公开(公告)号：US20210375831A1

公开(公告)日：2021-12-02

申请号：US17399233

申请日：2021-08-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongho PARK ,  Kyungsuk OH ,  Hyunki KIM ,  Yongkwan LEE ,  Sangsoo KIM ,  Seungkon MOK ,  Junyoung OH ,  Changyoung YOO

IPC: H01L25/065 ,  H01L23/16 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

Abstract: A semiconductor package including a circuit substrate including a plurality of interconnections; a first chip on the circuit substrate; a second chip stacked on the first chip; a plurality of first pads on the circuit substrate, the plurality of first pads overlapping the first chip; a plurality of bumps between the circuit substrate and the first chip; a plurality of second pads on an edge portion of a first side of the circuit substrate, the plurality of second pads electrically connected to the second chip through a conductive wire; an underfill that fills a space between the circuit substrate and the first chip; and a first dam on the circuit substrate, the first dam overlapping the first chip. The first dam includes a conductive material and overlaps at least one of the plurality of interconnections.

公开(公告)号：US20210255246A1

公开(公告)日：2021-08-19

申请号：US16973117

申请日：2019-06-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongho HAN ,  Bookeun OH ,  Gilho KIM ,  Junyoung OH ,  Sungun WI ,  Jaeyeon LEE

IPC: G01R31/367 ,  G06N20/00 ,  G01R31/382 ,  G01R31/371

Abstract: An electronic device according to various embodiments of the present invention includes: a memory which stores one or more mapping parameters that indicate the correlation between a voltage change amount and the state of health (SOH) of the battery; and a processor, wherein the processor can be set to: detect that an external device for charging the battery is connected to the electronic device; charge the battery by using a charging current supplied from the external device; decide on at least one mapping parameter among the one or more mapping parameters on the basis of at least the charging current; check the voltage change amount of the battery while the battery is being charged; and acquire the SOH of the battery at least partially on the basis of the at least one mapping parameter and the voltage change amount.

公开(公告)号：US20230282533A1

公开(公告)日：2023-09-07

申请号：US18315558

申请日：2023-05-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junyoung OH ,  Hyunggil BAEK ,  Seunghwan KIM ,  Jungjoo KIM ,  Jongho PARK ,  Yongkwan LEE

IPC: H01L23/16 ,  H01L25/065 ,  H01L23/498 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L23/16 ,  H01L25/0657 ,  H01L23/49811 ,  H01L23/3128 ,  H01L23/5389

Abstract: A semiconductor package is provided. The semiconductor package includes: a first package substrate; a first semiconductor chip on the first package substrate; an interposer substrate including a lower surface facing the first package substrate, an upper surface opposite to the lower surface, and an upper conductive pad in the upper surface of the interposer substrate; a first dam structure on the upper surface of the interposer substrate and extending along an edge of the upper conductive pad; a first molding layer in contact with the lower and upper surfaces of the interposer substrate and with an outer wall of the first dam structure; and a conductive connector in contact with an inner wall of the at least one first dam structure and with the upper conductive pad.

公开(公告)号：US20220093519A1

公开(公告)日：2022-03-24

申请号：US17306290

申请日：2021-05-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongho PARK ,  Seunghwan KIM ,  Junyoung OH ,  Yonghyun KIM ,  Yongkwan LEE ,  Junga LEE

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10 ,  H01L23/31

Abstract: A semiconductor package includes a first package substrate; a first semiconductor chip on the first package substrate; a first conductive connector on the first package substrate; and an interposer including a central portion on the first semiconductor chip and an outer portion having the first conductive connector attached thereto. The central portion of the interposer includes a bottom surface defining a recess from a bottom surface of the outer portion of the interposer in a vertical direction that is perpendicular to a top surface of the first package substrate. A thickness in the vertical direction of the outer portion of the interposer is greater than a thickness in the vertical direction of the central portion of the interposer.