公开(公告)号：US20210104405A1

公开(公告)日：2021-04-08

申请号：US16842083

申请日：2020-04-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junhyung Kim ,  Kyeongbin Lim ,  Minsoo Han ,  Minwoo Rhee ,  Inbae Chang

IPC: H01L21/18 ,  B32B37/00 ,  B23K20/10 ,  H01L21/20 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

Abstract: A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck supporting the first substrate, a second bonding chuck disposed above the first bonding chuck and supporting the second substrate, a resonant frequency detector detecting a resonant frequency of a bonded structure with the first substrate and the second substrate which are at least partially bonded to each other, and a controller controlling a distance between the first bonding chuck and the second bonding chuck according to the detected resonant frequency of the bonded structure.

公开(公告)号：US11581188B2

公开(公告)日：2023-02-14

申请号：US16842083

申请日：2020-04-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junhyung Kim ,  Kyeongbin Lim ,  Minsoo Han ,  Minwoo Rhee ,  Inbae Chang

IPC: H01L21/18 ,  B32B37/00 ,  B23K20/10 ,  H01L21/20 ,  H01L21/683 ,  H01L21/687 ,  H01L21/67 ,  H05K13/08 ,  B32B41/00 ,  B32B37/10 ,  B32B38/18

Abstract: A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck supporting the first substrate, a second bonding chuck disposed above the first bonding chuck and supporting the second substrate, a resonant frequency detector detecting a resonant frequency of a bonded structure with the first substrate and the second substrate which are at least partially bonded to each other, and a controller controlling a distance between the first bonding chuck and the second bonding chuck according to the detected resonant frequency of the bonded structure.

公开(公告)号：US09690200B2

公开(公告)日：2017-06-27

申请号：US14867292

申请日：2015-09-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangjoon Hong ,  Jongjin Lee ,  Hikuk Lee ,  Sangdon Jang ,  Inbae Chang

IPC: G03B27/54 ,  G03F7/16 ,  G03F7/20

CPC classification number: G03F7/16 ,  G03F7/70383 ,  G03F7/70791 ,  G03F7/7085

Abstract: An optical apparatus and a manufacturing method using the optical apparatus are disclosed. The optical apparatus includes a stage supporting a substrate, first optical systems providing a first light onto the substrate, a gantry supporting the first optical systems to transfer them on the stage, and second optical systems disposed between the gantry and the stage and detecting displacement of the first optical systems. Each of the second optical systems includes a beam source generating a second light different with the first light, and sensor arrays for sensing the second light provided to the first optical systems to detect displacement of the first optical systems.