公开(公告)号：US20250138048A1

公开(公告)日：2025-05-01

申请号：US18916304

申请日：2024-10-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Insang SONG ,  Kihyun KWON ,  Gunwoo RYU ,  Jaehyun BYUN ,  Kyoungsoo SON

IPC: G01R1/04 ,  G01R31/28

Abstract: Provided is a test module for testing the performance of an image sensor, the test module including a test board having an area greater than an area of the image sensor and configured to be coupled to the image sensor, and a connector electrically connected to the image sensor and configured to transmit an electrical signal received from the image sensor to a test socket, wherein the test board includes a dummy region of which an outer perimeter corresponds to a perimeter of the test board and configured to be electrically cut off from the image sensor, and a cut-off region formed corresponding to an inner perimeter of the dummy region, located between the dummy region and the image sensor, and configured to electrically cut off the dummy region from the image sensor.

公开(公告)号：US20210120160A1

公开(公告)日：2021-04-22

申请号：US16914389

申请日：2020-06-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kihyun KWON ,  Gunwoo RYU ,  Euncheol LEE

IPC: H04N5/232 ,  H04N5/225 ,  H04N1/00

Abstract: A semiconductor memory device includes a pixel array having pixels, a logic circuit configured to process a signal output by the pixels to generate image data, and sensor pads connected to the logic circuit, where the sensor pads include a first ground sensor pad, a second ground sensor pad, signal sensor pads disposed between the first ground sensor pad and the second ground sensor pad and configured to output the image data, and dummy sensor pads disposed between the first ground sensor pad and the second ground sensor pad and configured not to output the image data, and at least one of the dummy sensor pads is disposed between the signal sensor pads.

公开(公告)号：US20220132011A1

公开(公告)日：2022-04-28

申请号：US17570500

申请日：2022-01-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunsu JUN ,  Kihyun KWON ,  Seunghak LEE

IPC: H04N5/225

Abstract: A camera module is provided. The camera module includes a substrate; a first camera disposed on the substrate and configured to generate a first image based on a first optical signal; a second camera disposed on the substrate and configured to generate a second image based on a second optical signal; a power management integrated circuit disposed on the substrate and configured to generate a plurality of voltages based on an external power voltage received from an external power supply and provide the plurality of voltages to the first camera and the second camera; a metal fixing member coupled to the first camera and the second camera; and a thermal interface material disposed between the power management integrated circuit and the metal fixing member along a direction perpendicular to an upper surface of the substrate.