公开(公告)号：US20210296153A1

公开(公告)日：2021-09-23

申请号：US17189392

申请日：2021-03-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kihong CHO ,  Kyuchul SHIM ,  Chungho CHO ,  Jiho UH ,  Jinseok LEE ,  Namki CHO

IPC: H01L21/683 ,  H01J37/32

Abstract: A substrate processing apparatus including an electrostatic chuck on which a substrate is mountable; a ring surrounding the electrostatic chuck, the ring including a first coupling groove; and a first floating electrode in the first coupling groove of the ring, the first floating electrode having a ring shape, wherein a top surface of the first floating electrode is exposed at the ring, and the first floating electrode has a tapered shape including an inclined surface that is inclined in a downward direction toward the electrostatic chuck.

公开(公告)号：US20130199726A1

公开(公告)日：2013-08-08

申请号：US13755533

申请日：2013-01-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hongjin KIM ,  Kyoungseob KIM ,  SungHo SHIN ,  Kuntack LEE ,  Kihong CHO

IPC: H01L21/465

CPC classification number: H01L21/30625 ,  B24C1/08 ,  H01L21/02021 ,  H01L21/02057 ,  H01L21/465 ,  H01L21/67219

Abstract: A substrate treating method may include jetting a fluid containing an abrasive onto a substrate, and polishing the substrate using the jetted fluid.

Abstract translation: 基板处理方法可以包括将含有研磨剂的流体喷射到基板上，并且使用喷射流体对基板进行抛光。