公开(公告)号：US20140162053A1

公开(公告)日：2014-06-12

申请号：US13866389

申请日：2013-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeong-yub LEE ,  Xianyu WENXU ,  Jun-sik HWANG ,  Chang-youl MOON

IPC: B32B7/12 ,  B32B37/12 ,  B32B38/00

CPC classification number: B32B7/12 ,  B32B7/10 ,  B32B15/08 ,  B32B15/20 ,  B32B27/08 ,  B32B27/281 ,  B32B27/283 ,  B32B27/302 ,  B32B27/32 ,  B32B37/12 ,  B32B38/0008 ,  B32B38/162 ,  B32B2250/40 ,  B32B2457/14 ,  H01L21/187 ,  H01L21/306 ,  Y10T428/265 ,  Y10T428/31663

Abstract: A bonded substrate structure includes a siloxane-based monomer layer between a first substrate and a second substrate, the siloxane-based monomer layer bonding the first substrate and the second substrate. The first substrate and the second substrate may be one of a silicon substrate and a silicon oxide substrate, respectively.

Abstract translation: 键合衬底结构包括在第一衬底和第二衬底之间的硅氧烷基单体层，所述硅氧烷基单体层接合第一衬底和第二衬底。 第一基板和第二基板可以分别是硅基板和氧化硅基板之一。

公开(公告)号：US20140299231A1

公开(公告)日：2014-10-09

申请号：US14077846

申请日：2013-11-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kun-mo CHU ,  Chang-youl MOON ,  Sung-hee LEE ,  Jun-sik HWANG

IPC: B23K35/02

CPC classification number: B23K35/0222 ,  B23K35/0244

Abstract: A solder composite is provided. The solder composite may include: a metal-based solder matrix, a capsule dispersed in the solder matrix, and a self-healing material that is encapsulated in the capsule. The self-healing material may be configured to react with the solder matrix when in contact with the solder matrix such that at least one of an electrically conductive intermetallic compound and an electrically conductive alloy is formed.

Abstract translation: 提供焊料复合材料。 焊料复合材料可以包括：金属基焊料基质，分散在焊料基质中的胶囊，以及封装在胶囊中的自修复材料。 自修复材料可以被配置为当与焊料基质接触时与焊料基质反应，使得形成导电金属间化合物和导电合金中的至少一种。

公开(公告)号：US20140124818A1

公开(公告)日：2014-05-08

申请号：US13856716

申请日：2013-04-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun-sik HWANG ,  Jun-youn KIM ,  Su-hee CHAE

IPC: H01L33/12

CPC classification number: H01L33/0079 ,  H01L33/12

Abstract: A light emitting device (LED) includes a stress control layer having a compressive stress on a substrate, a bonding layer on the stress control layer, a semiconductor layer on the bonding layer and including an active region for emitting light on the bonding layer, a first electrode on a lower surface of the substrate, and a second electrode on the semiconductor layer. The compressive stress of the stress control layer is between about 1 and about 20 GPa.

Abstract translation: 发光器件（LED）包括在基板上具有压应力的应力控制层，应力控制层上的接合层，接合层上的半导体层，并且包括用于在接合层上发光的有源区， 在基板的下表面上的第一电极和在半导体层上的第二电极。 应力控制层的压缩应力在约1和约20GPa之间。