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公开(公告)号：US09680853B2
公开(公告)日：2017-06-13
申请号：US14752223
申请日：2015-06-26
Applicant: Samsung Electronics Co., Ltd
Inventor： Jewon Lee , Youngkyoo Kim
CPC classification number: H04L63/1425 , G06F8/61 , G06F11/07 , G06F21/563 , H04W4/60
Abstract: A method for preventing a malicious code in an electronic device according to various embodiments of the present disclosure includes: converting a suspicious operation code to a logging operation code, executing the converted logging operation code, and displaying predictive operation information to a display unit related to the logging operation code according to the result of execution.
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Patent Agency Ranking
公开(公告)号：US11443965B2
公开(公告)日：2022-09-13
申请号：US16747783
申请日：2020-01-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyeongbin Lim , Hyeonjun Yun , Gwanghee Jo , Jewon Lee , Minsoo Han , Junhyung Kim , Seungdae Seok
IPC: H01L21/67 , H01L21/683 , H01L23/00 , H01L21/20
Abstract: A wafer bonding apparatus includes lower and upper stages, lower and upper push rods, a position detection sensor, and processing circuitry. The stages may vacuum suction respective wafers on respective surfaces of the stages based on a vacuum pressure being supplied to respective suction holes in the respective surfaces from a vacuum pump. The push rods are movable through respective center holes in the stages to apply pressure to respective middle regions of the respective wafers. The position detection sensor may generate information indicating a bonding propagation position of the wafers based on detecting at least one wafer through a detection hole in at least one stage. The processing circuitry may process the information to detect the bonding propagation position and cause a change of at least one of a ratio of protruding lengths of the push rods, or a ratio of suction areas of the stages.
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公开(公告)号：US20210005475A1
公开(公告)日：2021-01-07
申请号：US16747783
申请日：2020-01-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyeongbin LIM , Hyeonjun Yun , Gwanghee Jo , Jewon Lee , Minsoo Han , Junhyung Kim , Seungdae Seok
IPC: H01L21/67 , H01L21/683 , H01L21/20 , H01L23/00
Abstract: In a wafer to wafer bonding method, a first wafer is vacuum suctions on a first surface of a lower stage and a second wafer is vacuum suctioned on a second surface of an upper stage. Pressure is applied to a middle portion of the first wafer by a lower push rod and pressure is applied to a middle portion of the second wafer by an upper push rod. Bonding of the first and second wafers propagates radially outwards. A bonding propagation position of the first and second wafers is detected. A ratio of protruding lengths of the lower push rod and the upper push rod is changed according to the bonding propagation position.
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公开(公告)号：US12058465B2
公开(公告)日：2024-08-06
申请号：US17970986
申请日：2022-10-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jinyoung Jeong , Jewon Lee , Seokyong Hong
IPC: H04N25/772 , H04N25/709
CPC classification number: H04N25/772 , H04N25/709
Abstract: An image sensor device includes a first image pixel connected to a first data line, a second image pixel connected to the first data line, an analog-to-digital converter that generates a digital signal based on a ramp signal and a voltage level of the first data line, and a clamp signal generator that generates a clamp signal depending on an analog gain of the analog-to-digital converter. While a data voltage is provided from the first image pixel to the first data line, the second image pixel provides a clamp voltage to the first data line based on the clamp signal.
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公开(公告)号：US12096148B2
公开(公告)日：2024-09-17
申请号：US17970986
申请日：2022-10-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jinyoung Jeong , Jewon Lee , Seokyong Hong
IPC: H04N25/772 , H04N25/709
CPC classification number: H04N25/772 , H04N25/709
Abstract: An image sensor device includes a first image pixel connected to a first data line, a second image pixel connected to the first data line, an analog-to-digital converter that generates a digital signal based on a ramp signal and a voltage level of the first data line, and a clamp signal generator that generates a clamp signal depending on an analog gain of the analog-to-digital converter. While a data voltage is provided from the first image pixel to the first data line, the second image pixel provides a clamp voltage to the first data line based on the clamp signal.
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6.发明申请公开(公告)号：US20150381644A1
公开(公告)日：2015-12-31
申请号：US14752223
申请日：2015-06-26
Applicant: Samsung Electronics Co., Ltd
Inventor： Jewon Lee , Youngkyoo Kim
CPC classification number: H04L63/1425 , G06F8/61 , G06F11/07 , G06F21/563 , H04W4/60
Abstract: A method for preventing a malicious code in an electronic device according to various embodiments of the present disclosure includes: converting a suspicious operation code to a logging operation code, executing the converted logging operation code, and displaying predictive operation information to a display unit related to the logging operation code according to the result of execution.
Abstract translation: 根据本公开的各种实施例的用于防止电子设备中的恶意代码的方法包括：将可疑操作代码转换为记录操作代码，执行转换的日志操作代码，并将显示预测操作信息显示到与 根据执行结果记录操作代码。
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