904A1

公开(公告)日：2022-04-21

申请号：US17358800

申请日：2021-06-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunki YUN ,  Kwangkyu BANG ,  Jihong KIM ,  Eunji YU ,  Kyungjae KIM ,  Yusuf CINAR

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/11

Abstract: A module substrate for a semiconductor module including a wiring substrate having an upper surface and a lower surface opposite to each other and including a wiring formed therein, the wiring substrate having at least one through groove in at least one sidewall and extending in a thickness direction, and a through-groove test terminal including at least one contact pad, a surface of the contact pad being exposed from an inner wall of the through-groove, the contact pad being spaced apart from a vertical plane extending from the sidewall of the wiring substrate may be provided.

公开(公告)号：US20250029637A1

公开(公告)日：2025-01-23

申请号：US18738658

申请日：2024-06-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanggeun YOO ,  Kwangkyu BANG

IPC: G11B33/12 ,  H01R13/58

Abstract: A multi connector grip includes a first surface including a first cable connector groove configured to accommodate a first cable connector, the first cable connector groove having a first cable connector groove depth and the first cable connector having a first depth; and a second surface opposite to the first surface and including a second cable connector groove configured to accommodate a second cable connector, the second cable connector groove having a second cable connector groove depth and the second cable connector having a second depth, wherein a difference between the first cable connector groove depth and the second cable connector groove depth is equal to a difference between the first depth and the second depth.

公开(公告)号：US20170052551A1

公开(公告)日：2017-02-23

申请号：US15098427

申请日：2016-04-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwangkyu BANG ,  Heeyoub KANG ,  HyoJae BANG ,  Kitaek LEE

IPC: G05D23/19 ,  G05B15/02 ,  G06F3/06

CPC classification number: G05B15/02 ,  G06F1/206 ,  G06F3/0616 ,  G06F3/0659 ,  G06F3/0673

Abstract: A storage device may include a nonvolatile memory including a plurality of memory blocks and a memory controller configured to determine a comparison between an idle current value of the nonvolatile memory and a reference current value and to adjust, based on the comparison, a start temperature at which the storage device begins operating speed control of the storage device.

Abstract translation: 存储装置可以包括包括多个存储器块的非易失性存储器和被配置为确定非易失性存储器的空闲电流值与参考电流值之间的比较的存储器控​​制器，并且基于比较来调整开关温度 存储设备开始对存储设备进行速度控制。