公开(公告)号：US20230047026A1

公开(公告)日：2023-02-16

申请号：US17867764

申请日：2022-07-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung Soo HA ,  Ju-Youn CHOI ,  In Won O ,  Jun Ho LEE

IPC: H01L23/498 ,  H01L25/16

Abstract: A semiconductor package includes: a first wiring structure including a first wiring layer, and a second wiring layer disposed on the first wiring layer, and connected to a first connecting structure placed disposed on the first wiring layer; a first semiconductor chip disposed on the first wiring structure and connected to the first wiring structure through a first connecting pad disposed on a first side of the first semiconductor chip; a second wiring structure disposed on the first semiconductor chip; and an insulating member disposed between the first and second wiring structures, wherein the first wiring structure further includes a first signal pattern that is electrically connected to the first connecting pad, and the first signal pattern redistributes the first connecting pad to the first connecting structure via the insulating member.

公开(公告)号：US11166368B2

公开(公告)日：2021-11-02

申请号：US16787712

申请日：2020-02-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung Ho Park ,  In Won O ,  Hak Jun Kim

IPC: H01L23/498 ,  H01L25/065 ,  H05K1/02 ,  H05K1/11

Abstract: A printed circuit board that includes a base layer having a first surface and a second surface opposing each other. A first structure is disposed on the first surface of the base layer. The first structure includes a first plate structure. A first connection structure is disposed on a same plane as the first plate structure and is spaced apart from the first plate structure. The first plate structure includes first openings. At least some of the first openings are linear openings having a line shape.

公开(公告)号：US20200260577A1

公开(公告)日：2020-08-13

申请号：US16787712

申请日：2020-02-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung Ho PARK ,  In Won O ,  Hak Jun KIM

IPC: H05K1/02 ,  H01L23/498 ,  H05K1/11

Abstract: A printed circuit board that includes a base layer having a first surface and a second surface opposing each other. A first structure is disposed on the first surface of the base layer. The first structure includes a first plate structure. A first connection structure is disposed on a same plane as the first plate structure and is spaced apart from the first plate structure. The first plate structure includes first openings. At least some of the first openings are linear openings having a line shape.