公开(公告)号：US20220094825A1

公开(公告)日：2022-03-24

申请号：US17388594

申请日：2021-07-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Insang SONG ,  Hyunjin KANG ,  Seunghak LEE

IPC: H04N5/225 ,  H01L27/146

Abstract: An image sensor device includes an image sensor, a substrate including first and second pads spaced apart from each other, a first support member on which an optical filter is mounted, a second support member further adjacent to an outer edge of the substrate than the first support member, and an optical device on the optical filter and the image sensor, wherein the image sensor is electrically connected to the first pad, and wherein at least one of the first or second support members is electrically connected to the second pad.

公开(公告)号：US20250138048A1

公开(公告)日：2025-05-01

申请号：US18916304

申请日：2024-10-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Insang SONG ,  Kihyun KWON ,  Gunwoo RYU ,  Jaehyun BYUN ,  Kyoungsoo SON

IPC: G01R1/04 ,  G01R31/28

Abstract: Provided is a test module for testing the performance of an image sensor, the test module including a test board having an area greater than an area of the image sensor and configured to be coupled to the image sensor, and a connector electrically connected to the image sensor and configured to transmit an electrical signal received from the image sensor to a test socket, wherein the test board includes a dummy region of which an outer perimeter corresponds to a perimeter of the test board and configured to be electrically cut off from the image sensor, and a cut-off region formed corresponding to an inner perimeter of the dummy region, located between the dummy region and the image sensor, and configured to electrically cut off the dummy region from the image sensor.